A microbeam RBS analysis of low temperature direct-write inkjet deposited copper
Quantitative microbeam Rutherford backscattering (RBS) analysis with a 1.5 MeV 4 He + beam has determined limits on the purity of copper deposited on glass with a novel inkjet process. A tetravinyl silane tetrakisCu(I) 1,1,1,5,5,5-hexafluoroacetylacetonate (TVST[Cu]hfac) complex was heated to 70 °C...
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| Veröffentlicht in: | Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms Beam interactions with materials and atoms, 2002-04, Vol.188 (1), p.141-145 |
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| container_title | Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms |
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| creator | Jeynes, C. Rozenberg, G.G. Speakman, S.P. Steinke, J.H.G. |
| description | Quantitative microbeam Rutherford backscattering (RBS) analysis with a 1.5 MeV
4
He
+ beam has determined limits on the purity of copper deposited on glass with a novel inkjet process. A tetravinyl silane tetrakisCu(I) 1,1,1,5,5,5-hexafluoroacetylacetonate (TVST[Cu]hfac) complex was heated to 70 °C and jetted onto the glass substrate through a piezoelectric ceramic print head in droplets about 0.5 mm diameter. The substrate temperature was 150 °C. Solid well-formed deposits resulted which have a copper content greater than about 90% by weight. The RBS spectra were analysed objectively using the DataFurnace code, with the assumption that the deposit was CuO
x
, and the validity of different assumed values of
x being tested. The assumptions and the errors of the analysis are critically evaluated. |
| doi_str_mv | 10.1016/S0168-583X(01)01063-1 |
| format | Article |
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4
He
+ beam has determined limits on the purity of copper deposited on glass with a novel inkjet process. A tetravinyl silane tetrakisCu(I) 1,1,1,5,5,5-hexafluoroacetylacetonate (TVST[Cu]hfac) complex was heated to 70 °C and jetted onto the glass substrate through a piezoelectric ceramic print head in droplets about 0.5 mm diameter. The substrate temperature was 150 °C. Solid well-formed deposits resulted which have a copper content greater than about 90% by weight. The RBS spectra were analysed objectively using the DataFurnace code, with the assumption that the deposit was CuO
x
, and the validity of different assumed values of
x being tested. The assumptions and the errors of the analysis are critically evaluated.</description><identifier>ISSN: 0168-583X</identifier><identifier>EISSN: 1872-9584</identifier><identifier>DOI: 10.1016/S0168-583X(01)01063-1</identifier><language>eng</language><publisher>Elsevier B.V</publisher><subject>CVD ; Electronics ; Markov chain Monte Carlo ; Organometallic ; PCB</subject><ispartof>Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms, 2002-04, Vol.188 (1), p.141-145</ispartof><rights>2002 Elsevier Science B.V.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c338t-4247f49178853eb08b1eb13e03ddef73b4dbebd3386115b9b83bc1d3e504f12b3</citedby><cites>FETCH-LOGICAL-c338t-4247f49178853eb08b1eb13e03ddef73b4dbebd3386115b9b83bc1d3e504f12b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/S0168-583X(01)01063-1$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids></links><search><creatorcontrib>Jeynes, C.</creatorcontrib><creatorcontrib>Rozenberg, G.G.</creatorcontrib><creatorcontrib>Speakman, S.P.</creatorcontrib><creatorcontrib>Steinke, J.H.G.</creatorcontrib><title>A microbeam RBS analysis of low temperature direct-write inkjet deposited copper</title><title>Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms</title><description>Quantitative microbeam Rutherford backscattering (RBS) analysis with a 1.5 MeV
4
He
+ beam has determined limits on the purity of copper deposited on glass with a novel inkjet process. A tetravinyl silane tetrakisCu(I) 1,1,1,5,5,5-hexafluoroacetylacetonate (TVST[Cu]hfac) complex was heated to 70 °C and jetted onto the glass substrate through a piezoelectric ceramic print head in droplets about 0.5 mm diameter. The substrate temperature was 150 °C. Solid well-formed deposits resulted which have a copper content greater than about 90% by weight. The RBS spectra were analysed objectively using the DataFurnace code, with the assumption that the deposit was CuO
x
, and the validity of different assumed values of
x being tested. The assumptions and the errors of the analysis are critically evaluated.</description><subject>CVD</subject><subject>Electronics</subject><subject>Markov chain Monte Carlo</subject><subject>Organometallic</subject><subject>PCB</subject><issn>0168-583X</issn><issn>1872-9584</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2002</creationdate><recordtype>article</recordtype><recordid>eNqFkE1LAzEQhoMoWKs_QchJ9LCa2Wy66Ulq8QsExSp4C5tkFlL3y2Rr6b837YpX5zDDwDMD70PIKbBLYDC5WsQmEyH5xzmDCwZswhPYIyOQeZpMhcz2yegPOSRHISxZLMHFiLzMaO2MbzUWNX29WdCiKapNcIG2Ja3aNe2x7tAX_cojtc6j6ZO1dz1S13wusacWuzbE3VLTdpE8JgdlUQU8-Z1j8n53-zZ_SJ6e7x_ns6fEcC77JEuzvMymkEspOGomNaAGjoxbi2XOdWY1ahvZCYDQUy25NmA5CpaVkGo-JmfD3863XysMvapdMFhVRYPtKqg0BzllEiIoBjCmDMFjqTrv6sJvFDC19ad2_tRWjmKgdv7U9u56uMOY4tuhV8E4bAwOFpRt3T8ffgDLyXhx</recordid><startdate>20020401</startdate><enddate>20020401</enddate><creator>Jeynes, C.</creator><creator>Rozenberg, G.G.</creator><creator>Speakman, S.P.</creator><creator>Steinke, J.H.G.</creator><general>Elsevier B.V</general><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>20020401</creationdate><title>A microbeam RBS analysis of low temperature direct-write inkjet deposited copper</title><author>Jeynes, C. ; Rozenberg, G.G. ; Speakman, S.P. ; Steinke, J.H.G.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c338t-4247f49178853eb08b1eb13e03ddef73b4dbebd3386115b9b83bc1d3e504f12b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2002</creationdate><topic>CVD</topic><topic>Electronics</topic><topic>Markov chain Monte Carlo</topic><topic>Organometallic</topic><topic>PCB</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Jeynes, C.</creatorcontrib><creatorcontrib>Rozenberg, G.G.</creatorcontrib><creatorcontrib>Speakman, S.P.</creatorcontrib><creatorcontrib>Steinke, J.H.G.</creatorcontrib><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Jeynes, C.</au><au>Rozenberg, G.G.</au><au>Speakman, S.P.</au><au>Steinke, J.H.G.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A microbeam RBS analysis of low temperature direct-write inkjet deposited copper</atitle><jtitle>Nuclear instruments & methods in physics research. Section B, Beam interactions with materials and atoms</jtitle><date>2002-04-01</date><risdate>2002</risdate><volume>188</volume><issue>1</issue><spage>141</spage><epage>145</epage><pages>141-145</pages><issn>0168-583X</issn><eissn>1872-9584</eissn><abstract>Quantitative microbeam Rutherford backscattering (RBS) analysis with a 1.5 MeV
4
He
+ beam has determined limits on the purity of copper deposited on glass with a novel inkjet process. A tetravinyl silane tetrakisCu(I) 1,1,1,5,5,5-hexafluoroacetylacetonate (TVST[Cu]hfac) complex was heated to 70 °C and jetted onto the glass substrate through a piezoelectric ceramic print head in droplets about 0.5 mm diameter. The substrate temperature was 150 °C. Solid well-formed deposits resulted which have a copper content greater than about 90% by weight. The RBS spectra were analysed objectively using the DataFurnace code, with the assumption that the deposit was CuO
x
, and the validity of different assumed values of
x being tested. The assumptions and the errors of the analysis are critically evaluated.</abstract><pub>Elsevier B.V</pub><doi>10.1016/S0168-583X(01)01063-1</doi><tpages>5</tpages></addata></record> |
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| subjects | CVD Electronics Markov chain Monte Carlo Organometallic PCB |
| title | A microbeam RBS analysis of low temperature direct-write inkjet deposited copper |
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