Shock consolidation: microstructurally-based analysis and computational modeling
The most important microstructural processes involved in shock consolidation are identified and discussed; the energy dissipated by a shock wave as it traverses a powder is assessed. The basic microstructural phenomena are illustrated for a metal (nickel-based superalloy), an intermetallic compound...
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Veröffentlicht in: | Acta Materialia 1999-05, Vol.47 (7), p.2089-2108 |
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description | The most important microstructural processes involved in shock consolidation are identified and discussed; the energy dissipated by a shock wave as it traverses a powder is assessed. The basic microstructural phenomena are illustrated for a metal (nickel-based superalloy), an intermetallic compound (rapidly solidified Ti
3Al), and ceramics (silicon carbide). Interparticle melting, vorticity, voids, and particle fracture are observed and the plastic deformation patterns are identified. Various energy dissipation processes are estimated: plastic deformation, interparticle friction, microkinetic energy, and defect generation. An analytical expression is developed for the energy requirement to shock consolidate a powder as a function of strength, size, porosity, and temperature, based on a prescribed interparticle melting layer. This formulation enables the prediction of pressures required to shock consolidate materials; results of calculations for the superalloy and silicon carbide as a function of particle size and porosity are represented. The fracture of ceramic particles under shock compression is discussed. Tensile stresses are generated during compaction that may lead to fracture. It is shown that the activation of flaws occurs at tensile reflected pulses that are a decreasing fraction of the compressive pulse, as the powder strength increases. These analytical results are compared to numerical solutions obtained by modeling the compaction of a discrete set of particles with an Eulerian finite element program. These results confirm the increasing difficulty encountered in shock consolidating harder materials, and point out three possible solutions: (a) reduction of initial particle size; (b) reduction of shock energy; (c) post-shock thermal treatment. Two possible and potentially fruitful approaches are to shock densify (collapse voids with minimum bonding) powders and to apply post-shock thermal treatments, and to shock consolidate nanosized powders. The latter method requires high shock energy and careful minimization of the shock reflections. |
doi_str_mv | 10.1016/S1359-6454(99)00083-X |
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fullrecord | <record><control><sourceid>proquest_osti_</sourceid><recordid>TN_cdi_proquest_miscellaneous_27155641</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S135964549900083X</els_id><sourcerecordid>27108553</sourcerecordid><originalsourceid>FETCH-LOGICAL-c490t-4c7b484a8b45e649c5ba078ffc7e1fc41a7f6ccc2b33b20fa4dc22a760a8f0573</originalsourceid><addsrcrecordid>eNqNkUtLxDAUhYso-PwJwggiuqgmTdK0bkQGXyAoqOAu3N4mGk2bMWmF-fe2M4pLXeUuvnNvzjlJskvJMSU0P3mgTJRpzgU_LMsjQkjB0ueVZIMWkqUZF2x1mH-Q9WQzxjdCaCY52UjuH149vk_Qt9E7W0NnfXs6aSwGH7vQY9cHcG6eVhB1PYEW3DzaOAz1oGlmfbdQgJs0vtbOti_byZoBF_XO97uVPF1ePE6v09u7q5vp-W2KvCRdylFWvOBQVFzonJcoKiCyMAalpgY5BWlyRMwqxqqMGOA1ZhnInEBhiJBsK9lb7h3-aVVE22l8HWy0GjvFhCyzkTlYMrPgP3odO9XYiNo5aLXvo8okFSLn9D8gKYRgAyiW4JhPDNqoWbANhLmiRI1lqEUZakxalaValKGeB93-9wGICM4EaNHGX3HBpKDj-rMlpofkPq0OozHdoq5tGH3V3v5x6AvdsZ_J</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>27108553</pqid></control><display><type>article</type><title>Shock consolidation: microstructurally-based analysis and computational modeling</title><source>Access via ScienceDirect (Elsevier)</source><creator>Meyers, M.A. ; Benson, D.J. ; Olevsky, E.A.</creator><creatorcontrib>Meyers, M.A. ; Benson, D.J. ; Olevsky, E.A.</creatorcontrib><description>The most important microstructural processes involved in shock consolidation are identified and discussed; the energy dissipated by a shock wave as it traverses a powder is assessed. The basic microstructural phenomena are illustrated for a metal (nickel-based superalloy), an intermetallic compound (rapidly solidified Ti
3Al), and ceramics (silicon carbide). Interparticle melting, vorticity, voids, and particle fracture are observed and the plastic deformation patterns are identified. Various energy dissipation processes are estimated: plastic deformation, interparticle friction, microkinetic energy, and defect generation. An analytical expression is developed for the energy requirement to shock consolidate a powder as a function of strength, size, porosity, and temperature, based on a prescribed interparticle melting layer. This formulation enables the prediction of pressures required to shock consolidate materials; results of calculations for the superalloy and silicon carbide as a function of particle size and porosity are represented. The fracture of ceramic particles under shock compression is discussed. Tensile stresses are generated during compaction that may lead to fracture. It is shown that the activation of flaws occurs at tensile reflected pulses that are a decreasing fraction of the compressive pulse, as the powder strength increases. These analytical results are compared to numerical solutions obtained by modeling the compaction of a discrete set of particles with an Eulerian finite element program. These results confirm the increasing difficulty encountered in shock consolidating harder materials, and point out three possible solutions: (a) reduction of initial particle size; (b) reduction of shock energy; (c) post-shock thermal treatment. Two possible and potentially fruitful approaches are to shock densify (collapse voids with minimum bonding) powders and to apply post-shock thermal treatments, and to shock consolidate nanosized powders. The latter method requires high shock energy and careful minimization of the shock reflections.</description><identifier>ISSN: 1359-6454</identifier><identifier>EISSN: 1873-2453</identifier><identifier>DOI: 10.1016/S1359-6454(99)00083-X</identifier><language>eng</language><publisher>Oxford: Elsevier Ltd</publisher><subject>Applied sciences ; COMPACTING ; Cross-disciplinary physics: materials science; rheology ; ENERGY LOSSES ; Exact sciences and technology ; FRACTURES ; MATERIALS ; MATERIALS SCIENCE ; Materials synthesis; materials processing ; MATHEMATICAL MODELS ; MELTING ; Metals. Metallurgy ; MICROSTRUCTURE ; Physics ; Powder processing: powder metallurgy, compaction, sintering, mechanical alloying, and granulation ; POWDERS ; SHOCK WAVES ; VOIDS</subject><ispartof>Acta Materialia, 1999-05, Vol.47 (7), p.2089-2108</ispartof><rights>1999 Acta Metallurgica Inc</rights><rights>1999 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c490t-4c7b484a8b45e649c5ba078ffc7e1fc41a7f6ccc2b33b20fa4dc22a760a8f0573</citedby><cites>FETCH-LOGICAL-c490t-4c7b484a8b45e649c5ba078ffc7e1fc41a7f6ccc2b33b20fa4dc22a760a8f0573</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/S1359-6454(99)00083-X$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,885,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=1837513$$DView record in Pascal Francis$$Hfree_for_read</backlink><backlink>$$Uhttps://www.osti.gov/biblio/357927$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Meyers, M.A.</creatorcontrib><creatorcontrib>Benson, D.J.</creatorcontrib><creatorcontrib>Olevsky, E.A.</creatorcontrib><title>Shock consolidation: microstructurally-based analysis and computational modeling</title><title>Acta Materialia</title><description>The most important microstructural processes involved in shock consolidation are identified and discussed; the energy dissipated by a shock wave as it traverses a powder is assessed. The basic microstructural phenomena are illustrated for a metal (nickel-based superalloy), an intermetallic compound (rapidly solidified Ti
3Al), and ceramics (silicon carbide). Interparticle melting, vorticity, voids, and particle fracture are observed and the plastic deformation patterns are identified. Various energy dissipation processes are estimated: plastic deformation, interparticle friction, microkinetic energy, and defect generation. An analytical expression is developed for the energy requirement to shock consolidate a powder as a function of strength, size, porosity, and temperature, based on a prescribed interparticle melting layer. This formulation enables the prediction of pressures required to shock consolidate materials; results of calculations for the superalloy and silicon carbide as a function of particle size and porosity are represented. The fracture of ceramic particles under shock compression is discussed. Tensile stresses are generated during compaction that may lead to fracture. It is shown that the activation of flaws occurs at tensile reflected pulses that are a decreasing fraction of the compressive pulse, as the powder strength increases. These analytical results are compared to numerical solutions obtained by modeling the compaction of a discrete set of particles with an Eulerian finite element program. These results confirm the increasing difficulty encountered in shock consolidating harder materials, and point out three possible solutions: (a) reduction of initial particle size; (b) reduction of shock energy; (c) post-shock thermal treatment. Two possible and potentially fruitful approaches are to shock densify (collapse voids with minimum bonding) powders and to apply post-shock thermal treatments, and to shock consolidate nanosized powders. The latter method requires high shock energy and careful minimization of the shock reflections.</description><subject>Applied sciences</subject><subject>COMPACTING</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>ENERGY LOSSES</subject><subject>Exact sciences and technology</subject><subject>FRACTURES</subject><subject>MATERIALS</subject><subject>MATERIALS SCIENCE</subject><subject>Materials synthesis; materials processing</subject><subject>MATHEMATICAL MODELS</subject><subject>MELTING</subject><subject>Metals. Metallurgy</subject><subject>MICROSTRUCTURE</subject><subject>Physics</subject><subject>Powder processing: powder metallurgy, compaction, sintering, mechanical alloying, and granulation</subject><subject>POWDERS</subject><subject>SHOCK WAVES</subject><subject>VOIDS</subject><issn>1359-6454</issn><issn>1873-2453</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><recordid>eNqNkUtLxDAUhYso-PwJwggiuqgmTdK0bkQGXyAoqOAu3N4mGk2bMWmF-fe2M4pLXeUuvnNvzjlJskvJMSU0P3mgTJRpzgU_LMsjQkjB0ueVZIMWkqUZF2x1mH-Q9WQzxjdCaCY52UjuH149vk_Qt9E7W0NnfXs6aSwGH7vQY9cHcG6eVhB1PYEW3DzaOAz1oGlmfbdQgJs0vtbOti_byZoBF_XO97uVPF1ePE6v09u7q5vp-W2KvCRdylFWvOBQVFzonJcoKiCyMAalpgY5BWlyRMwqxqqMGOA1ZhnInEBhiJBsK9lb7h3-aVVE22l8HWy0GjvFhCyzkTlYMrPgP3odO9XYiNo5aLXvo8okFSLn9D8gKYRgAyiW4JhPDNqoWbANhLmiRI1lqEUZakxalaValKGeB93-9wGICM4EaNHGX3HBpKDj-rMlpofkPq0OozHdoq5tGH3V3v5x6AvdsZ_J</recordid><startdate>19990528</startdate><enddate>19990528</enddate><creator>Meyers, M.A.</creator><creator>Benson, D.J.</creator><creator>Olevsky, E.A.</creator><general>Elsevier Ltd</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope><scope>8BQ</scope><scope>OTOTI</scope></search><sort><creationdate>19990528</creationdate><title>Shock consolidation: microstructurally-based analysis and computational modeling</title><author>Meyers, M.A. ; Benson, D.J. ; Olevsky, E.A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c490t-4c7b484a8b45e649c5ba078ffc7e1fc41a7f6ccc2b33b20fa4dc22a760a8f0573</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Applied sciences</topic><topic>COMPACTING</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>ENERGY LOSSES</topic><topic>Exact sciences and technology</topic><topic>FRACTURES</topic><topic>MATERIALS</topic><topic>MATERIALS SCIENCE</topic><topic>Materials synthesis; materials processing</topic><topic>MATHEMATICAL MODELS</topic><topic>MELTING</topic><topic>Metals. Metallurgy</topic><topic>MICROSTRUCTURE</topic><topic>Physics</topic><topic>Powder processing: powder metallurgy, compaction, sintering, mechanical alloying, and granulation</topic><topic>POWDERS</topic><topic>SHOCK WAVES</topic><topic>VOIDS</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Meyers, M.A.</creatorcontrib><creatorcontrib>Benson, D.J.</creatorcontrib><creatorcontrib>Olevsky, E.A.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>METADEX</collection><collection>OSTI.GOV</collection><jtitle>Acta Materialia</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Meyers, M.A.</au><au>Benson, D.J.</au><au>Olevsky, E.A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Shock consolidation: microstructurally-based analysis and computational modeling</atitle><jtitle>Acta Materialia</jtitle><date>1999-05-28</date><risdate>1999</risdate><volume>47</volume><issue>7</issue><spage>2089</spage><epage>2108</epage><pages>2089-2108</pages><issn>1359-6454</issn><eissn>1873-2453</eissn><abstract>The most important microstructural processes involved in shock consolidation are identified and discussed; the energy dissipated by a shock wave as it traverses a powder is assessed. The basic microstructural phenomena are illustrated for a metal (nickel-based superalloy), an intermetallic compound (rapidly solidified Ti
3Al), and ceramics (silicon carbide). Interparticle melting, vorticity, voids, and particle fracture are observed and the plastic deformation patterns are identified. Various energy dissipation processes are estimated: plastic deformation, interparticle friction, microkinetic energy, and defect generation. An analytical expression is developed for the energy requirement to shock consolidate a powder as a function of strength, size, porosity, and temperature, based on a prescribed interparticle melting layer. This formulation enables the prediction of pressures required to shock consolidate materials; results of calculations for the superalloy and silicon carbide as a function of particle size and porosity are represented. The fracture of ceramic particles under shock compression is discussed. Tensile stresses are generated during compaction that may lead to fracture. It is shown that the activation of flaws occurs at tensile reflected pulses that are a decreasing fraction of the compressive pulse, as the powder strength increases. These analytical results are compared to numerical solutions obtained by modeling the compaction of a discrete set of particles with an Eulerian finite element program. These results confirm the increasing difficulty encountered in shock consolidating harder materials, and point out three possible solutions: (a) reduction of initial particle size; (b) reduction of shock energy; (c) post-shock thermal treatment. Two possible and potentially fruitful approaches are to shock densify (collapse voids with minimum bonding) powders and to apply post-shock thermal treatments, and to shock consolidate nanosized powders. The latter method requires high shock energy and careful minimization of the shock reflections.</abstract><cop>Oxford</cop><pub>Elsevier Ltd</pub><doi>10.1016/S1359-6454(99)00083-X</doi><tpages>20</tpages></addata></record> |
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subjects | Applied sciences COMPACTING Cross-disciplinary physics: materials science rheology ENERGY LOSSES Exact sciences and technology FRACTURES MATERIALS MATERIALS SCIENCE Materials synthesis materials processing MATHEMATICAL MODELS MELTING Metals. Metallurgy MICROSTRUCTURE Physics Powder processing: powder metallurgy, compaction, sintering, mechanical alloying, and granulation POWDERS SHOCK WAVES VOIDS |
title | Shock consolidation: microstructurally-based analysis and computational modeling |
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