Shock consolidation: microstructurally-based analysis and computational modeling

The most important microstructural processes involved in shock consolidation are identified and discussed; the energy dissipated by a shock wave as it traverses a powder is assessed. The basic microstructural phenomena are illustrated for a metal (nickel-based superalloy), an intermetallic compound...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Acta Materialia 1999-05, Vol.47 (7), p.2089-2108
Hauptverfasser: Meyers, M.A., Benson, D.J., Olevsky, E.A.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 2108
container_issue 7
container_start_page 2089
container_title Acta Materialia
container_volume 47
creator Meyers, M.A.
Benson, D.J.
Olevsky, E.A.
description The most important microstructural processes involved in shock consolidation are identified and discussed; the energy dissipated by a shock wave as it traverses a powder is assessed. The basic microstructural phenomena are illustrated for a metal (nickel-based superalloy), an intermetallic compound (rapidly solidified Ti 3Al), and ceramics (silicon carbide). Interparticle melting, vorticity, voids, and particle fracture are observed and the plastic deformation patterns are identified. Various energy dissipation processes are estimated: plastic deformation, interparticle friction, microkinetic energy, and defect generation. An analytical expression is developed for the energy requirement to shock consolidate a powder as a function of strength, size, porosity, and temperature, based on a prescribed interparticle melting layer. This formulation enables the prediction of pressures required to shock consolidate materials; results of calculations for the superalloy and silicon carbide as a function of particle size and porosity are represented. The fracture of ceramic particles under shock compression is discussed. Tensile stresses are generated during compaction that may lead to fracture. It is shown that the activation of flaws occurs at tensile reflected pulses that are a decreasing fraction of the compressive pulse, as the powder strength increases. These analytical results are compared to numerical solutions obtained by modeling the compaction of a discrete set of particles with an Eulerian finite element program. These results confirm the increasing difficulty encountered in shock consolidating harder materials, and point out three possible solutions: (a) reduction of initial particle size; (b) reduction of shock energy; (c) post-shock thermal treatment. Two possible and potentially fruitful approaches are to shock densify (collapse voids with minimum bonding) powders and to apply post-shock thermal treatments, and to shock consolidate nanosized powders. The latter method requires high shock energy and careful minimization of the shock reflections.
doi_str_mv 10.1016/S1359-6454(99)00083-X
format Article
fullrecord <record><control><sourceid>proquest_osti_</sourceid><recordid>TN_cdi_proquest_miscellaneous_27155641</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S135964549900083X</els_id><sourcerecordid>27108553</sourcerecordid><originalsourceid>FETCH-LOGICAL-c490t-4c7b484a8b45e649c5ba078ffc7e1fc41a7f6ccc2b33b20fa4dc22a760a8f0573</originalsourceid><addsrcrecordid>eNqNkUtLxDAUhYso-PwJwggiuqgmTdK0bkQGXyAoqOAu3N4mGk2bMWmF-fe2M4pLXeUuvnNvzjlJskvJMSU0P3mgTJRpzgU_LMsjQkjB0ueVZIMWkqUZF2x1mH-Q9WQzxjdCaCY52UjuH149vk_Qt9E7W0NnfXs6aSwGH7vQY9cHcG6eVhB1PYEW3DzaOAz1oGlmfbdQgJs0vtbOti_byZoBF_XO97uVPF1ePE6v09u7q5vp-W2KvCRdylFWvOBQVFzonJcoKiCyMAalpgY5BWlyRMwqxqqMGOA1ZhnInEBhiJBsK9lb7h3-aVVE22l8HWy0GjvFhCyzkTlYMrPgP3odO9XYiNo5aLXvo8okFSLn9D8gKYRgAyiW4JhPDNqoWbANhLmiRI1lqEUZakxalaValKGeB93-9wGICM4EaNHGX3HBpKDj-rMlpofkPq0OozHdoq5tGH3V3v5x6AvdsZ_J</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>27108553</pqid></control><display><type>article</type><title>Shock consolidation: microstructurally-based analysis and computational modeling</title><source>Access via ScienceDirect (Elsevier)</source><creator>Meyers, M.A. ; Benson, D.J. ; Olevsky, E.A.</creator><creatorcontrib>Meyers, M.A. ; Benson, D.J. ; Olevsky, E.A.</creatorcontrib><description>The most important microstructural processes involved in shock consolidation are identified and discussed; the energy dissipated by a shock wave as it traverses a powder is assessed. The basic microstructural phenomena are illustrated for a metal (nickel-based superalloy), an intermetallic compound (rapidly solidified Ti 3Al), and ceramics (silicon carbide). Interparticle melting, vorticity, voids, and particle fracture are observed and the plastic deformation patterns are identified. Various energy dissipation processes are estimated: plastic deformation, interparticle friction, microkinetic energy, and defect generation. An analytical expression is developed for the energy requirement to shock consolidate a powder as a function of strength, size, porosity, and temperature, based on a prescribed interparticle melting layer. This formulation enables the prediction of pressures required to shock consolidate materials; results of calculations for the superalloy and silicon carbide as a function of particle size and porosity are represented. The fracture of ceramic particles under shock compression is discussed. Tensile stresses are generated during compaction that may lead to fracture. It is shown that the activation of flaws occurs at tensile reflected pulses that are a decreasing fraction of the compressive pulse, as the powder strength increases. These analytical results are compared to numerical solutions obtained by modeling the compaction of a discrete set of particles with an Eulerian finite element program. These results confirm the increasing difficulty encountered in shock consolidating harder materials, and point out three possible solutions: (a) reduction of initial particle size; (b) reduction of shock energy; (c) post-shock thermal treatment. Two possible and potentially fruitful approaches are to shock densify (collapse voids with minimum bonding) powders and to apply post-shock thermal treatments, and to shock consolidate nanosized powders. The latter method requires high shock energy and careful minimization of the shock reflections.</description><identifier>ISSN: 1359-6454</identifier><identifier>EISSN: 1873-2453</identifier><identifier>DOI: 10.1016/S1359-6454(99)00083-X</identifier><language>eng</language><publisher>Oxford: Elsevier Ltd</publisher><subject>Applied sciences ; COMPACTING ; Cross-disciplinary physics: materials science; rheology ; ENERGY LOSSES ; Exact sciences and technology ; FRACTURES ; MATERIALS ; MATERIALS SCIENCE ; Materials synthesis; materials processing ; MATHEMATICAL MODELS ; MELTING ; Metals. Metallurgy ; MICROSTRUCTURE ; Physics ; Powder processing: powder metallurgy, compaction, sintering, mechanical alloying, and granulation ; POWDERS ; SHOCK WAVES ; VOIDS</subject><ispartof>Acta Materialia, 1999-05, Vol.47 (7), p.2089-2108</ispartof><rights>1999 Acta Metallurgica Inc</rights><rights>1999 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c490t-4c7b484a8b45e649c5ba078ffc7e1fc41a7f6ccc2b33b20fa4dc22a760a8f0573</citedby><cites>FETCH-LOGICAL-c490t-4c7b484a8b45e649c5ba078ffc7e1fc41a7f6ccc2b33b20fa4dc22a760a8f0573</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/S1359-6454(99)00083-X$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,885,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=1837513$$DView record in Pascal Francis$$Hfree_for_read</backlink><backlink>$$Uhttps://www.osti.gov/biblio/357927$$D View this record in Osti.gov$$Hfree_for_read</backlink></links><search><creatorcontrib>Meyers, M.A.</creatorcontrib><creatorcontrib>Benson, D.J.</creatorcontrib><creatorcontrib>Olevsky, E.A.</creatorcontrib><title>Shock consolidation: microstructurally-based analysis and computational modeling</title><title>Acta Materialia</title><description>The most important microstructural processes involved in shock consolidation are identified and discussed; the energy dissipated by a shock wave as it traverses a powder is assessed. The basic microstructural phenomena are illustrated for a metal (nickel-based superalloy), an intermetallic compound (rapidly solidified Ti 3Al), and ceramics (silicon carbide). Interparticle melting, vorticity, voids, and particle fracture are observed and the plastic deformation patterns are identified. Various energy dissipation processes are estimated: plastic deformation, interparticle friction, microkinetic energy, and defect generation. An analytical expression is developed for the energy requirement to shock consolidate a powder as a function of strength, size, porosity, and temperature, based on a prescribed interparticle melting layer. This formulation enables the prediction of pressures required to shock consolidate materials; results of calculations for the superalloy and silicon carbide as a function of particle size and porosity are represented. The fracture of ceramic particles under shock compression is discussed. Tensile stresses are generated during compaction that may lead to fracture. It is shown that the activation of flaws occurs at tensile reflected pulses that are a decreasing fraction of the compressive pulse, as the powder strength increases. These analytical results are compared to numerical solutions obtained by modeling the compaction of a discrete set of particles with an Eulerian finite element program. These results confirm the increasing difficulty encountered in shock consolidating harder materials, and point out three possible solutions: (a) reduction of initial particle size; (b) reduction of shock energy; (c) post-shock thermal treatment. Two possible and potentially fruitful approaches are to shock densify (collapse voids with minimum bonding) powders and to apply post-shock thermal treatments, and to shock consolidate nanosized powders. The latter method requires high shock energy and careful minimization of the shock reflections.</description><subject>Applied sciences</subject><subject>COMPACTING</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>ENERGY LOSSES</subject><subject>Exact sciences and technology</subject><subject>FRACTURES</subject><subject>MATERIALS</subject><subject>MATERIALS SCIENCE</subject><subject>Materials synthesis; materials processing</subject><subject>MATHEMATICAL MODELS</subject><subject>MELTING</subject><subject>Metals. Metallurgy</subject><subject>MICROSTRUCTURE</subject><subject>Physics</subject><subject>Powder processing: powder metallurgy, compaction, sintering, mechanical alloying, and granulation</subject><subject>POWDERS</subject><subject>SHOCK WAVES</subject><subject>VOIDS</subject><issn>1359-6454</issn><issn>1873-2453</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><recordid>eNqNkUtLxDAUhYso-PwJwggiuqgmTdK0bkQGXyAoqOAu3N4mGk2bMWmF-fe2M4pLXeUuvnNvzjlJskvJMSU0P3mgTJRpzgU_LMsjQkjB0ueVZIMWkqUZF2x1mH-Q9WQzxjdCaCY52UjuH149vk_Qt9E7W0NnfXs6aSwGH7vQY9cHcG6eVhB1PYEW3DzaOAz1oGlmfbdQgJs0vtbOti_byZoBF_XO97uVPF1ePE6v09u7q5vp-W2KvCRdylFWvOBQVFzonJcoKiCyMAalpgY5BWlyRMwqxqqMGOA1ZhnInEBhiJBsK9lb7h3-aVVE22l8HWy0GjvFhCyzkTlYMrPgP3odO9XYiNo5aLXvo8okFSLn9D8gKYRgAyiW4JhPDNqoWbANhLmiRI1lqEUZakxalaValKGeB93-9wGICM4EaNHGX3HBpKDj-rMlpofkPq0OozHdoq5tGH3V3v5x6AvdsZ_J</recordid><startdate>19990528</startdate><enddate>19990528</enddate><creator>Meyers, M.A.</creator><creator>Benson, D.J.</creator><creator>Olevsky, E.A.</creator><general>Elsevier Ltd</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7SR</scope><scope>8FD</scope><scope>JG9</scope><scope>8BQ</scope><scope>OTOTI</scope></search><sort><creationdate>19990528</creationdate><title>Shock consolidation: microstructurally-based analysis and computational modeling</title><author>Meyers, M.A. ; Benson, D.J. ; Olevsky, E.A.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c490t-4c7b484a8b45e649c5ba078ffc7e1fc41a7f6ccc2b33b20fa4dc22a760a8f0573</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Applied sciences</topic><topic>COMPACTING</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>ENERGY LOSSES</topic><topic>Exact sciences and technology</topic><topic>FRACTURES</topic><topic>MATERIALS</topic><topic>MATERIALS SCIENCE</topic><topic>Materials synthesis; materials processing</topic><topic>MATHEMATICAL MODELS</topic><topic>MELTING</topic><topic>Metals. Metallurgy</topic><topic>MICROSTRUCTURE</topic><topic>Physics</topic><topic>Powder processing: powder metallurgy, compaction, sintering, mechanical alloying, and granulation</topic><topic>POWDERS</topic><topic>SHOCK WAVES</topic><topic>VOIDS</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Meyers, M.A.</creatorcontrib><creatorcontrib>Benson, D.J.</creatorcontrib><creatorcontrib>Olevsky, E.A.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>METADEX</collection><collection>OSTI.GOV</collection><jtitle>Acta Materialia</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Meyers, M.A.</au><au>Benson, D.J.</au><au>Olevsky, E.A.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Shock consolidation: microstructurally-based analysis and computational modeling</atitle><jtitle>Acta Materialia</jtitle><date>1999-05-28</date><risdate>1999</risdate><volume>47</volume><issue>7</issue><spage>2089</spage><epage>2108</epage><pages>2089-2108</pages><issn>1359-6454</issn><eissn>1873-2453</eissn><abstract>The most important microstructural processes involved in shock consolidation are identified and discussed; the energy dissipated by a shock wave as it traverses a powder is assessed. The basic microstructural phenomena are illustrated for a metal (nickel-based superalloy), an intermetallic compound (rapidly solidified Ti 3Al), and ceramics (silicon carbide). Interparticle melting, vorticity, voids, and particle fracture are observed and the plastic deformation patterns are identified. Various energy dissipation processes are estimated: plastic deformation, interparticle friction, microkinetic energy, and defect generation. An analytical expression is developed for the energy requirement to shock consolidate a powder as a function of strength, size, porosity, and temperature, based on a prescribed interparticle melting layer. This formulation enables the prediction of pressures required to shock consolidate materials; results of calculations for the superalloy and silicon carbide as a function of particle size and porosity are represented. The fracture of ceramic particles under shock compression is discussed. Tensile stresses are generated during compaction that may lead to fracture. It is shown that the activation of flaws occurs at tensile reflected pulses that are a decreasing fraction of the compressive pulse, as the powder strength increases. These analytical results are compared to numerical solutions obtained by modeling the compaction of a discrete set of particles with an Eulerian finite element program. These results confirm the increasing difficulty encountered in shock consolidating harder materials, and point out three possible solutions: (a) reduction of initial particle size; (b) reduction of shock energy; (c) post-shock thermal treatment. Two possible and potentially fruitful approaches are to shock densify (collapse voids with minimum bonding) powders and to apply post-shock thermal treatments, and to shock consolidate nanosized powders. The latter method requires high shock energy and careful minimization of the shock reflections.</abstract><cop>Oxford</cop><pub>Elsevier Ltd</pub><doi>10.1016/S1359-6454(99)00083-X</doi><tpages>20</tpages></addata></record>
fulltext fulltext
identifier ISSN: 1359-6454
ispartof Acta Materialia, 1999-05, Vol.47 (7), p.2089-2108
issn 1359-6454
1873-2453
language eng
recordid cdi_proquest_miscellaneous_27155641
source Access via ScienceDirect (Elsevier)
subjects Applied sciences
COMPACTING
Cross-disciplinary physics: materials science
rheology
ENERGY LOSSES
Exact sciences and technology
FRACTURES
MATERIALS
MATERIALS SCIENCE
Materials synthesis
materials processing
MATHEMATICAL MODELS
MELTING
Metals. Metallurgy
MICROSTRUCTURE
Physics
Powder processing: powder metallurgy, compaction, sintering, mechanical alloying, and granulation
POWDERS
SHOCK WAVES
VOIDS
title Shock consolidation: microstructurally-based analysis and computational modeling
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T00%3A59%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_osti_&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Shock%20consolidation:%20microstructurally-based%20analysis%20and%20computational%20modeling&rft.jtitle=Acta%20Materialia&rft.au=Meyers,%20M.A.&rft.date=1999-05-28&rft.volume=47&rft.issue=7&rft.spage=2089&rft.epage=2108&rft.pages=2089-2108&rft.issn=1359-6454&rft.eissn=1873-2453&rft_id=info:doi/10.1016/S1359-6454(99)00083-X&rft_dat=%3Cproquest_osti_%3E27108553%3C/proquest_osti_%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=27108553&rft_id=info:pmid/&rft_els_id=S135964549900083X&rfr_iscdi=true