Feature superfilling in copper electrochemical deposition

We present a finite element-based simulator for electrochemical deposition (ECD) on the scale of features on patterned wafers during integrated circuit (IC) fabrication. The potential, current, and species concentration fields are computed after specifying the dependent variable values above the waf...

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Veröffentlicht in:	Journal of the Electrochemical Society 2002, Vol.149 (1), p.C74-C81
Hauptverfasser:	SOUKANE, S, SEN, S, CALE, And T. S
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology Lithography, masks and pattern transfer Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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