Effect of copper seed aging on electroplating-induced defects in copper interconnects

Voids in copper thin films, observed after electroplating, have been linked to seed aging that occurs when a wafer is exposed, over time, to clean-room ambient. Oxidation of the copper seed surface prevents wetting during subsequent copper electroplating, leading to voids. Several surface treatments...

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Veröffentlicht in:	Journal of electronic materials 2002-10, Vol.31 (10), p.1047-1051
Hauptverfasser:	CONTESTABLE-GILKES, Daniele, RAMAPPA, Deepak, OH, Minseok, MERCHANT, Sailesh M
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology Metallization, contacts, interconnects device isolation Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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