Bonding of silicon scanning mirror having vertical comb fingers
A 1500x1200-micron silicon scanning mirror has been fabricated by using anodic bonding and flip chip bonding. This scanning mirror is mainly composed of two structures having vertical comb fingers. By anodic bonding between the silicon wafer and the Pyrex glass substrate, and following deep inductiv...
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| Veröffentlicht in: | Journal of micromechanics and microengineering 2002-09, Vol.12 (5), p.644-649, Article 320 |
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| container_end_page | 649 |
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| container_issue | 5 |
| container_start_page | 644 |
| container_title | Journal of micromechanics and microengineering |
| container_volume | 12 |
| creator | Lee, Jin-Ho Ko, Young-Chul Choi, Byoung-So Kim, Jong-Min Jeon, Duk Young |
| description | A 1500x1200-micron silicon scanning mirror has been fabricated by using anodic bonding and flip chip bonding. This scanning mirror is mainly composed of two structures having vertical comb fingers. By anodic bonding between the silicon wafer and the Pyrex glass substrate, and following deep inductively coupled plasma reactive ion etching (ICPRIE), isolated comb electrodes were fabricated at the lower structure. However, gold signal lines for electrical connection to the electrodes, which were inserted between silicon and Pyrex glass, were damaged during anodic bonding. This problem was solved by using the proposed processes and signal lines were successfully fabricated with the contact resistance below several tens of ohms. Using flip chip bonding, the upper and lower structures, with vertical comb fingers, were assembled. Vertical comb fingers of two structures were aligned with a microscope and the frames of two structures were bonded at 300 C for 20 s using the eutectic bonding material-electroplated AuSn. Finally, the scanning mirror was successfully fabricated and could be used for laser display as a galvanometric vertical scanner. (Author) |
| doi_str_mv | 10.1088/0960-1317/12/5/320 |
| format | Article |
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This scanning mirror is mainly composed of two structures having vertical comb fingers. By anodic bonding between the silicon wafer and the Pyrex glass substrate, and following deep inductively coupled plasma reactive ion etching (ICPRIE), isolated comb electrodes were fabricated at the lower structure. However, gold signal lines for electrical connection to the electrodes, which were inserted between silicon and Pyrex glass, were damaged during anodic bonding. This problem was solved by using the proposed processes and signal lines were successfully fabricated with the contact resistance below several tens of ohms. Using flip chip bonding, the upper and lower structures, with vertical comb fingers, were assembled. Vertical comb fingers of two structures were aligned with a microscope and the frames of two structures were bonded at 300 C for 20 s using the eutectic bonding material-electroplated AuSn. Finally, the scanning mirror was successfully fabricated and could be used for laser display as a galvanometric vertical scanner. (Author)</description><identifier>ISSN: 0960-1317</identifier><identifier>EISSN: 1361-6439</identifier><identifier>DOI: 10.1088/0960-1317/12/5/320</identifier><language>eng</language><publisher>Bristol: IOP Publishing</publisher><subject>Applied sciences ; Bonding ; Electrodes ; Electronics ; Exact sciences and technology ; Fundamental areas of phenomenology (including applications) ; General equipment and techniques ; Instruments, apparatus, components and techniques common to several branches of physics and astronomy ; Lenses, prisms and mirrors ; Lithography, masks and pattern transfer ; Mechanical instruments, equipment and techniques ; Microelectronic fabrication (materials and surfaces technology) ; Micromechanical devices and systems ; Optical elements, devices, and systems ; Optics ; Physics ; Reactive ion etching ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Silicon wafers ; Substrates ; Transducers</subject><ispartof>Journal of micromechanics and microengineering, 2002-09, Vol.12 (5), p.644-649, Article 320</ispartof><rights>2002 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c410t-bf635b36326c2b4db653b08fc873a81790e71ca7bbb45c572cb127aacb55870c3</citedby><cites>FETCH-LOGICAL-c410t-bf635b36326c2b4db653b08fc873a81790e71ca7bbb45c572cb127aacb55870c3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://iopscience.iop.org/article/10.1088/0960-1317/12/5/320/pdf$$EPDF$$P50$$Giop$$H</linktopdf><link.rule.ids>315,781,785,27929,27930,53835,53915</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=13870139$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Lee, Jin-Ho</creatorcontrib><creatorcontrib>Ko, Young-Chul</creatorcontrib><creatorcontrib>Choi, Byoung-So</creatorcontrib><creatorcontrib>Kim, Jong-Min</creatorcontrib><creatorcontrib>Jeon, Duk Young</creatorcontrib><title>Bonding of silicon scanning mirror having vertical comb fingers</title><title>Journal of micromechanics and microengineering</title><description>A 1500x1200-micron silicon scanning mirror has been fabricated by using anodic bonding and flip chip bonding. This scanning mirror is mainly composed of two structures having vertical comb fingers. By anodic bonding between the silicon wafer and the Pyrex glass substrate, and following deep inductively coupled plasma reactive ion etching (ICPRIE), isolated comb electrodes were fabricated at the lower structure. However, gold signal lines for electrical connection to the electrodes, which were inserted between silicon and Pyrex glass, were damaged during anodic bonding. This problem was solved by using the proposed processes and signal lines were successfully fabricated with the contact resistance below several tens of ohms. Using flip chip bonding, the upper and lower structures, with vertical comb fingers, were assembled. Vertical comb fingers of two structures were aligned with a microscope and the frames of two structures were bonded at 300 C for 20 s using the eutectic bonding material-electroplated AuSn. Finally, the scanning mirror was successfully fabricated and could be used for laser display as a galvanometric vertical scanner. (Author)</description><subject>Applied sciences</subject><subject>Bonding</subject><subject>Electrodes</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Fundamental areas of phenomenology (including applications)</subject><subject>General equipment and techniques</subject><subject>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</subject><subject>Lenses, prisms and mirrors</subject><subject>Lithography, masks and pattern transfer</subject><subject>Mechanical instruments, equipment and techniques</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Micromechanical devices and systems</subject><subject>Optical elements, devices, and systems</subject><subject>Optics</subject><subject>Physics</subject><subject>Reactive ion etching</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Silicon wafers</subject><subject>Substrates</subject><subject>Transducers</subject><issn>0960-1317</issn><issn>1361-6439</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2002</creationdate><recordtype>article</recordtype><recordid>eNqNkE1LxDAQhoMouK7-AU-9qHiozSTNR0-ii1-w4EXPIcm2Gmmbmuwu-O9N2UUPC-JpmOF5X4YHoVPAV4ClLHDFcQ4URAGkYAUleA9NgHLIeUmrfTT5AQ7RUYwfGANIkBN0fev7hevfMt9k0bXO-j6LVvf9eOtcCD5k73o9bus6LJ3VbWZ9Z7ImneoQj9FBo9tYn2znFL3e373MHvP588PT7Gae2xLwMjcNp8xQTgm3xJQLwxk1WDZWCqoliArXAqwWxpiSWSaINUCE1tYwJgW2dIouNr1D8J-rOi5V56Kt21b3tV9FJUqOQRJGEnn-J0kE5ji1JpBsQBt8jKFu1BBcp8OXAqxGq2qUpkZpCohiKllNobNtu06a2ibo3rr4m6TpW6BV4vIN5_zwv97LXX6XU8Oiod_MBJCc</recordid><startdate>20020901</startdate><enddate>20020901</enddate><creator>Lee, Jin-Ho</creator><creator>Ko, Young-Chul</creator><creator>Choi, Byoung-So</creator><creator>Kim, Jong-Min</creator><creator>Jeon, Duk Young</creator><general>IOP Publishing</general><general>Institute of Physics</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope><scope>7TC</scope></search><sort><creationdate>20020901</creationdate><title>Bonding of silicon scanning mirror having vertical comb fingers</title><author>Lee, Jin-Ho ; Ko, Young-Chul ; Choi, Byoung-So ; Kim, Jong-Min ; Jeon, Duk Young</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c410t-bf635b36326c2b4db653b08fc873a81790e71ca7bbb45c572cb127aacb55870c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2002</creationdate><topic>Applied sciences</topic><topic>Bonding</topic><topic>Electrodes</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Fundamental areas of phenomenology (including applications)</topic><topic>General equipment and techniques</topic><topic>Instruments, apparatus, components and techniques common to several branches of physics and astronomy</topic><topic>Lenses, prisms and mirrors</topic><topic>Lithography, masks and pattern transfer</topic><topic>Mechanical instruments, equipment and techniques</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Micromechanical devices and systems</topic><topic>Optical elements, devices, and systems</topic><topic>Optics</topic><topic>Physics</topic><topic>Reactive ion etching</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Silicon wafers</topic><topic>Substrates</topic><topic>Transducers</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lee, Jin-Ho</creatorcontrib><creatorcontrib>Ko, Young-Chul</creatorcontrib><creatorcontrib>Choi, Byoung-So</creatorcontrib><creatorcontrib>Kim, Jong-Min</creatorcontrib><creatorcontrib>Jeon, Duk Young</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Mechanical Engineering Abstracts</collection><jtitle>Journal of micromechanics and microengineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lee, Jin-Ho</au><au>Ko, Young-Chul</au><au>Choi, Byoung-So</au><au>Kim, Jong-Min</au><au>Jeon, Duk Young</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Bonding of silicon scanning mirror having vertical comb fingers</atitle><jtitle>Journal of micromechanics and microengineering</jtitle><date>2002-09-01</date><risdate>2002</risdate><volume>12</volume><issue>5</issue><spage>644</spage><epage>649</epage><pages>644-649</pages><artnum>320</artnum><issn>0960-1317</issn><eissn>1361-6439</eissn><abstract>A 1500x1200-micron silicon scanning mirror has been fabricated by using anodic bonding and flip chip bonding. This scanning mirror is mainly composed of two structures having vertical comb fingers. By anodic bonding between the silicon wafer and the Pyrex glass substrate, and following deep inductively coupled plasma reactive ion etching (ICPRIE), isolated comb electrodes were fabricated at the lower structure. However, gold signal lines for electrical connection to the electrodes, which were inserted between silicon and Pyrex glass, were damaged during anodic bonding. This problem was solved by using the proposed processes and signal lines were successfully fabricated with the contact resistance below several tens of ohms. Using flip chip bonding, the upper and lower structures, with vertical comb fingers, were assembled. Vertical comb fingers of two structures were aligned with a microscope and the frames of two structures were bonded at 300 C for 20 s using the eutectic bonding material-electroplated AuSn. Finally, the scanning mirror was successfully fabricated and could be used for laser display as a galvanometric vertical scanner. (Author)</abstract><cop>Bristol</cop><pub>IOP Publishing</pub><doi>10.1088/0960-1317/12/5/320</doi><tpages>6</tpages></addata></record> |
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| ispartof | Journal of micromechanics and microengineering, 2002-09, Vol.12 (5), p.644-649, Article 320 |
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| source | IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link |
| subjects | Applied sciences Bonding Electrodes Electronics Exact sciences and technology Fundamental areas of phenomenology (including applications) General equipment and techniques Instruments, apparatus, components and techniques common to several branches of physics and astronomy Lenses, prisms and mirrors Lithography, masks and pattern transfer Mechanical instruments, equipment and techniques Microelectronic fabrication (materials and surfaces technology) Micromechanical devices and systems Optical elements, devices, and systems Optics Physics Reactive ion etching Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Silicon wafers Substrates Transducers |
| title | Bonding of silicon scanning mirror having vertical comb fingers |
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