Voltammetric characterization of oxide films formed on copper in air
Oxide layers thermally formed on copper have been studied using double sweep cyclic voltammetry in strongly alkaline electrolytes. It was found that the addition of 1 M LiOH in an electrolyte (6 M KOH) allowed perfect resolution of cathodic waves due to the reduction of Cu sub 2 O and CuO. Assignmen...
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Veröffentlicht in: | Journal of the Electrochemical Society 2001-11, Vol.148 (11), p.B467-B472 |
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container_title | Journal of the Electrochemical Society |
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creator | NAKAYAMA, Shigeyoshi KIMURA, Atsushi SHIBATA, Masahiro KUWABATA, Susumu OSAKAI, Toshiyuki |
description | Oxide layers thermally formed on copper have been studied using double sweep cyclic voltammetry in strongly alkaline electrolytes. It was found that the addition of 1 M LiOH in an electrolyte (6 M KOH) allowed perfect resolution of cathodic waves due to the reduction of Cu sub 2 O and CuO. Assignment of the two reduction waves has been achieved with the help of spectrophotometric techniques including X-ray photoelectron spectroscopy and X-ray diffraction; the cathodic wave appearing between -1.3 and -1.5 V (vs. Ag/AgCl) was attributed to the reduction of Cu sub 2 O, while that appearing at a less negative potential (-1.0 to -1.1 V) was attributed to the reduction of CuO. The electrochemical measurement of samples prepared under several conditions has revealed that CuO is reduced at once to Cu prior to the reduction of Cu sub 2 O. It was also confirmed that the formation of the oxide films was accelerated by elevating temperature, heightening humidity, and by preimmersion in electrolyte solutions. Water vapor was essential for the formation of CuO at a lower temperature (80 deg C). |
doi_str_mv | 10.1149/1.1409545 |
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It was found that the addition of 1 M LiOH in an electrolyte (6 M KOH) allowed perfect resolution of cathodic waves due to the reduction of Cu sub 2 O and CuO. Assignment of the two reduction waves has been achieved with the help of spectrophotometric techniques including X-ray photoelectron spectroscopy and X-ray diffraction; the cathodic wave appearing between -1.3 and -1.5 V (vs. Ag/AgCl) was attributed to the reduction of Cu sub 2 O, while that appearing at a less negative potential (-1.0 to -1.1 V) was attributed to the reduction of CuO. The electrochemical measurement of samples prepared under several conditions has revealed that CuO is reduced at once to Cu prior to the reduction of Cu sub 2 O. It was also confirmed that the formation of the oxide films was accelerated by elevating temperature, heightening humidity, and by preimmersion in electrolyte solutions. 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It was found that the addition of 1 M LiOH in an electrolyte (6 M KOH) allowed perfect resolution of cathodic waves due to the reduction of Cu sub 2 O and CuO. Assignment of the two reduction waves has been achieved with the help of spectrophotometric techniques including X-ray photoelectron spectroscopy and X-ray diffraction; the cathodic wave appearing between -1.3 and -1.5 V (vs. Ag/AgCl) was attributed to the reduction of Cu sub 2 O, while that appearing at a less negative potential (-1.0 to -1.1 V) was attributed to the reduction of CuO. The electrochemical measurement of samples prepared under several conditions has revealed that CuO is reduced at once to Cu prior to the reduction of Cu sub 2 O. It was also confirmed that the formation of the oxide films was accelerated by elevating temperature, heightening humidity, and by preimmersion in electrolyte solutions. Water vapor was essential for the formation of CuO at a lower temperature (80 deg C).</description><subject>Chemistry</subject><subject>Electrochemistry</subject><subject>Electrodeposition</subject><subject>Exact sciences and technology</subject><subject>General and physical chemistry</subject><subject>Study of interfaces</subject><issn>0013-4651</issn><issn>1945-7111</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><recordid>eNpFkE1LxDAYhIMouK4e_Ae5KHjomrd527RHWT9hwYt6LW_zgZG2qUkX1F9vZRc8DcM8M4dh7BzECgDra1gBirrA4oAtoMYiUwBwyBZCgMywLOCYnaT0MVuoUC3Y7VvoJup7O0WvuX6nSHqy0f_Q5MPAg-PhyxvLne_6xF2IvTV8DnQYRxu5Hzj5eMqOHHXJnu11yV7v717Wj9nm-eFpfbPJtCxwyrDNrTayLWpXoXRa5dDatrQGjYFKYNliIaWqLWkliAxipUs0Ypa2LEuSS3a52x1j-NzaNDW9T9p2HQ02bFOTK4E1KJjBqx2oY0gpWteM0fcUvxsQzd9PDTT7n2b2Yj9KSVPnIg3ap_8CQq6gzuUvqiFnMA</recordid><startdate>20011101</startdate><enddate>20011101</enddate><creator>NAKAYAMA, Shigeyoshi</creator><creator>KIMURA, Atsushi</creator><creator>SHIBATA, Masahiro</creator><creator>KUWABATA, Susumu</creator><creator>OSAKAI, Toshiyuki</creator><general>Electrochemical Society</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SE</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope></search><sort><creationdate>20011101</creationdate><title>Voltammetric characterization of oxide films formed on copper in air</title><author>NAKAYAMA, Shigeyoshi ; KIMURA, Atsushi ; SHIBATA, Masahiro ; KUWABATA, Susumu ; OSAKAI, Toshiyuki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c354t-4b2ecd3b59f843fc721beb6ed4dd18046b453379eac70aad448c64d048cb666a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Chemistry</topic><topic>Electrochemistry</topic><topic>Electrodeposition</topic><topic>Exact sciences and technology</topic><topic>General and physical chemistry</topic><topic>Study of interfaces</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>NAKAYAMA, Shigeyoshi</creatorcontrib><creatorcontrib>KIMURA, Atsushi</creatorcontrib><creatorcontrib>SHIBATA, Masahiro</creatorcontrib><creatorcontrib>KUWABATA, Susumu</creatorcontrib><creatorcontrib>OSAKAI, Toshiyuki</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Corrosion Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>Journal of the Electrochemical Society</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>NAKAYAMA, Shigeyoshi</au><au>KIMURA, Atsushi</au><au>SHIBATA, Masahiro</au><au>KUWABATA, Susumu</au><au>OSAKAI, Toshiyuki</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Voltammetric characterization of oxide films formed on copper in air</atitle><jtitle>Journal of the Electrochemical Society</jtitle><date>2001-11-01</date><risdate>2001</risdate><volume>148</volume><issue>11</issue><spage>B467</spage><epage>B472</epage><pages>B467-B472</pages><issn>0013-4651</issn><eissn>1945-7111</eissn><coden>JESOAN</coden><abstract>Oxide layers thermally formed on copper have been studied using double sweep cyclic voltammetry in strongly alkaline electrolytes. It was found that the addition of 1 M LiOH in an electrolyte (6 M KOH) allowed perfect resolution of cathodic waves due to the reduction of Cu sub 2 O and CuO. Assignment of the two reduction waves has been achieved with the help of spectrophotometric techniques including X-ray photoelectron spectroscopy and X-ray diffraction; the cathodic wave appearing between -1.3 and -1.5 V (vs. Ag/AgCl) was attributed to the reduction of Cu sub 2 O, while that appearing at a less negative potential (-1.0 to -1.1 V) was attributed to the reduction of CuO. The electrochemical measurement of samples prepared under several conditions has revealed that CuO is reduced at once to Cu prior to the reduction of Cu sub 2 O. It was also confirmed that the formation of the oxide films was accelerated by elevating temperature, heightening humidity, and by preimmersion in electrolyte solutions. Water vapor was essential for the formation of CuO at a lower temperature (80 deg C).</abstract><cop>Pennington, NJ</cop><pub>Electrochemical Society</pub><doi>10.1149/1.1409545</doi></addata></record> |
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subjects | Chemistry Electrochemistry Electrodeposition Exact sciences and technology General and physical chemistry Study of interfaces |
title | Voltammetric characterization of oxide films formed on copper in air |
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