Endurance of thermoset resins for flip chip encapsulation

The adhesion or endurance between underfills and die, as well as between underfills and printed circuit board (PCB) is examined. Two types of thermosetting plastic underfills, one commercial product called J and another called IME are investigated. The formulations of both underfills are protected b...

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Veröffentlicht in:	Journal of materials science letters 1999-03, Vol.18 (5), p.423-424
Hauptverfasser:	SARKAR, G, NG, H. W, LAW, S. B
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology
Online-Zugang:	Volltext
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