Elongation of Lifetime of Ni-W Alloy Electroplating Bath by Using Sacrificial Organic Compound
Ni-W alloy plating is expected as a substitute for Cr plating, because of its hard, superior corrosion resistance and resistance to softening at high temperature. The effect on suppression of electrolytic oxidation of organic compound by the addition of sacrificial organic compound in Ni-W alloy pla...
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Veröffentlicht in: | Hyōmen gijutsu 1999/12/01, Vol.50(12), pp.1169-1170 |
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container_title | Hyōmen gijutsu |
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creator | MORIKAWA, Tsutomu NAKADE, Takuo SATO, Yukihiro YOKOI, Masayuki ISHIDA, Kouhei |
description | Ni-W alloy plating is expected as a substitute for Cr plating, because of its hard, superior corrosion resistance and resistance to softening at high temperature. The effect on suppression of electrolytic oxidation of organic compound by the addition of sacrificial organic compound in Ni-W alloy plating was investigated by electrochemical measurements and a plating experiment. It became clear that the addition of sacrificial organic compound to electrolyte suppress the decomposition of organic complex agent on an insoluble anode. |
doi_str_mv | 10.4139/sfj.50.1169 |
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fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_27003294</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>27003294</sourcerecordid><originalsourceid>FETCH-LOGICAL-c2949-dcc561dc1c306f8ef817b1137714459cee954ab8509cb45fd9638293ac32c9943</originalsourceid><addsrcrecordid>eNpd0E1rGzEQBmBRWqib9NQ_ICj0UtbRrKTdnWNqnCZgkkMbequQx5IjI69caX3wv-9uHHLIRR_wzDDzMvYFxFyBxKvid3Mt5gANvmMz6DpVSSXwPZsJBF1B1-BH9qmUnRBS6qadsb_LmPqtHULqefJ8Fbwbwt5N7_tQ_eHXMaYTX0ZHQ06HOMJ-y3_Y4YmvT_yxTL9flnLwgYKN_CFvbR-IL9L-kI795pJ98DYW9_nlvmCPN8vfi9tq9fDzbnG9qqhGhdWGSDewISApGt8530G7BpBtC0ppJOdQK7vutEBaK-032MiuRmlJ1oSo5AX7du57yOnf0ZXB7EMhF6PtXToWU7fjxvUz_PoG7tIx9-NsBhSCQAEwqe9nRTmVkp03hxz2Np8MCDMlbcakjRZmSnrUN2e9K4Pduldr8xAouskCdvjs65dzKnwF9GSzcb38D5FHiGE</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1491090114</pqid></control><display><type>article</type><title>Elongation of Lifetime of Ni-W Alloy Electroplating Bath by Using Sacrificial Organic Compound</title><source>J-STAGE (Free - Japanese)</source><source>EZB Electronic Journals Library</source><creator>MORIKAWA, Tsutomu ; NAKADE, Takuo ; SATO, Yukihiro ; YOKOI, Masayuki ; ISHIDA, Kouhei</creator><creatorcontrib>MORIKAWA, Tsutomu ; NAKADE, Takuo ; SATO, Yukihiro ; YOKOI, Masayuki ; ISHIDA, Kouhei</creatorcontrib><description>Ni-W alloy plating is expected as a substitute for Cr plating, because of its hard, superior corrosion resistance and resistance to softening at high temperature. The effect on suppression of electrolytic oxidation of organic compound by the addition of sacrificial organic compound in Ni-W alloy plating was investigated by electrochemical measurements and a plating experiment. It became clear that the addition of sacrificial organic compound to electrolyte suppress the decomposition of organic complex agent on an insoluble anode.</description><identifier>ISSN: 0915-1869</identifier><identifier>EISSN: 1884-3409</identifier><identifier>DOI: 10.4139/sfj.50.1169</identifier><language>eng ; jpn</language><publisher>Tokyo: The Surface Finishing Society of Japan</publisher><subject>Elongation of Lifetime ; Ni-W Alloy ; Sacrificial Organic Compound</subject><ispartof>Journal of The Surface Finishing Society of Japan, 1999/12/01, Vol.50(12), pp.1169-1170</ispartof><rights>The Surface Finishing Society of Japan</rights><rights>Copyright Japan Science and Technology Agency 1999</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c2949-dcc561dc1c306f8ef817b1137714459cee954ab8509cb45fd9638293ac32c9943</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids></links><search><creatorcontrib>MORIKAWA, Tsutomu</creatorcontrib><creatorcontrib>NAKADE, Takuo</creatorcontrib><creatorcontrib>SATO, Yukihiro</creatorcontrib><creatorcontrib>YOKOI, Masayuki</creatorcontrib><creatorcontrib>ISHIDA, Kouhei</creatorcontrib><title>Elongation of Lifetime of Ni-W Alloy Electroplating Bath by Using Sacrificial Organic Compound</title><title>Hyōmen gijutsu</title><addtitle>Journal of The Surface Finishing Society of Japan</addtitle><description>Ni-W alloy plating is expected as a substitute for Cr plating, because of its hard, superior corrosion resistance and resistance to softening at high temperature. The effect on suppression of electrolytic oxidation of organic compound by the addition of sacrificial organic compound in Ni-W alloy plating was investigated by electrochemical measurements and a plating experiment. It became clear that the addition of sacrificial organic compound to electrolyte suppress the decomposition of organic complex agent on an insoluble anode.</description><subject>Elongation of Lifetime</subject><subject>Ni-W Alloy</subject><subject>Sacrificial Organic Compound</subject><issn>0915-1869</issn><issn>1884-3409</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><recordid>eNpd0E1rGzEQBmBRWqib9NQ_ICj0UtbRrKTdnWNqnCZgkkMbequQx5IjI69caX3wv-9uHHLIRR_wzDDzMvYFxFyBxKvid3Mt5gANvmMz6DpVSSXwPZsJBF1B1-BH9qmUnRBS6qadsb_LmPqtHULqefJ8Fbwbwt5N7_tQ_eHXMaYTX0ZHQ06HOMJ-y3_Y4YmvT_yxTL9flnLwgYKN_CFvbR-IL9L-kI795pJ98DYW9_nlvmCPN8vfi9tq9fDzbnG9qqhGhdWGSDewISApGt8530G7BpBtC0ppJOdQK7vutEBaK-032MiuRmlJ1oSo5AX7du57yOnf0ZXB7EMhF6PtXToWU7fjxvUz_PoG7tIx9-NsBhSCQAEwqe9nRTmVkp03hxz2Np8MCDMlbcakjRZmSnrUN2e9K4Pduldr8xAouskCdvjs65dzKnwF9GSzcb38D5FHiGE</recordid><startdate>19991201</startdate><enddate>19991201</enddate><creator>MORIKAWA, Tsutomu</creator><creator>NAKADE, Takuo</creator><creator>SATO, Yukihiro</creator><creator>YOKOI, Masayuki</creator><creator>ISHIDA, Kouhei</creator><general>The Surface Finishing Society of Japan</general><general>Japan Science and Technology Agency</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope></search><sort><creationdate>19991201</creationdate><title>Elongation of Lifetime of Ni-W Alloy Electroplating Bath by Using Sacrificial Organic Compound</title><author>MORIKAWA, Tsutomu ; NAKADE, Takuo ; SATO, Yukihiro ; YOKOI, Masayuki ; ISHIDA, Kouhei</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2949-dcc561dc1c306f8ef817b1137714459cee954ab8509cb45fd9638293ac32c9943</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng ; jpn</language><creationdate>1999</creationdate><topic>Elongation of Lifetime</topic><topic>Ni-W Alloy</topic><topic>Sacrificial Organic Compound</topic><toplevel>online_resources</toplevel><creatorcontrib>MORIKAWA, Tsutomu</creatorcontrib><creatorcontrib>NAKADE, Takuo</creatorcontrib><creatorcontrib>SATO, Yukihiro</creatorcontrib><creatorcontrib>YOKOI, Masayuki</creatorcontrib><creatorcontrib>ISHIDA, Kouhei</creatorcontrib><collection>CrossRef</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Hyōmen gijutsu</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>MORIKAWA, Tsutomu</au><au>NAKADE, Takuo</au><au>SATO, Yukihiro</au><au>YOKOI, Masayuki</au><au>ISHIDA, Kouhei</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Elongation of Lifetime of Ni-W Alloy Electroplating Bath by Using Sacrificial Organic Compound</atitle><jtitle>Hyōmen gijutsu</jtitle><addtitle>Journal of The Surface Finishing Society of Japan</addtitle><date>1999-12-01</date><risdate>1999</risdate><volume>50</volume><issue>12</issue><spage>1169</spage><epage>1170</epage><pages>1169-1170</pages><issn>0915-1869</issn><eissn>1884-3409</eissn><abstract>Ni-W alloy plating is expected as a substitute for Cr plating, because of its hard, superior corrosion resistance and resistance to softening at high temperature. The effect on suppression of electrolytic oxidation of organic compound by the addition of sacrificial organic compound in Ni-W alloy plating was investigated by electrochemical measurements and a plating experiment. It became clear that the addition of sacrificial organic compound to electrolyte suppress the decomposition of organic complex agent on an insoluble anode.</abstract><cop>Tokyo</cop><pub>The Surface Finishing Society of Japan</pub><doi>10.4139/sfj.50.1169</doi><tpages>2</tpages><oa>free_for_read</oa></addata></record> |
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subjects | Elongation of Lifetime Ni-W Alloy Sacrificial Organic Compound |
title | Elongation of Lifetime of Ni-W Alloy Electroplating Bath by Using Sacrificial Organic Compound |
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