Feature scale simulation of selective chemical vapor deposition process

The feature scale model for selective chemical vapor deposition process was proposed, and the simulation was performed to study the selectivity and the uniformity of deposited thin film using the Monte Carlo method and string algorithm. Elementary steps such as direct deposition, re-emission, and su...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Thin solid films 1999-02, Vol.339 (1-2), p.270-276
Hauptverfasser: YUN, J.-H, RHEE, S.-W
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 276
container_issue 1-2
container_start_page 270
container_title Thin solid films
container_volume 339
creator YUN, J.-H
RHEE, S.-W
description The feature scale model for selective chemical vapor deposition process was proposed, and the simulation was performed to study the selectivity and the uniformity of deposited thin film using the Monte Carlo method and string algorithm. Elementary steps such as direct deposition, re-emission, and surface diffusion were included in the model. The effect of model parameters such as sticking coefficient of the chemical precursor, aspect ratio, surface diffusion coefficient, and lateral wall slope angle was examined in detail. The thickness uniformity of selectively deposited thin film inside the trench was better in the deposition on the microstructure with higher aspect ratio and with the chemical precursor with lower sticking coefficient. It was revealed that the surface diffusion of adsorbed reactant led to the selectivity loss. With the decrease of the lateral wall slope angle, more uniform deposition profile was obtained except near the sidewall of the trench. It was found that low sticking coefficient with optimum surface diffusion coefficient gave the most uniform and selective film deposition.
doi_str_mv 10.1016/S0040-6090(98)01405-9
format Article
fullrecord <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_26968413</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>26968413</sourcerecordid><originalsourceid>FETCH-LOGICAL-c311t-c5a2d045d18b21fbffac0612d64ddfaf5b2edc2e0a07bc962ea04da1c8103d5a3</originalsourceid><addsrcrecordid>eNpFkEFLxDAQhYMouK7-BKEHET1UZ9I2bY6yuKuw4EE9hzSZYKTd1qRd8N_b3RW9zFy-9x58jF0i3CGguH8FyCEVIOFGVreAORSpPGIzrEqZ8jLDYzb7Q07ZWYyfAICcZzO2WpIexkBJNLqZrm_HRg--2ySdSyI1ZAa_pcR8UOsnItnqvguJpb6Lfo_1oTMU4zk7cbqJdPH75-x9-fi2eErXL6vnxcM6NRnikJpCcwt5YbGqObraOW1AILcit9ZpV9ScrOEEGsraSMFJQ241mgohs4XO5uz60Dvtfo0UB9X6aKhp9Ia6MSoupKhyzCawOIAmdDEGcqoPvtXhWyGonTa116Z2TpSs1F6bklPu6ndA75S4oDfGx_-wkKXIZfYD5Ohu1g</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>26968413</pqid></control><display><type>article</type><title>Feature scale simulation of selective chemical vapor deposition process</title><source>Access via ScienceDirect (Elsevier)</source><creator>YUN, J.-H ; RHEE, S.-W</creator><creatorcontrib>YUN, J.-H ; RHEE, S.-W</creatorcontrib><description>The feature scale model for selective chemical vapor deposition process was proposed, and the simulation was performed to study the selectivity and the uniformity of deposited thin film using the Monte Carlo method and string algorithm. Elementary steps such as direct deposition, re-emission, and surface diffusion were included in the model. The effect of model parameters such as sticking coefficient of the chemical precursor, aspect ratio, surface diffusion coefficient, and lateral wall slope angle was examined in detail. The thickness uniformity of selectively deposited thin film inside the trench was better in the deposition on the microstructure with higher aspect ratio and with the chemical precursor with lower sticking coefficient. It was revealed that the surface diffusion of adsorbed reactant led to the selectivity loss. With the decrease of the lateral wall slope angle, more uniform deposition profile was obtained except near the sidewall of the trench. It was found that low sticking coefficient with optimum surface diffusion coefficient gave the most uniform and selective film deposition.</description><identifier>ISSN: 0040-6090</identifier><identifier>EISSN: 1879-2731</identifier><identifier>DOI: 10.1016/S0040-6090(98)01405-9</identifier><identifier>CODEN: THSFAP</identifier><language>eng</language><publisher>Lausanne: Elsevier Science</publisher><subject>Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.) ; Cross-disciplinary physics: materials science; rheology ; Exact sciences and technology ; Materials science ; Methods of deposition of films and coatings; film growth and epitaxy ; Physics ; Theory and models of film growth</subject><ispartof>Thin solid films, 1999-02, Vol.339 (1-2), p.270-276</ispartof><rights>1999 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c311t-c5a2d045d18b21fbffac0612d64ddfaf5b2edc2e0a07bc962ea04da1c8103d5a3</citedby><cites>FETCH-LOGICAL-c311t-c5a2d045d18b21fbffac0612d64ddfaf5b2edc2e0a07bc962ea04da1c8103d5a3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&amp;idt=1697649$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>YUN, J.-H</creatorcontrib><creatorcontrib>RHEE, S.-W</creatorcontrib><title>Feature scale simulation of selective chemical vapor deposition process</title><title>Thin solid films</title><description>The feature scale model for selective chemical vapor deposition process was proposed, and the simulation was performed to study the selectivity and the uniformity of deposited thin film using the Monte Carlo method and string algorithm. Elementary steps such as direct deposition, re-emission, and surface diffusion were included in the model. The effect of model parameters such as sticking coefficient of the chemical precursor, aspect ratio, surface diffusion coefficient, and lateral wall slope angle was examined in detail. The thickness uniformity of selectively deposited thin film inside the trench was better in the deposition on the microstructure with higher aspect ratio and with the chemical precursor with lower sticking coefficient. It was revealed that the surface diffusion of adsorbed reactant led to the selectivity loss. With the decrease of the lateral wall slope angle, more uniform deposition profile was obtained except near the sidewall of the trench. It was found that low sticking coefficient with optimum surface diffusion coefficient gave the most uniform and selective film deposition.</description><subject>Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Exact sciences and technology</subject><subject>Materials science</subject><subject>Methods of deposition of films and coatings; film growth and epitaxy</subject><subject>Physics</subject><subject>Theory and models of film growth</subject><issn>0040-6090</issn><issn>1879-2731</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><recordid>eNpFkEFLxDAQhYMouK7-BKEHET1UZ9I2bY6yuKuw4EE9hzSZYKTd1qRd8N_b3RW9zFy-9x58jF0i3CGguH8FyCEVIOFGVreAORSpPGIzrEqZ8jLDYzb7Q07ZWYyfAICcZzO2WpIexkBJNLqZrm_HRg--2ySdSyI1ZAa_pcR8UOsnItnqvguJpb6Lfo_1oTMU4zk7cbqJdPH75-x9-fi2eErXL6vnxcM6NRnikJpCcwt5YbGqObraOW1AILcit9ZpV9ScrOEEGsraSMFJQ241mgohs4XO5uz60Dvtfo0UB9X6aKhp9Ia6MSoupKhyzCawOIAmdDEGcqoPvtXhWyGonTa116Z2TpSs1F6bklPu6ndA75S4oDfGx_-wkKXIZfYD5Ohu1g</recordid><startdate>19990208</startdate><enddate>19990208</enddate><creator>YUN, J.-H</creator><creator>RHEE, S.-W</creator><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>19990208</creationdate><title>Feature scale simulation of selective chemical vapor deposition process</title><author>YUN, J.-H ; RHEE, S.-W</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c311t-c5a2d045d18b21fbffac0612d64ddfaf5b2edc2e0a07bc962ea04da1c8103d5a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)</topic><topic>Cross-disciplinary physics: materials science; rheology</topic><topic>Exact sciences and technology</topic><topic>Materials science</topic><topic>Methods of deposition of films and coatings; film growth and epitaxy</topic><topic>Physics</topic><topic>Theory and models of film growth</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>YUN, J.-H</creatorcontrib><creatorcontrib>RHEE, S.-W</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Thin solid films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>YUN, J.-H</au><au>RHEE, S.-W</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Feature scale simulation of selective chemical vapor deposition process</atitle><jtitle>Thin solid films</jtitle><date>1999-02-08</date><risdate>1999</risdate><volume>339</volume><issue>1-2</issue><spage>270</spage><epage>276</epage><pages>270-276</pages><issn>0040-6090</issn><eissn>1879-2731</eissn><coden>THSFAP</coden><abstract>The feature scale model for selective chemical vapor deposition process was proposed, and the simulation was performed to study the selectivity and the uniformity of deposited thin film using the Monte Carlo method and string algorithm. Elementary steps such as direct deposition, re-emission, and surface diffusion were included in the model. The effect of model parameters such as sticking coefficient of the chemical precursor, aspect ratio, surface diffusion coefficient, and lateral wall slope angle was examined in detail. The thickness uniformity of selectively deposited thin film inside the trench was better in the deposition on the microstructure with higher aspect ratio and with the chemical precursor with lower sticking coefficient. It was revealed that the surface diffusion of adsorbed reactant led to the selectivity loss. With the decrease of the lateral wall slope angle, more uniform deposition profile was obtained except near the sidewall of the trench. It was found that low sticking coefficient with optimum surface diffusion coefficient gave the most uniform and selective film deposition.</abstract><cop>Lausanne</cop><pub>Elsevier Science</pub><doi>10.1016/S0040-6090(98)01405-9</doi><tpages>7</tpages></addata></record>
fulltext fulltext
identifier ISSN: 0040-6090
ispartof Thin solid films, 1999-02, Vol.339 (1-2), p.270-276
issn 0040-6090
1879-2731
language eng
recordid cdi_proquest_miscellaneous_26968413
source Access via ScienceDirect (Elsevier)
subjects Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.)
Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Methods of deposition of films and coatings
film growth and epitaxy
Physics
Theory and models of film growth
title Feature scale simulation of selective chemical vapor deposition process
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T12%3A10%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Feature%20scale%20simulation%20of%20selective%20chemical%20vapor%20deposition%20process&rft.jtitle=Thin%20solid%20films&rft.au=YUN,%20J.-H&rft.date=1999-02-08&rft.volume=339&rft.issue=1-2&rft.spage=270&rft.epage=276&rft.pages=270-276&rft.issn=0040-6090&rft.eissn=1879-2731&rft.coden=THSFAP&rft_id=info:doi/10.1016/S0040-6090(98)01405-9&rft_dat=%3Cproquest_cross%3E26968413%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=26968413&rft_id=info:pmid/&rfr_iscdi=true