Reliability of Au/Al Bonds and its Governing Factors

In order to clarify the reliability of Au wire bonds to Al pads, failure causes such as void formation and corrosion behavior of Au-Al intermetallics were investigated in accelerated tests. The effects of annealing environments, temperatures and bonding conditions on bond reliability were also exami...

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Veröffentlicht in:	QUARTERLY JOURNAL OF THE JAPAN WELDING SOCIETY 2001/02/05, Vol.19(1), pp.156-166
Hauptverfasser:	UNO, Tomohiro, TATSUMI, Kohei
Format:	Artikel
Sprache:	jpn
Schlagworte:	aluminum thin film bromine corrosion gold intermetallic formation molding resin reliability void wire bonding
Online-Zugang:	Volltext
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