Deposition Mechanism of Electroless Pd Plating Using Formic Acid as a Reducing Agent

Gold plating is used for many surface treatment cases of contact and joints within electronic components to increase the contact performance and the corrosion resistance. However as a result of mutual dispersion of gold and the base metal, or reduction in joint strength due to ductility of intermeta...

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Veröffentlicht in:	Hyōmen gijutsu 1999/05/01, Vol.50(5), pp.469-470
Hauptverfasser:	UCHIDA, Ei, OKADA, Takashi, NAWAFUNE, Hidemi, NAKAO, Seiichiro, MIZUMOTO, Shozo
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Deposition Mechanism Electroless Pd Plating Formic Acid Mass Balance
Online-Zugang:	Volltext
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