Development of an electroplating solution for codepositing Au–Sn alloys

A relatively stable, weakly acidic, non-cyanide electroplating solution has been developed for deposition of Au–Sn alloys over a range of compositions. The solution consists of Au and Sn chloride salts, as well as ammonium citrate as a buffering agent and sodium sulphite and ascorbic acid as stabili...

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Veröffentlicht in:	Materials science & engineering. B, Solid-state materials for advanced technology Solid-state materials for advanced technology, 1999-11, Vol.65 (2), p.111-122
Hauptverfasser:	Sun, W, Ivey, D.G
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Au–Sn alloys Cross-disciplinary physics: materials science rheology Electrodeposition, electroplating Electroplating Exact sciences and technology Materials science Metals. Metallurgy Methods of deposition of films and coatings film growth and epitaxy Physics Solders
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