Development of an electroplating solution for codepositing Au–Sn alloys
A relatively stable, weakly acidic, non-cyanide electroplating solution has been developed for deposition of Au–Sn alloys over a range of compositions. The solution consists of Au and Sn chloride salts, as well as ammonium citrate as a buffering agent and sodium sulphite and ascorbic acid as stabili...
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| Veröffentlicht in: | Materials science & engineering. B, Solid-state materials for advanced technology Solid-state materials for advanced technology, 1999-11, Vol.65 (2), p.111-122 |
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| container_title | Materials science & engineering. B, Solid-state materials for advanced technology |
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| creator | Sun, W Ivey, D.G |
| description | A relatively stable, weakly acidic, non-cyanide electroplating solution has been developed for deposition of Au–Sn alloys over a range of compositions. The solution consists of Au and Sn chloride salts, as well as ammonium citrate as a buffering agent and sodium sulphite and ascorbic acid as stabilizers. Electrochemical studies have been conducted to examine the effects of the various additives and their concentrations on bath stability and plating behaviour. Preliminary electroplating experiments with the developed solution indicate that uniform, homogeneous deposits can be achieved over a range of compositions, including the technologically important eutectic and near eutectic values. |
| doi_str_mv | 10.1016/S0921-5107(99)00223-8 |
| format | Article |
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The solution consists of Au and Sn chloride salts, as well as ammonium citrate as a buffering agent and sodium sulphite and ascorbic acid as stabilizers. Electrochemical studies have been conducted to examine the effects of the various additives and their concentrations on bath stability and plating behaviour. Preliminary electroplating experiments with the developed solution indicate that uniform, homogeneous deposits can be achieved over a range of compositions, including the technologically important eutectic and near eutectic values.</description><identifier>ISSN: 0921-5107</identifier><identifier>EISSN: 1873-4944</identifier><identifier>DOI: 10.1016/S0921-5107(99)00223-8</identifier><language>eng</language><publisher>Amsterdam: Elsevier B.V</publisher><subject>Applied sciences ; Au–Sn alloys ; Cross-disciplinary physics: materials science; rheology ; Electrodeposition, electroplating ; Electroplating ; Exact sciences and technology ; Materials science ; Metals. 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Preliminary electroplating experiments with the developed solution indicate that uniform, homogeneous deposits can be achieved over a range of compositions, including the technologically important eutectic and near eutectic values.</description><subject>Applied sciences</subject><subject>Au–Sn alloys</subject><subject>Cross-disciplinary physics: materials science; rheology</subject><subject>Electrodeposition, electroplating</subject><subject>Electroplating</subject><subject>Exact sciences and technology</subject><subject>Materials science</subject><subject>Metals. 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| ispartof | Materials science & engineering. B, Solid-state materials for advanced technology, 1999-11, Vol.65 (2), p.111-122 |
| issn | 0921-5107 1873-4944 |
| language | eng |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Applied sciences Au–Sn alloys Cross-disciplinary physics: materials science rheology Electrodeposition, electroplating Electroplating Exact sciences and technology Materials science Metals. Metallurgy Methods of deposition of films and coatings film growth and epitaxy Physics Solders |
| title | Development of an electroplating solution for codepositing Au–Sn alloys |
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