A cleaning process for flip chip assemblies before encapsulation
Flip chip technology offers high I/O density on a small footprint with fast signal processes, due to the short electrical interconnect length. However, the residues of the flux-metal reaction can be entrapped underneath the chip and may be difficult to clean/remove. These residues can degrade the re...
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| Veröffentlicht in: | Journal of materials science letters 1999, Vol.18 (1), p.63-65 |
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| container_end_page | 65 |
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| container_title | Journal of materials science letters |
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| creator | SARKAR, G CHONG, Y. F COLLIER, P. A |
| description | Flip chip technology offers high I/O density on a small footprint with fast signal processes, due to the short electrical interconnect length. However, the residues of the flux-metal reaction can be entrapped underneath the chip and may be difficult to clean/remove. These residues can degrade the reliability of the flip chip assembly with corrosive effects. Since the excessive use of chlorofluorocarbons and toxic solvents for cleaning have been raising environmental issues, it is important to develop cleaning processes that are reliable and non-toxic. The surface insulation resistance (SIR) test system is proposed to measure the levels of contamination on the test coupon. |
| doi_str_mv | 10.1023/A:1006681511388 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_pasca</sourceid><recordid>TN_cdi_proquest_miscellaneous_26867143</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>26867143</sourcerecordid><originalsourceid>FETCH-LOGICAL-p213t-30589bbd0b784abc2b6e1de561e5afb0a91305ba5194257a612f486e97280b9c3</originalsourceid><addsrcrecordid>eNotjr1PwzAUxD2ARCnMrB4QW8DPjh2HiajiS6rEAnP07L6AkZuEvHTgvycSXe6ku59OJ8QVqFtQ2tw196CUcx4sgPH-RKyUdlB4pf2ZOGf-VmoJbLkSD42MmbBP_accpyESs-yGSXY5jTJ-LYLMtA85EctAS0WS-ogjHzLOaegvxGmHmeny6Gvx8fT4vnkptm_Pr5tmW4wazFwYZX0dwk6FypcYog6OYEfWAVnsgsIaFiSghbrUtkIHuiu9o7rSXoU6mrW4-d9dXv4ciOd2nzhSztjTcOBWO-8qKM0CXh9B5Ii5m7CPidtxSnucfluoVG2NN3_po1cX</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>26867143</pqid></control><display><type>article</type><title>A cleaning process for flip chip assemblies before encapsulation</title><source>Springer Nature - Complete Springer Journals</source><creator>SARKAR, G ; CHONG, Y. F ; COLLIER, P. A</creator><creatorcontrib>SARKAR, G ; CHONG, Y. F ; COLLIER, P. A</creatorcontrib><description>Flip chip technology offers high I/O density on a small footprint with fast signal processes, due to the short electrical interconnect length. However, the residues of the flux-metal reaction can be entrapped underneath the chip and may be difficult to clean/remove. These residues can degrade the reliability of the flip chip assembly with corrosive effects. Since the excessive use of chlorofluorocarbons and toxic solvents for cleaning have been raising environmental issues, it is important to develop cleaning processes that are reliable and non-toxic. The surface insulation resistance (SIR) test system is proposed to measure the levels of contamination on the test coupon.</description><identifier>ISSN: 0261-8028</identifier><identifier>DOI: 10.1023/A:1006681511388</identifier><identifier>CODEN: JMSLD5</identifier><language>eng</language><publisher>Dordrecht: Kluwer Academic Publishers</publisher><subject>Applied sciences ; Electronics ; Exact sciences and technology ; Microelectronic fabrication (materials and surfaces technology) ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><ispartof>Journal of materials science letters, 1999, Vol.18 (1), p.63-65</ispartof><rights>1999 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,777,781,4010,27904,27905,27906</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=1709538$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>SARKAR, G</creatorcontrib><creatorcontrib>CHONG, Y. F</creatorcontrib><creatorcontrib>COLLIER, P. A</creatorcontrib><title>A cleaning process for flip chip assemblies before encapsulation</title><title>Journal of materials science letters</title><description>Flip chip technology offers high I/O density on a small footprint with fast signal processes, due to the short electrical interconnect length. However, the residues of the flux-metal reaction can be entrapped underneath the chip and may be difficult to clean/remove. These residues can degrade the reliability of the flip chip assembly with corrosive effects. Since the excessive use of chlorofluorocarbons and toxic solvents for cleaning have been raising environmental issues, it is important to develop cleaning processes that are reliable and non-toxic. The surface insulation resistance (SIR) test system is proposed to measure the levels of contamination on the test coupon.</description><subject>Applied sciences</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><issn>0261-8028</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1999</creationdate><recordtype>article</recordtype><recordid>eNotjr1PwzAUxD2ARCnMrB4QW8DPjh2HiajiS6rEAnP07L6AkZuEvHTgvycSXe6ku59OJ8QVqFtQ2tw196CUcx4sgPH-RKyUdlB4pf2ZOGf-VmoJbLkSD42MmbBP_accpyESs-yGSXY5jTJ-LYLMtA85EctAS0WS-ogjHzLOaegvxGmHmeny6Gvx8fT4vnkptm_Pr5tmW4wazFwYZX0dwk6FypcYog6OYEfWAVnsgsIaFiSghbrUtkIHuiu9o7rSXoU6mrW4-d9dXv4ciOd2nzhSztjTcOBWO-8qKM0CXh9B5Ii5m7CPidtxSnucfluoVG2NN3_po1cX</recordid><startdate>1999</startdate><enddate>1999</enddate><creator>SARKAR, G</creator><creator>CHONG, Y. F</creator><creator>COLLIER, P. A</creator><general>Kluwer Academic Publishers</general><scope>IQODW</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>1999</creationdate><title>A cleaning process for flip chip assemblies before encapsulation</title><author>SARKAR, G ; CHONG, Y. F ; COLLIER, P. A</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-p213t-30589bbd0b784abc2b6e1de561e5afb0a91305ba5194257a612f486e97280b9c3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Applied sciences</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Microelectronic fabrication (materials and surfaces technology)</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>SARKAR, G</creatorcontrib><creatorcontrib>CHONG, Y. F</creatorcontrib><creatorcontrib>COLLIER, P. A</creatorcontrib><collection>Pascal-Francis</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Journal of materials science letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>SARKAR, G</au><au>CHONG, Y. F</au><au>COLLIER, P. A</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A cleaning process for flip chip assemblies before encapsulation</atitle><jtitle>Journal of materials science letters</jtitle><date>1999</date><risdate>1999</risdate><volume>18</volume><issue>1</issue><spage>63</spage><epage>65</epage><pages>63-65</pages><issn>0261-8028</issn><coden>JMSLD5</coden><abstract>Flip chip technology offers high I/O density on a small footprint with fast signal processes, due to the short electrical interconnect length. However, the residues of the flux-metal reaction can be entrapped underneath the chip and may be difficult to clean/remove. These residues can degrade the reliability of the flip chip assembly with corrosive effects. Since the excessive use of chlorofluorocarbons and toxic solvents for cleaning have been raising environmental issues, it is important to develop cleaning processes that are reliable and non-toxic. The surface insulation resistance (SIR) test system is proposed to measure the levels of contamination on the test coupon.</abstract><cop>Dordrecht</cop><pub>Kluwer Academic Publishers</pub><doi>10.1023/A:1006681511388</doi><tpages>3</tpages></addata></record> |
| fulltext | fulltext |
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| ispartof | Journal of materials science letters, 1999, Vol.18 (1), p.63-65 |
| issn | 0261-8028 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_26867143 |
| source | Springer Nature - Complete Springer Journals |
| subjects | Applied sciences Electronics Exact sciences and technology Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
| title | A cleaning process for flip chip assemblies before encapsulation |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T20%3A36%3A33IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_pasca&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=A%20cleaning%20process%20for%20flip%20chip%20assemblies%20before%20encapsulation&rft.jtitle=Journal%20of%20materials%20science%20letters&rft.au=SARKAR,%20G&rft.date=1999&rft.volume=18&rft.issue=1&rft.spage=63&rft.epage=65&rft.pages=63-65&rft.issn=0261-8028&rft.coden=JMSLD5&rft_id=info:doi/10.1023/A:1006681511388&rft_dat=%3Cproquest_pasca%3E26867143%3C/proquest_pasca%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=26867143&rft_id=info:pmid/&rfr_iscdi=true |