Exploring CMP solutions to planarity challenges with tungsten plugs
Tungsten plugs have been used in the recent past for local interconnects and for level–level interconnect applications. The resist etch back process has been the method of choice historically for planarization purposes. However, with the advent of chemical mechanical polishing (CMP) technology, one...
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| Veröffentlicht in: | Thin solid films 1998-05, Vol.320 (1), p.103-109 |
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| container_title | Thin solid films |
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| creator | Mendonca, John Murella, Krishna Kim, Inki Schlueter, Jim Karlsrud, Chris |
| description | Tungsten plugs have been used in the recent past for local interconnects and for level–level interconnect applications. The resist etch back process has been the method of choice historically for planarization purposes. However, with the advent of chemical mechanical polishing (CMP) technology, one has an alternate path for achieving global planarity. Process integration issues have to be worked out. In this paper, we have explored the effect of various process parameters and consumable changes on planarity/non-uniformity. The across wafer and wafer–wafer non-uniformity 1-sigma was reduced from 10–20% to 5000 Å/min with 5.5% wafer–wafer removal variation. |
| doi_str_mv | 10.1016/S0040-6090(97)01076-6 |
| format | Article |
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The optimized process was verified on a 500 wafer extended run to obtain >5000 Å/min with 5.5% wafer–wafer removal variation.</description><subject>Applied sciences</subject><subject>Chemical mechanical polishing (CMP)</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Multi-headed tools</subject><subject>Non-uniformity reduction</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. 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| language | eng |
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| source | Elsevier ScienceDirect Journals |
| subjects | Applied sciences Chemical mechanical polishing (CMP) Electronics Exact sciences and technology Microelectronic fabrication (materials and surfaces technology) Multi-headed tools Non-uniformity reduction Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
| title | Exploring CMP solutions to planarity challenges with tungsten plugs |
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