Effects of Annealing Temperature on Tensile Property of Recrystallized Commercial Pure Coppers
Recent trends toward smaller diameter in fine copper wire and smaller thickness in rolled copper foil require improvement in workability of materials. Generally, workability can be estimated by the strain hardening exponent obtained from the true stress-true strain curve in the tensile test. In this...
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Veröffentlicht in: | Journal of the Japan Institute of Metals and Materials 2001, Vol.65(3), pp.217-222 |
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creator | Sudo, Yuichiro Yajima, Kenji Mae, Yoshiharu |
description | Recent trends toward smaller diameter in fine copper wire and smaller thickness in rolled copper foil require improvement in workability of materials. Generally, workability can be estimated by the strain hardening exponent obtained from the true stress-true strain curve in the tensile test. In this work, work hardening behavior of three kinds of recrystallized commercial pure coppers was investigated. The effect of the increase in the annealing temperature is summarized as follows. (1) In oxygen free copper, the flow stress increases due to the locking hardening by sulfur, but the strain hardening exponent does not change. (2) In phosphorus deoxidized copper, the flow stress decreases and the strain hardening exponent increases due to phosphorus in the solid solution. (3) In electrolytic tough pitch copper, the flow stress decreases due to the coarsening of Cu2O particles and the strain hardening exponent increases due to oxygen in solid solution. The difference in work hardening behavior between three kinds of commercially pure coppers seems to be brought about by the difference in the interaction between dislocations or stacking faults and atoms of the above trace elements. |
doi_str_mv | 10.2320/jinstmet1952.65.3_217 |
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Generally, workability can be estimated by the strain hardening exponent obtained from the true stress-true strain curve in the tensile test. In this work, work hardening behavior of three kinds of recrystallized commercial pure coppers was investigated. The effect of the increase in the annealing temperature is summarized as follows. (1) In oxygen free copper, the flow stress increases due to the locking hardening by sulfur, but the strain hardening exponent does not change. (2) In phosphorus deoxidized copper, the flow stress decreases and the strain hardening exponent increases due to phosphorus in the solid solution. (3) In electrolytic tough pitch copper, the flow stress decreases due to the coarsening of Cu2O particles and the strain hardening exponent increases due to oxygen in solid solution. The difference in work hardening behavior between three kinds of commercially pure coppers seems to be brought about by the difference in the interaction between dislocations or stacking faults and atoms of the above trace elements.</description><identifier>ISSN: 0021-4876</identifier><identifier>EISSN: 1880-6880</identifier><identifier>DOI: 10.2320/jinstmet1952.65.3_217</identifier><identifier>CODEN: NIKGAV</identifier><language>jpn</language><publisher>Sendai: The Japan Institute of Metals and Materials</publisher><subject>annealing temperature ; electrolytic tough pitch copper ; oxygen free copper ; phosphorus deoxidized copper ; strain hardening exponent ; work hardening ; workability</subject><ispartof>Journal of the Japan Institute of Metals and Materials, 2001, Vol.65(3), pp.217-222</ispartof><rights>The Japan Institute of Metals</rights><rights>2001 INIST-CNRS</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c422t-c3679198af0daf752b3433c0109c97b667d1a45412e5b7dd3fd7c13ae9920e7e3</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,1876,4009,27902,27903,27904</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=987798$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Sudo, Yuichiro</creatorcontrib><creatorcontrib>Yajima, Kenji</creatorcontrib><creatorcontrib>Mae, Yoshiharu</creatorcontrib><title>Effects of Annealing Temperature on Tensile Property of Recrystallized Commercial Pure Coppers</title><title>Journal of the Japan Institute of Metals and Materials</title><addtitle>J. Japan Inst. Metals and Materials</addtitle><description>Recent trends toward smaller diameter in fine copper wire and smaller thickness in rolled copper foil require improvement in workability of materials. Generally, workability can be estimated by the strain hardening exponent obtained from the true stress-true strain curve in the tensile test. In this work, work hardening behavior of three kinds of recrystallized commercial pure coppers was investigated. The effect of the increase in the annealing temperature is summarized as follows. (1) In oxygen free copper, the flow stress increases due to the locking hardening by sulfur, but the strain hardening exponent does not change. (2) In phosphorus deoxidized copper, the flow stress decreases and the strain hardening exponent increases due to phosphorus in the solid solution. (3) In electrolytic tough pitch copper, the flow stress decreases due to the coarsening of Cu2O particles and the strain hardening exponent increases due to oxygen in solid solution. The difference in work hardening behavior between three kinds of commercially pure coppers seems to be brought about by the difference in the interaction between dislocations or stacking faults and atoms of the above trace elements.</description><subject>annealing temperature</subject><subject>electrolytic tough pitch copper</subject><subject>oxygen free copper</subject><subject>phosphorus deoxidized copper</subject><subject>strain hardening exponent</subject><subject>work hardening</subject><subject>workability</subject><issn>0021-4876</issn><issn>1880-6880</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><recordid>eNptkE9LAzEQxYMoWKofQVgQvG3Nn91kc5SiVihYpF4NaXaikWy2Jumhfnq3VosHLzPMzO-9gYfQBcETyii-fnch5Q4ykTWd8HrCFCXiCI1I0-CSD-UYjTCmpKwawU_ReUpuhTGWnHAsR-jl1lowORW9LW5CAO1deC2W0K0h6ryJUPRhGENyHopF7Id13u7gJzBxm7L23n1CW0z7roNonPbFYqea9usBTWfoxGqf4Pynj9Hz3e1yOivnj_cP05t5aSpKc2kYF5LIRlvcaitqumIVYwYTLI0UK85FS3RVV4RCvRJty2wrDGEapKQYBLAxutr7rmP_sYGUVeeSAe91gH6TFOWCNpjUA1jvQRP7lCJYtY6u03GrCFa7QNXfQBWv1Xegg-7y54FORnsbdTAuHcSyEUI2AzXbU-9DMq9wOOuYnfHwj_fvgwNi3nRUENgX9W-TqA</recordid><startdate>2001</startdate><enddate>2001</enddate><creator>Sudo, Yuichiro</creator><creator>Yajima, Kenji</creator><creator>Mae, Yoshiharu</creator><general>The Japan Institute of Metals and Materials</general><general>Nippon Kinzoku Gakkai</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope></search><sort><creationdate>2001</creationdate><title>Effects of Annealing Temperature on Tensile Property of Recrystallized Commercial Pure Coppers</title><author>Sudo, Yuichiro ; Yajima, Kenji ; Mae, Yoshiharu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c422t-c3679198af0daf752b3433c0109c97b667d1a45412e5b7dd3fd7c13ae9920e7e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>jpn</language><creationdate>2001</creationdate><topic>annealing temperature</topic><topic>electrolytic tough pitch copper</topic><topic>oxygen free copper</topic><topic>phosphorus deoxidized copper</topic><topic>strain hardening exponent</topic><topic>work hardening</topic><topic>workability</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Sudo, Yuichiro</creatorcontrib><creatorcontrib>Yajima, Kenji</creatorcontrib><creatorcontrib>Mae, Yoshiharu</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>Journal of the Japan Institute of Metals and Materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Sudo, Yuichiro</au><au>Yajima, Kenji</au><au>Mae, Yoshiharu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Effects of Annealing Temperature on Tensile Property of Recrystallized Commercial Pure Coppers</atitle><jtitle>Journal of the Japan Institute of Metals and Materials</jtitle><addtitle>J. Japan Inst. Metals and Materials</addtitle><date>2001</date><risdate>2001</risdate><volume>65</volume><issue>3</issue><spage>217</spage><epage>222</epage><pages>217-222</pages><issn>0021-4876</issn><eissn>1880-6880</eissn><coden>NIKGAV</coden><abstract>Recent trends toward smaller diameter in fine copper wire and smaller thickness in rolled copper foil require improvement in workability of materials. Generally, workability can be estimated by the strain hardening exponent obtained from the true stress-true strain curve in the tensile test. In this work, work hardening behavior of three kinds of recrystallized commercial pure coppers was investigated. The effect of the increase in the annealing temperature is summarized as follows. (1) In oxygen free copper, the flow stress increases due to the locking hardening by sulfur, but the strain hardening exponent does not change. (2) In phosphorus deoxidized copper, the flow stress decreases and the strain hardening exponent increases due to phosphorus in the solid solution. (3) In electrolytic tough pitch copper, the flow stress decreases due to the coarsening of Cu2O particles and the strain hardening exponent increases due to oxygen in solid solution. The difference in work hardening behavior between three kinds of commercially pure coppers seems to be brought about by the difference in the interaction between dislocations or stacking faults and atoms of the above trace elements.</abstract><cop>Sendai</cop><pub>The Japan Institute of Metals and Materials</pub><doi>10.2320/jinstmet1952.65.3_217</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record> |
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subjects | annealing temperature electrolytic tough pitch copper oxygen free copper phosphorus deoxidized copper strain hardening exponent work hardening workability |
title | Effects of Annealing Temperature on Tensile Property of Recrystallized Commercial Pure Coppers |
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