CAC58 copper alloy for miniaturized automobile terminals

CAC58 copper alloy for miniaturized automobile terminals

In order to take advantage of the excellent stress relaxation characteristics of Cu-Ni-Sn base alloys such as C72500, a new pseudo-spinodal hardening alloy of Cu-1.5%Sn-0.4%Ni-0.02%P-1.5%Zn, with low Ni and Sn concentrations, has been developed. This alloy has a yield strength of 550 N/mm exp 2 , an...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Kobe Research and Development (Japan) 2001-04, Vol.51 (1), p.25-28
Hauptverfasser: Arai, H, Miyafuji, M
Format: Artikel
Sprache:jpn
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 28
container_issue 1
container_start_page 25
container_title Kobe Research and Development (Japan)
container_volume 51
creator Arai, H
Miyafuji, M
description In order to take advantage of the excellent stress relaxation characteristics of Cu-Ni-Sn base alloys such as C72500, a new pseudo-spinodal hardening alloy of Cu-1.5%Sn-0.4%Ni-0.02%P-1.5%Zn, with low Ni and Sn concentrations, has been developed. This alloy has a yield strength of 550 N/mm exp 2 , an electrical conductivity of 34%IACS, excellent bend formability (180 deg bending at 0 radius), and excellent stress relaxation resistance (170 deg C). Furthermore, because of the addition of Zn, the alloy adheres well to tin-plated layer, making it highly suitable for the small terminals used in the area around automobile engines. Materials studied: CAC58, C51910.
format Article
fullrecord <record><control><sourceid>proquest</sourceid><recordid>TN_cdi_proquest_miscellaneous_26647109</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>26647109</sourcerecordid><originalsourceid>FETCH-LOGICAL-p99t-63f0d1c4a1dc5c0af69533db68fbe9307e7b9721993ef9dbab0cbc3769e5ae2f3</originalsourceid><addsrcrecordid>eNotzLtqwzAUgGENKSSkeQdN3QySTyzpjMGkFwh0yR50OQKBHLmWPLRP30A7fcMP_4btBGjojFFmyw61Jid6raWSQuyYGU_jYLgv80wLtzmXbx7Lwqd0T7atS_qhwO3aylRcysQbLY9kc31mT_EBHf7ds-vr-Tq-d5fPt4_xdOlmxNYpiCJIf7Qy-MELGxUOAMEpEx0hCE3aoe4lIlDE4KwT3nnQCmmw1EfYs5e_7byUr5Vqu02pesrZ3qms9dYrddRSIPwCE5REjA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>26647109</pqid></control><display><type>article</type><title>CAC58 copper alloy for miniaturized automobile terminals</title><source>Open Access Titles of Japan</source><source>EZB-FREE-00999 freely available EZB journals</source><creator>Arai, H ; Miyafuji, M</creator><creatorcontrib>Arai, H ; Miyafuji, M</creatorcontrib><description>In order to take advantage of the excellent stress relaxation characteristics of Cu-Ni-Sn base alloys such as C72500, a new pseudo-spinodal hardening alloy of Cu-1.5%Sn-0.4%Ni-0.02%P-1.5%Zn, with low Ni and Sn concentrations, has been developed. This alloy has a yield strength of 550 N/mm exp 2 , an electrical conductivity of 34%IACS, excellent bend formability (180 deg bending at 0 radius), and excellent stress relaxation resistance (170 deg C). Furthermore, because of the addition of Zn, the alloy adheres well to tin-plated layer, making it highly suitable for the small terminals used in the area around automobile engines. Materials studied: CAC58, C51910.</description><identifier>ISSN: 0373-8868</identifier><language>jpn</language><ispartof>Kobe Research and Development (Japan), 2001-04, Vol.51 (1), p.25-28</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784</link.rule.ids></links><search><creatorcontrib>Arai, H</creatorcontrib><creatorcontrib>Miyafuji, M</creatorcontrib><title>CAC58 copper alloy for miniaturized automobile terminals</title><title>Kobe Research and Development (Japan)</title><description>In order to take advantage of the excellent stress relaxation characteristics of Cu-Ni-Sn base alloys such as C72500, a new pseudo-spinodal hardening alloy of Cu-1.5%Sn-0.4%Ni-0.02%P-1.5%Zn, with low Ni and Sn concentrations, has been developed. This alloy has a yield strength of 550 N/mm exp 2 , an electrical conductivity of 34%IACS, excellent bend formability (180 deg bending at 0 radius), and excellent stress relaxation resistance (170 deg C). Furthermore, because of the addition of Zn, the alloy adheres well to tin-plated layer, making it highly suitable for the small terminals used in the area around automobile engines. Materials studied: CAC58, C51910.</description><issn>0373-8868</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><recordid>eNotzLtqwzAUgGENKSSkeQdN3QySTyzpjMGkFwh0yR50OQKBHLmWPLRP30A7fcMP_4btBGjojFFmyw61Jid6raWSQuyYGU_jYLgv80wLtzmXbx7Lwqd0T7atS_qhwO3aylRcysQbLY9kc31mT_EBHf7ds-vr-Tq-d5fPt4_xdOlmxNYpiCJIf7Qy-MELGxUOAMEpEx0hCE3aoe4lIlDE4KwT3nnQCmmw1EfYs5e_7byUr5Vqu02pesrZ3qms9dYrddRSIPwCE5REjA</recordid><startdate>20010401</startdate><enddate>20010401</enddate><creator>Arai, H</creator><creator>Miyafuji, M</creator><scope>7TB</scope><scope>8BQ</scope><scope>8FD</scope><scope>FR3</scope><scope>H8G</scope><scope>JG9</scope></search><sort><creationdate>20010401</creationdate><title>CAC58 copper alloy for miniaturized automobile terminals</title><author>Arai, H ; Miyafuji, M</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-p99t-63f0d1c4a1dc5c0af69533db68fbe9307e7b9721993ef9dbab0cbc3769e5ae2f3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>jpn</language><creationdate>2001</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Arai, H</creatorcontrib><creatorcontrib>Miyafuji, M</creatorcontrib><collection>Mechanical &amp; Transportation Engineering Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Engineering Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>Kobe Research and Development (Japan)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Arai, H</au><au>Miyafuji, M</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>CAC58 copper alloy for miniaturized automobile terminals</atitle><jtitle>Kobe Research and Development (Japan)</jtitle><date>2001-04-01</date><risdate>2001</risdate><volume>51</volume><issue>1</issue><spage>25</spage><epage>28</epage><pages>25-28</pages><issn>0373-8868</issn><abstract>In order to take advantage of the excellent stress relaxation characteristics of Cu-Ni-Sn base alloys such as C72500, a new pseudo-spinodal hardening alloy of Cu-1.5%Sn-0.4%Ni-0.02%P-1.5%Zn, with low Ni and Sn concentrations, has been developed. This alloy has a yield strength of 550 N/mm exp 2 , an electrical conductivity of 34%IACS, excellent bend formability (180 deg bending at 0 radius), and excellent stress relaxation resistance (170 deg C). Furthermore, because of the addition of Zn, the alloy adheres well to tin-plated layer, making it highly suitable for the small terminals used in the area around automobile engines. Materials studied: CAC58, C51910.</abstract><tpages>4</tpages></addata></record>
fulltext fulltext
identifier ISSN: 0373-8868
ispartof Kobe Research and Development (Japan), 2001-04, Vol.51 (1), p.25-28
issn 0373-8868
language jpn
recordid cdi_proquest_miscellaneous_26647109
source Open Access Titles of Japan; EZB-FREE-00999 freely available EZB journals
title CAC58 copper alloy for miniaturized automobile terminals
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T13%3A36%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=CAC58%20copper%20alloy%20for%20miniaturized%20automobile%20terminals&rft.jtitle=Kobe%20Research%20and%20Development%20(Japan)&rft.au=Arai,%20H&rft.date=2001-04-01&rft.volume=51&rft.issue=1&rft.spage=25&rft.epage=28&rft.pages=25-28&rft.issn=0373-8868&rft_id=info:doi/&rft_dat=%3Cproquest%3E26647109%3C/proquest%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=26647109&rft_id=info:pmid/&rfr_iscdi=true