Water-Quench Thermal Shock Testing for Ceramic Disks

Thermal shock fracture testing was performed on both alumina and silicon nitride by water-quenching method. Disk-shaped specimens in this study were preferred because of their easier processing and smaller volume as composed to the pencil-shaped specimen recommended by JIS. Thermal stress in the spe...

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Veröffentlicht in:Journal of the Ceramic Society of Japan 2000/02/01, Vol.108(1254), pp.166-171
Hauptverfasser: HONDA, Sawao, HAYAKAWA, Shuhei, NISHIKAWA, Tadahiro, AWAJI, Hideo
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container_end_page 171
container_issue 1254
container_start_page 166
container_title Journal of the Ceramic Society of Japan
container_volume 108
creator HONDA, Sawao
HAYAKAWA, Shuhei
NISHIKAWA, Tadahiro
AWAJI, Hideo
description Thermal shock fracture testing was performed on both alumina and silicon nitride by water-quenching method. Disk-shaped specimens in this study were preferred because of their easier processing and smaller volume as composed to the pencil-shaped specimen recommended by JIS. Thermal stress in the specimen during quenching was calculated by numerical analysis in order to evaluate the critical temperature difference, Δθc. The heat transfer coefficient of water was previously measured on a Ni-specimen under experimental conditions similar to the present thermal shock test. Observed values of Δθc agreed well with the calculated values for alumina, but disagreed by about 150K in silicon nitride.
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subjects Ceramic disk
Critical temperature difference
Heat transfer coefficient
Thermal shock test
Thermal stress
Water-quenching
title Water-Quench Thermal Shock Testing for Ceramic Disks
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