AlSiV and AlSiVPd films as alternatives for AlSiCu interconnect: microstructure and its impact on reliability

In this paper new data on highly reliable interconnect materials based on aluminium will be presented. Compared with AlSiCu alloy films, alternative alloys such as AlSiV and AlSiVPd combine excellent plasma etchability with good corrosion resistance. Addition of V to AlSi increases the elect...

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Veröffentlicht in:	Thin solid films 1994-01, Vol.246 (1), p.164-171
Hauptverfasser:	Dirks, A.G., Augur, R.A., De Veirman, A.E.M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Physics Structure and morphology thickness Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film structure and morphology
Online-Zugang:	Volltext
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