Recent Structural Engineering of Polymer Semiconductors Incorporating Hydrogen Bonds

Highly planar, extended π‐electron organic conjugated polymers have been increasingly attractive for achieving high‐mobility organic semiconductors. In addition to the conventional strategy to construct rigid backbone by covalent bonds, hydrogen bond has been employed extensively to increase the planarity and rigidity of polymer via intramolecular noncovalent interactions. This review provides a general summary of high‐mobility semiconducting polymers incorporating hydrogen bonds in field‐effect transistors over recent years. The structural engineering of the hydrogen bond‐containing building blocks and the discussion of theoretical simulation, microstructural characterization, and device performance are covered. Additionally, the effects of the introduction of hydrogen bond on self‐healing, stretchability, chemical sensitivity, and mechanical properties are also discussed. The review aims to help and inspire design of new high‐mobility conjugated polymers with superiority of mechanical flexibility by incorporation of hydrogen bond for the application in flexible electronics. The incorporation of hydrogen bonds can enhance the planarity and rigidity of polymer semiconductors via noncovalent interactions, improve the charge transport, and offer polymers unique superiority of mechanical flexibility. This review describes the recent structural evolution of polymer semiconductors containing hydrogen bonds and the effect of hydrogen bonds on carrier mobility, self‐healing, chemical sensitivity, and mechanical properties.