Question marks to the extrapolation to lower temperatures in high temperature storage life (HTSL) testing in plastic encapsulated IC'S

A model has been constructed to describe ball-bond corrosion in HTSL stress testing. In this model ion-mobility has been believed to be the rate determining step and has been found to be non-linear for the anti-popcorn plastic. In HTSL testing an Arrhenius type extrapolation of the mean-time to fail...

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Veröffentlicht in:	Microelectronics and reliability 1996-11, Vol.36 (11-12), p.1935-1938
Hauptverfasser:	Schuddeboom, W., Wobbenhorst, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology Testing, measurement, noise and reliability
Online-Zugang:	Volltext
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