New assembling technique for BGA packages without thermal processes
A new assembling technique for flip-chip mounting without heating processes was developed. The proposed construction is an FR4 substrate with ring shaped connectors. It is a typical flip-chip technology. The chip is placed, with its active part face-down, directly on to the connecting areas of the s...
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| Veröffentlicht in: | Microelectronics and reliability 2001-04, Vol.41 (4), p.611-615 |
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| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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