New assembling technique for BGA packages without thermal processes

New assembling technique for BGA packages without thermal processes

A new assembling technique for flip-chip mounting without heating processes was developed. The proposed construction is an FR4 substrate with ring shaped connectors. It is a typical flip-chip technology. The chip is placed, with its active part face-down, directly on to the connecting areas of the s...

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Veröffentlicht in:Microelectronics and reliability 2001-04, Vol.41 (4), p.611-615
Hauptverfasser: Videkov, Valentin, Tzanova, Slavka, Arnaudov, Radosvet, Iordanov, Nikolai
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container_end_page 615
container_issue 4
container_start_page 611
container_title Microelectronics and reliability
container_volume 41
creator Videkov, Valentin
Tzanova, Slavka
Arnaudov, Radosvet
Iordanov, Nikolai
description A new assembling technique for flip-chip mounting without heating processes was developed. The proposed construction is an FR4 substrate with ring shaped connectors. It is a typical flip-chip technology. The chip is placed, with its active part face-down, directly on to the connecting areas of the substrate. The electrical connection is obtained through a mechanical contact between the ring-shaped clips and the chip bumps. The main advantage of the ring-clip-bump attachment technique is the possibility for multi-chip modules repairing without thermal processes. It is a lead-free assembling technology involving only “conventional” processes.
doi_str_mv 10.1016/S0026-2714(00)00257-2
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title New assembling technique for BGA packages without thermal processes
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