Pulsed electrodeposition of copper/nickel multilayers on a rotating disk electrode. I: Galvanostatic deposition

Thin Cu/Ni multilayers were deposited on a rotating disk electrode by square-wave galvanostatic pulses in one-third and full strength Watts nickel baths with 50 to 1000 ppm Cu exp 2+ . A theoretical model was developed to predict the copper content in the Ni layer. Factors affecting the deposition w...

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Veröffentlicht in:	Journal of the Electrochemical Society 1995-09, Vol.142 (9), p.3034-3040
Hauptverfasser:	CHUN-CHEN YANG, CHEH, H. Y
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Sprache:	eng
Schlagworte:	Chemistry Electrochemistry Electrodeposition Exact sciences and technology General and physical chemistry Study of interfaces
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description	Thin Cu/Ni multilayers were deposited on a rotating disk electrode by square-wave galvanostatic pulses in one-third and full strength Watts nickel baths with 50 to 1000 ppm Cu exp 2+ . A theoretical model was developed to predict the copper content in the Ni layer. Factors affecting the deposition which include the mass-transfer rate, Cu ion concentration, temperature, and applied current density were studied. The Cu content in the Ni layer was analyzed experimentally by x-ray diffraction and potentiodynamic stripping. Theoretical predictions are in good agreement with experimental results.
doi_str_mv	10.1149/1.2048681
format	Article
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Theoretical predictions are in good agreement with experimental results.</description><identifier>ISSN: 0013-4651</identifier><identifier>EISSN: 1945-7111</identifier><identifier>DOI: 10.1149/1.2048681</identifier><identifier>CODEN: JESOAN</identifier><language>eng</language><publisher>Pennington, NJ: Electrochemical Society</publisher><subject>Chemistry ; Electrochemistry ; Electrodeposition ; Exact sciences and technology ; General and physical chemistry ; Study of interfaces</subject><ispartof>Journal of the Electrochemical Society, 1995-09, Vol.142 (9), p.3034-3040</ispartof><rights>1995 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c202t-2959a6982f6ab19ef253880f711592c187153a42109927a0b37d059c3e47fe2b3</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,27924,27925</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=3656313$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>CHUN-CHEN YANG</creatorcontrib><creatorcontrib>CHEH, H. 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Theoretical predictions are in good agreement with experimental results.</description><subject>Chemistry</subject><subject>Electrochemistry</subject><subject>Electrodeposition</subject><subject>Exact sciences and technology</subject><subject>General and physical chemistry</subject><subject>Study of interfaces</subject><issn>0013-4651</issn><issn>1945-7111</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1995</creationdate><recordtype>article</recordtype><recordid>eNpFkE1LAzEQhoMoWKsH_0EOInjYNpOP3Y03KVoLBT3oeclmE4lNN2uyK_Tfu6XFnoZhnnmGeRG6BTID4HIOM0p4mZdwhiYgucgKADhHE0KAZTwXcImuUvoeWyh5MUHhffDJNNh4o_sYGtOF5HoXWhws1qHrTJy3Tm-Mx9vB986rnYkJj3OFY-hV79ov3Li0ORlmePWIl8r_qjakPaHxSXuNLqwaL94c6xR9vjx_LF6z9dtytXhaZ5oS2mdUCqlyWVKbqxqksVSwsiR2_EZIqqEsQDDFKRApaaFIzYqGCKmZ4YU1tGZTdH_wdjH8DCb11dYlbbxXrQlDqqiQRHJZjODDAdQxpBSNrbrotiruKiDVPtIKqmOkI3t3lKqklbdRtdql_wWWi5wBY39K_nXA</recordid><startdate>19950901</startdate><enddate>19950901</enddate><creator>CHUN-CHEN YANG</creator><creator>CHEH, H. 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Theoretical predictions are in good agreement with experimental results.</abstract><cop>Pennington, NJ</cop><pub>Electrochemical Society</pub><doi>10.1149/1.2048681</doi><tpages>7</tpages></addata></record>
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subjects	Chemistry Electrochemistry Electrodeposition Exact sciences and technology General and physical chemistry Study of interfaces
title	Pulsed electrodeposition of copper/nickel multilayers on a rotating disk electrode. I: Galvanostatic deposition
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