Spectroscopic studies of the chemical properties of thin metal films on poly(ether imide)
X-ray photoelectron spectroscopy studies were conducted on thin films of copper and nichrome (80:20 Ni:Cr) on neat poly(ether imide) (PEI) substrates. Evaporated copper thin films reacted mildly with PEI and formed metal carbides and oxides at the copper - PEI interface. In contrast, the chromium co...
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Veröffentlicht in: | Thin solid films 1992-11, Vol.220 (1), p.217-221 |
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creator | Lynn Davis, J. Williams, Melanie Kevin Arledge, J. Swirbel, Tom |
description | X-ray photoelectron spectroscopy studies were conducted on thin films of copper and nichrome (80:20 Ni:Cr) on neat poly(ether imide) (PEI) substrates. Evaporated copper thin films reacted mildly with PEI and formed metal carbides and oxides at the copper - PEI interface. In contrast, the chromium component of the nichrome alloy reacted strongly with PEI to generate a distribution of chromium oxides, nitrides, and carbides. However, the nickel component of nichrome exhibited little reactivity with the resin. Differences in the reactivities of metal thin films on PEI can be correlated to the heats of formation of the corresponding metal carbides, oxides, and nitrides. This information provides key insights into metals for use as adhesion promoters on printed circuit boards and molded circuits containing PEI. |
doi_str_mv | 10.1016/0040-6090(92)90575-V |
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Evaporated copper thin films reacted mildly with PEI and formed metal carbides and oxides at the copper - PEI interface. In contrast, the chromium component of the nichrome alloy reacted strongly with PEI to generate a distribution of chromium oxides, nitrides, and carbides. However, the nickel component of nichrome exhibited little reactivity with the resin. Differences in the reactivities of metal thin films on PEI can be correlated to the heats of formation of the corresponding metal carbides, oxides, and nitrides. This information provides key insights into metals for use as adhesion promoters on printed circuit boards and molded circuits containing PEI.</description><identifier>ISSN: 0040-6090</identifier><identifier>EISSN: 1879-2731</identifier><identifier>DOI: 10.1016/0040-6090(92)90575-V</identifier><identifier>CODEN: THSFAP</identifier><language>eng</language><publisher>Lausanne: Elsevier B.V</publisher><subject>Applied sciences ; Condensed matter: structure, mechanical and thermal properties ; Exact sciences and technology ; Metals. 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Evaporated copper thin films reacted mildly with PEI and formed metal carbides and oxides at the copper - PEI interface. In contrast, the chromium component of the nichrome alloy reacted strongly with PEI to generate a distribution of chromium oxides, nitrides, and carbides. However, the nickel component of nichrome exhibited little reactivity with the resin. Differences in the reactivities of metal thin films on PEI can be correlated to the heats of formation of the corresponding metal carbides, oxides, and nitrides. This information provides key insights into metals for use as adhesion promoters on printed circuit boards and molded circuits containing PEI.</description><subject>Applied sciences</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Exact sciences and technology</subject><subject>Metals. Metallurgy</subject><subject>Physics</subject><subject>Solid surfaces and solid-solid interfaces</subject><subject>Surface structure and topography</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><issn>0040-6090</issn><issn>1879-2731</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1992</creationdate><recordtype>article</recordtype><recordid>eNqFkU1LAzEQhoMoWKv_wMMeROxhNcnmY3MRpPgFBQ9qwVNIsxMa2S-TrdB_b2pLj3oayDzvzPAEoXOCrwkm4gZjhnOBFb5SdKIwlzyfH6ARKaXKqSzIIRrtkWN0EuMnxphQWozQx2sPdghdtF3vbRaHVeUhZp3LhiVkdgmNt6bO-tD1EIZ9y7dZA0NqOF836a3N-q5eX0EKhcw3voLJKTpypo5wtqtj9P5w_zZ9ymcvj8_Tu1luC8WHXKrKcAyKcUk5UQusLHcCy8pQtih4JZwwZkEIo6SScuEIsdRyKpWwzIEQxRhdbuemG79WEAfd-Gihrk0L3SpqypOGJOVfkAgmpBRlAtkWtMlLDOB0H3xjwloTrDfC9cam3tjUiupf4XqeYhe7-SYmZy6Y1vq4zzJWyrLECbvdYpCkfHsIOloPrYXKh_QVuur833t-AOi4lCY</recordid><startdate>19921120</startdate><enddate>19921120</enddate><creator>Lynn Davis, J.</creator><creator>Williams, Melanie</creator><creator>Kevin Arledge, J.</creator><creator>Swirbel, Tom</creator><general>Elsevier B.V</general><general>Elsevier Science</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8BQ</scope><scope>8FD</scope><scope>H8G</scope><scope>JG9</scope></search><sort><creationdate>19921120</creationdate><title>Spectroscopic studies of the chemical properties of thin metal films on poly(ether imide)</title><author>Lynn Davis, J. ; Williams, Melanie ; Kevin Arledge, J. ; Swirbel, Tom</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c395t-79da50e94572519b09c5f607da24b35d6f6aab11421d77bf11c2c52796c4fe663</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1992</creationdate><topic>Applied sciences</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Exact sciences and technology</topic><topic>Metals. Metallurgy</topic><topic>Physics</topic><topic>Solid surfaces and solid-solid interfaces</topic><topic>Surface structure and topography</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lynn Davis, J.</creatorcontrib><creatorcontrib>Williams, Melanie</creatorcontrib><creatorcontrib>Kevin Arledge, J.</creatorcontrib><creatorcontrib>Swirbel, Tom</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><jtitle>Thin solid films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lynn Davis, J.</au><au>Williams, Melanie</au><au>Kevin Arledge, J.</au><au>Swirbel, Tom</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Spectroscopic studies of the chemical properties of thin metal films on poly(ether imide)</atitle><jtitle>Thin solid films</jtitle><date>1992-11-20</date><risdate>1992</risdate><volume>220</volume><issue>1</issue><spage>217</spage><epage>221</epage><pages>217-221</pages><issn>0040-6090</issn><eissn>1879-2731</eissn><coden>THSFAP</coden><abstract>X-ray photoelectron spectroscopy studies were conducted on thin films of copper and nichrome (80:20 Ni:Cr) on neat poly(ether imide) (PEI) substrates. Evaporated copper thin films reacted mildly with PEI and formed metal carbides and oxides at the copper - PEI interface. In contrast, the chromium component of the nichrome alloy reacted strongly with PEI to generate a distribution of chromium oxides, nitrides, and carbides. However, the nickel component of nichrome exhibited little reactivity with the resin. Differences in the reactivities of metal thin films on PEI can be correlated to the heats of formation of the corresponding metal carbides, oxides, and nitrides. This information provides key insights into metals for use as adhesion promoters on printed circuit boards and molded circuits containing PEI.</abstract><cop>Lausanne</cop><pub>Elsevier B.V</pub><doi>10.1016/0040-6090(92)90575-V</doi><tpages>5</tpages></addata></record> |
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subjects | Applied sciences Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Metals. Metallurgy Physics Solid surfaces and solid-solid interfaces Surface structure and topography Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) |
title | Spectroscopic studies of the chemical properties of thin metal films on poly(ether imide) |
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