Joint Mechanism of Press-Soldered Joints in Copper to Copper
Copper to Cu lap joint was made by resistance heating, applying pressure simultaneously. The Cu plate was pre-soldered and the alloyed layer was pre-formed by using Pb--50Sn solder. Then the joint mechanism of press-soldered joints was analyzed. The reason of enhancing strength and heat resistance h...
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| Veröffentlicht in: | Yōsetsu Gakkai ronbunshū 1992-08, Vol.10 (3), p.21-26 |
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| Sprache: | eng ; jpn |
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| container_title | Yōsetsu Gakkai ronbunshū |
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| creator | Haramaki, T Nakamura, M |
| description | Copper to Cu lap joint was made by resistance heating, applying pressure simultaneously. The Cu plate was pre-soldered and the alloyed layer was pre-formed by using Pb--50Sn solder. Then the joint mechanism of press-soldered joints was analyzed. The reason of enhancing strength and heat resistance heated by applying voltage in press-soldered joints is summarized as follows. (1) Solder composition turns to Cu--Sn alloy composition. (2) Joint layer with higher melting point was formed in which Cu increases and Sn decreases. (3) In terms of the crystal structure, Cu sub 3 Sn, Cu sub 6 Sn sub 5 , and Cu( alpha ) phases turn into Cu sub 41 Sn sub 11 and Cu( alpha ) phases which have high heat resistance. |
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The Cu plate was pre-soldered and the alloyed layer was pre-formed by using Pb--50Sn solder. Then the joint mechanism of press-soldered joints was analyzed. The reason of enhancing strength and heat resistance heated by applying voltage in press-soldered joints is summarized as follows. (1) Solder composition turns to Cu--Sn alloy composition. (2) Joint layer with higher melting point was formed in which Cu increases and Sn decreases. 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The Cu plate was pre-soldered and the alloyed layer was pre-formed by using Pb--50Sn solder. Then the joint mechanism of press-soldered joints was analyzed. The reason of enhancing strength and heat resistance heated by applying voltage in press-soldered joints is summarized as follows. (1) Solder composition turns to Cu--Sn alloy composition. (2) Joint layer with higher melting point was formed in which Cu increases and Sn decreases. (3) In terms of the crystal structure, Cu sub 3 Sn, Cu sub 6 Sn sub 5 , and Cu( alpha ) phases turn into Cu sub 41 Sn sub 11 and Cu( alpha ) phases which have high heat resistance.</abstract><tpages>6</tpages></addata></record> |
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| identifier | ISSN: 0288-4771 |
| ispartof | Yōsetsu Gakkai ronbunshū, 1992-08, Vol.10 (3), p.21-26 |
| issn | 0288-4771 |
| language | eng ; jpn |
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| source | Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals; J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese |
| title | Joint Mechanism of Press-Soldered Joints in Copper to Copper |
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