The effect of metal surface passivation on the Au-InP interaction

The effect of SiO2 encapsulation on reaction rates in the Au-InP system was studied. Scanning electron microscopy and x-ray photoelectron spectroscopy were used to investigate surface and/or interface morphologies and in-depth compositional profiles. It was found that the rate of dissolution of InP...

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Veröffentlicht in:	Journal of applied physics 1989-03, Vol.65 (5), p.2111-2115
Hauptverfasser:	Fatemi, Navid S., Weizer, Victor G.
Format:	Artikel
Sprache:	eng
Schlagworte:	Analysing. Testing. Standards Applied sciences Condensed matter: structure, mechanical and thermal properties Cross-disciplinary physics: materials science rheology Electronics And Electrical Engineering Exact sciences and technology Materials science Measurement of properties and materials state Metals, semimetals and alloys Metals. Metallurgy Nondestructive testing Physics Solid surfaces and solid-solid interfaces Specific materials Surface structure and topography Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
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