Thermal Visualization of Buried Interfaces Enabled by Ratio Signal and Steady-State Heating of Time-Domain Thermoreflectance

Thermal resistances from interfaces impede heat dissipation in micro/nanoscale electronics, especially for high-power electronics. Despite the growing importance of understanding interfacial thermal transport, advanced thermal characterization techniques that can visualize thermal conductance across...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	ACS applied materials & interfaces 2021-07, Vol.13 (27), p.31843-31851
Hauptverfasser:	Cheng, Zhe, Mu, Fengwen, Ji, Xiaoyang, You, Tiangui, Xu, Wenhui, Suga, Tadatomo, Ou, Xin, Cahill, David G, Graham, Samuel
Format:	Artikel
Sprache:	eng
Schlagworte:	Functional Inorganic Materials and Devices
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!