Retardation of grain boundary reactions in Ag-Pd-Cu alloys by additions of small amounts of other elements
The grain-boundary reactions in Ag--25 mass% Pd--10 mass% Cu alloys with 1 mass% Al, cobalt, Sn, Cr or indium, were investigated by optical microscopy, electrical resistivity, and hardness tests. Addition of Sn and Cr retarded grain-boundary reactions. The growth rate of nodules with Sn addition was...
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Veröffentlicht in: | Journal of materials science 1991-02, Vol.26 (4), p.1113-1118 |
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Sprache: | eng |
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