Retardation of grain boundary reactions in Ag-Pd-Cu alloys by additions of small amounts of other elements

The grain-boundary reactions in Ag--25 mass% Pd--10 mass% Cu alloys with 1 mass% Al, cobalt, Sn, Cr or indium, were investigated by optical microscopy, electrical resistivity, and hardness tests. Addition of Sn and Cr retarded grain-boundary reactions. The growth rate of nodules with Sn addition was...

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Veröffentlicht in:Journal of materials science 1991-02, Vol.26 (4), p.1113-1118
Hauptverfasser: KAWASHIMA, I, ARAKI, Y, OHNO, H
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Sprache:eng
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