New 3D digitizer by cutting and scanning layer-by-layer
A crucial element in the reverse engineering process is to obtain 3D data of the part or its CAD model. A new method is presented in this paper, which combines layer-by-layer cutting and scanning on each cross-section of a part with a milling machine and an image scanner respectively. The method can...
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| Veröffentlicht in: | CHIN J LASERS B 1999-04, Vol.B8 (2), p.183-187 |
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| Sprache: | eng |
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| container_end_page | 187 |
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| container_issue | 2 |
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| container_title | CHIN J LASERS B |
| container_volume | B8 |
| creator | Zhou, Jian Yang, Yuxiao Zhao, Mingtao Tan, Yushan |
| description | A crucial element in the reverse engineering process is to obtain 3D data of the part or its CAD model. A new method is presented in this paper, which combines layer-by-layer cutting and scanning on each cross-section of a part with a milling machine and an image scanner respectively. The method can capture the internal and external profile information of a complex-shaped part at the same precision simultaneously. When data files of 2D edges are imported into the 3D CAD/CAM package, the 3D data or 3D CAD model is acquired. According to the customers' requirements, the system can reach an accuracy of 5.4 mu m, and a resolution of 2.7 mu m in obtaining the 2D edges, and layer thicknesses range from 0.001 mm to 1 mm. The principle of the digitizer is described and the experimental results are presented. |
| format | Article |
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| identifier | ISSN: 1004-2822 |
| ispartof | CHIN J LASERS B, 1999-04, Vol.B8 (2), p.183-187 |
| issn | 1004-2822 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_25033066 |
| source | Alma/SFX Local Collection |
| title | New 3D digitizer by cutting and scanning layer-by-layer |
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