Platinum wire wedge bonding: a new IC and microsensor interconnect

We describe a new means of making electrical connections between die and chip header. Interconnects are made by using a conventional wire bonder to ultrasonically wedge bond 0.032 mm diameter Pt wires to both Pt and Al thin films. Interconnects made in this manner are remarkably strong. Electrical m...

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Veröffentlicht in:	Journal of electronic materials 1988-07, Vol.17 (4), p.285-289
Hauptverfasser:	MANTESE, J. V, ALCINI, W. V
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Electronics Exact sciences and technology Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
Online-Zugang:	Volltext
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