Platinum wire wedge bonding: a new IC and microsensor interconnect
We describe a new means of making electrical connections between die and chip header. Interconnects are made by using a conventional wire bonder to ultrasonically wedge bond 0.032 mm diameter Pt wires to both Pt and Al thin films. Interconnects made in this manner are remarkably strong. Electrical m...
Gespeichert in:
| Veröffentlicht in: | Journal of electronic materials 1988-07, Vol.17 (4), p.285-289 |
|---|---|
| Hauptverfasser: | , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 289 |
|---|---|
| container_issue | 4 |
| container_start_page | 285 |
| container_title | Journal of electronic materials |
| container_volume | 17 |
| creator | MANTESE, J. V ALCINI, W. V |
| description | We describe a new means of making electrical connections between die and chip header. Interconnects are made by using a conventional wire bonder to ultrasonically wedge bond 0.032 mm diameter Pt wires to both Pt and Al thin films. Interconnects made in this manner are remarkably strong. Electrical measurements show contact resistances of less than or equal to 0.05 Omega . Annealing tests show that bonds made to thin metal films of Pt on Ti on sapphire show no appreciable signs of electrical or mechanical degradation after anneals at 900 degree C for 1 h in pure oxygen. |
| doi_str_mv | 10.1007/BF02652107 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_24961952</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>24952844</sourcerecordid><originalsourceid>FETCH-LOGICAL-c322t-7e3137aefb501fcfed034cce2dd55c3091013a58aff1f8c48272fc368d035db43</originalsourceid><addsrcrecordid>eNqNkEFLwzAYhoMoOKcXf0EO4kGo5kuaNvXmhtPBQA8K3kqWfBmRNp1JR_Hfu7GhV0_v5XkfeF9CLoHdAmPl3WTGeCE5sPKIjEDmIgNVfByTERMFZJILeUrOUvpkDCQoGJHJa6N7HzYtHXxEOqBdIV12wfqwuqeaBhzofEp1sLT1JnYJQ-oi9aHHaLoQ0PTn5MTpJuHFIcfkffb4Nn3OFi9P8-nDIjOC8z4rUYAoNbqlZOCMQ8tEbgxya6U0glXAQGiptHPglMkVL7kzolBbTtplLsbkeu9dx-5rg6mvW58MNo0O2G1SzfOqgGq78R-g5CrfGW_24G5YiujqdfStjt81sHr3Z_335xa-Olh1MrpxUQfj02-jFEUFSokfREpzmQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>24952844</pqid></control><display><type>article</type><title>Platinum wire wedge bonding: a new IC and microsensor interconnect</title><source>SpringerLink Journals - AutoHoldings</source><creator>MANTESE, J. V ; ALCINI, W. V</creator><creatorcontrib>MANTESE, J. V ; ALCINI, W. V</creatorcontrib><description>We describe a new means of making electrical connections between die and chip header. Interconnects are made by using a conventional wire bonder to ultrasonically wedge bond 0.032 mm diameter Pt wires to both Pt and Al thin films. Interconnects made in this manner are remarkably strong. Electrical measurements show contact resistances of less than or equal to 0.05 Omega . Annealing tests show that bonds made to thin metal films of Pt on Ti on sapphire show no appreciable signs of electrical or mechanical degradation after anneals at 900 degree C for 1 h in pure oxygen.</description><identifier>ISSN: 0361-5235</identifier><identifier>EISSN: 1543-186X</identifier><identifier>DOI: 10.1007/BF02652107</identifier><identifier>CODEN: JECMA5</identifier><language>eng</language><publisher>New York, NY: Institute of Electrical and Electronics Engineers</publisher><subject>Applied sciences ; Electronics ; Exact sciences and technology ; Integrated circuits ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><ispartof>Journal of electronic materials, 1988-07, Vol.17 (4), p.285-289</ispartof><rights>1989 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c322t-7e3137aefb501fcfed034cce2dd55c3091013a58aff1f8c48272fc368d035db43</citedby><cites>FETCH-LOGICAL-c322t-7e3137aefb501fcfed034cce2dd55c3091013a58aff1f8c48272fc368d035db43</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,777,781,27905,27906</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=7369188$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>MANTESE, J. V</creatorcontrib><creatorcontrib>ALCINI, W. V</creatorcontrib><title>Platinum wire wedge bonding: a new IC and microsensor interconnect</title><title>Journal of electronic materials</title><description>We describe a new means of making electrical connections between die and chip header. Interconnects are made by using a conventional wire bonder to ultrasonically wedge bond 0.032 mm diameter Pt wires to both Pt and Al thin films. Interconnects made in this manner are remarkably strong. Electrical measurements show contact resistances of less than or equal to 0.05 Omega . Annealing tests show that bonds made to thin metal films of Pt on Ti on sapphire show no appreciable signs of electrical or mechanical degradation after anneals at 900 degree C for 1 h in pure oxygen.</description><subject>Applied sciences</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Integrated circuits</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><issn>0361-5235</issn><issn>1543-186X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1988</creationdate><recordtype>article</recordtype><recordid>eNqNkEFLwzAYhoMoOKcXf0EO4kGo5kuaNvXmhtPBQA8K3kqWfBmRNp1JR_Hfu7GhV0_v5XkfeF9CLoHdAmPl3WTGeCE5sPKIjEDmIgNVfByTERMFZJILeUrOUvpkDCQoGJHJa6N7HzYtHXxEOqBdIV12wfqwuqeaBhzofEp1sLT1JnYJQ-oi9aHHaLoQ0PTn5MTpJuHFIcfkffb4Nn3OFi9P8-nDIjOC8z4rUYAoNbqlZOCMQ8tEbgxya6U0glXAQGiptHPglMkVL7kzolBbTtplLsbkeu9dx-5rg6mvW58MNo0O2G1SzfOqgGq78R-g5CrfGW_24G5YiujqdfStjt81sHr3Z_335xa-Olh1MrpxUQfj02-jFEUFSokfREpzmQ</recordid><startdate>19880701</startdate><enddate>19880701</enddate><creator>MANTESE, J. V</creator><creator>ALCINI, W. V</creator><general>Institute of Electrical and Electronics Engineers</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><scope>7QF</scope><scope>8BQ</scope><scope>JG9</scope></search><sort><creationdate>19880701</creationdate><title>Platinum wire wedge bonding: a new IC and microsensor interconnect</title><author>MANTESE, J. V ; ALCINI, W. V</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c322t-7e3137aefb501fcfed034cce2dd55c3091013a58aff1f8c48272fc368d035db43</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1988</creationdate><topic>Applied sciences</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Integrated circuits</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>MANTESE, J. V</creatorcontrib><creatorcontrib>ALCINI, W. V</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Aluminium Industry Abstracts</collection><collection>METADEX</collection><collection>Materials Research Database</collection><jtitle>Journal of electronic materials</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>MANTESE, J. V</au><au>ALCINI, W. V</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Platinum wire wedge bonding: a new IC and microsensor interconnect</atitle><jtitle>Journal of electronic materials</jtitle><date>1988-07-01</date><risdate>1988</risdate><volume>17</volume><issue>4</issue><spage>285</spage><epage>289</epage><pages>285-289</pages><issn>0361-5235</issn><eissn>1543-186X</eissn><coden>JECMA5</coden><abstract>We describe a new means of making electrical connections between die and chip header. Interconnects are made by using a conventional wire bonder to ultrasonically wedge bond 0.032 mm diameter Pt wires to both Pt and Al thin films. Interconnects made in this manner are remarkably strong. Electrical measurements show contact resistances of less than or equal to 0.05 Omega . Annealing tests show that bonds made to thin metal films of Pt on Ti on sapphire show no appreciable signs of electrical or mechanical degradation after anneals at 900 degree C for 1 h in pure oxygen.</abstract><cop>New York, NY</cop><pub>Institute of Electrical and Electronics Engineers</pub><doi>10.1007/BF02652107</doi><tpages>5</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0361-5235 |
| ispartof | Journal of electronic materials, 1988-07, Vol.17 (4), p.285-289 |
| issn | 0361-5235 1543-186X |
| language | eng |
| recordid | cdi_proquest_miscellaneous_24961952 |
| source | SpringerLink Journals - AutoHoldings |
| subjects | Applied sciences Electronics Exact sciences and technology Integrated circuits Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
| title | Platinum wire wedge bonding: a new IC and microsensor interconnect |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-18T02%3A27%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Platinum%20wire%20wedge%20bonding:%20a%20new%20IC%20and%20microsensor%20interconnect&rft.jtitle=Journal%20of%20electronic%20materials&rft.au=MANTESE,%20J.%20V&rft.date=1988-07-01&rft.volume=17&rft.issue=4&rft.spage=285&rft.epage=289&rft.pages=285-289&rft.issn=0361-5235&rft.eissn=1543-186X&rft.coden=JECMA5&rft_id=info:doi/10.1007/BF02652107&rft_dat=%3Cproquest_cross%3E24952844%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=24952844&rft_id=info:pmid/&rfr_iscdi=true |