Copper electrodeposition studies with a reciprocating paddle

Electroplating processes usually are limited by diffusion of the active species to the cathode. Agitation techniques increase mass transfer and thus, the rate of deposition by reducing the diffusion layer thickness. Agitation is performed either by movement of the cathode or the plating solution. A...

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Veröffentlicht in:	Journal of the Electrochemical Society 1988-11, Vol.135 (11), p.2777-2780
Hauptverfasser:	RICE, D. E, SUNDSTROM, D, MCEACHERN, M. F, KLUMB, L. A, TALBOT, J. B
Format:	Artikel
Sprache:	eng
Schlagworte:	Adsorption Chemistry Electrochemistry Electrodeposition Exact sciences and technology General and physical chemistry Study of interfaces Transport phenomena
Online-Zugang:	Volltext
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