Re-examination of the relationship between packing coefficient and thermal expansion coefficient for aromatic polyimides

The existence of a possible relationship between molecular packing coefficient and thermal expansion coefficient for various aromatic polyimides was investigated. Rod-like low-thermal-expansion polyimides without side groups were seen to have very high packing coefficients, pointing to free volume a...

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Veröffentlicht in:	Polymer (Guilford) 1987-12, Vol.28 (13), p.2282-2288
Hauptverfasser:	Numata, Shunichi, Fujisaki, Koji, Kinjo, Noriyuki
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences density Exact sciences and technology low thermal expansion coefficient Organic polymers packing coefficient Physicochemistry of polymers polyimide Properties and characterization rod-like structure Thermal and thermodynamic properties thermal expansion
Online-Zugang:	Volltext
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