Low-temperature silicon epitaxy by ultrahigh vacuum/chemical vapor deposition

Low-temperature silicon epitaxy by ultrahigh vacuum/chemical vapor deposition

We have successfully demonstrated the use of a novel chemical vapor deposition technique, ultrahigh vacuum/chemical vapor deposition, to deposit homoepitaxial silicon layers of high crystalline perfection at low temperatures (T≥750 °C). Rutherford backscattering and transmission electron microscopy...

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Veröffentlicht in:Applied physics letters 1986-03, Vol.48 (12), p.797-799
1. Verfasser: MEYERSON, B. S
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Sprache:eng
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Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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container_title Applied physics letters
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creator MEYERSON, B. S
description We have successfully demonstrated the use of a novel chemical vapor deposition technique, ultrahigh vacuum/chemical vapor deposition, to deposit homoepitaxial silicon layers of high crystalline perfection at low temperatures (T≥750 °C). Rutherford backscattering and transmission electron microscopy showed the transition to epitaxial silicon growth took place in the range 700–750 °C, and secondary ion mass spectrometry showed typical oxygen and carbon levels to be near the detection limits of the technique 1016–1017 cm−3. In addition, abrupt dopant transitions have been demonstrated, with B levels dropping four orders of magnitude, 1019–1015 B/cm3, in the first 1000 angstroms of an intrinsic epilayer.
doi_str_mv 10.1063/1.96673
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subjects Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title Low-temperature silicon epitaxy by ultrahigh vacuum/chemical vapor deposition
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