Unravelling new principles of site-selective doping contrast in the dual-beam focused ion beam/scanning electron microscope
•FIB-processed doping contrast from trench-cut facet is lower than that from cleaving.•Doping contrast correlates with milling voltage via surface amorphous layer thickness.•Imaging/milling geometry and metal deposition impact on site-specific doping contrast.•The trench aspect ratio dependence of d...
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Veröffentlicht in: | Ultramicroscopy 2020-06, Vol.213, p.112947-112947, Article 112947 |
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description | •FIB-processed doping contrast from trench-cut facet is lower than that from cleaving.•Doping contrast correlates with milling voltage via surface amorphous layer thickness.•Imaging/milling geometry and metal deposition impact on site-specific doping contrast.•The trench aspect ratio dependence of doping contrast is related to redeposition effects.•Amorphous-crystalline interfacial field within electron range governs doping contrast.
Doping contrast using the secondary electron (SE) signal in the scanning electron microscope (SEM) can satisfy the International Roadmap for Semiconductors (ITRS) requisites for quantitative dopant profiling of next-generation integrated circuits and devices, but only if adopting a site-selective specimen preparation procedure. In this study, site-specific dopant profiling was performed on the trench side-wall cut by a 30-kV Ga+ focused ion beam (FIB) into silicon p–n junction specimens and milled using successively lower voltages in the dual-beam FIB/SEM. Although depositing the protective platinum strap on the surface effectively controls ‘curtaining’ effects at low final milling voltages, significantly reduced doping contrast from the side-wall compared to that from a cleaved surface subjected to the same ion-beam energy is ascribed to the material affected by a previous milling step, as well as the dissimilar geometries of milling and imaging. New principles underpinning the doping contrast mechanism were surveyed taking into account the depth and concentration of ion implantation and amorphization damage as a linear function of the final milling voltage. Patch fields are suppressed, but the bulk doping-dependent surface band-bending fields at the amorphous-crystalline interface is crucial for doping contrast. In general, as the milling voltage decreases the doping contrast increases, which although reaches up to only half that attainable from a freshly-cleaved specimen, is usable, and demonstrates the feasibility of site-specific dopant profiling in situ in the SEM. |
doi_str_mv | 10.1016/j.ultramic.2020.112947 |
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Doping contrast using the secondary electron (SE) signal in the scanning electron microscope (SEM) can satisfy the International Roadmap for Semiconductors (ITRS) requisites for quantitative dopant profiling of next-generation integrated circuits and devices, but only if adopting a site-selective specimen preparation procedure. In this study, site-specific dopant profiling was performed on the trench side-wall cut by a 30-kV Ga+ focused ion beam (FIB) into silicon p–n junction specimens and milled using successively lower voltages in the dual-beam FIB/SEM. Although depositing the protective platinum strap on the surface effectively controls ‘curtaining’ effects at low final milling voltages, significantly reduced doping contrast from the side-wall compared to that from a cleaved surface subjected to the same ion-beam energy is ascribed to the material affected by a previous milling step, as well as the dissimilar geometries of milling and imaging. New principles underpinning the doping contrast mechanism were surveyed taking into account the depth and concentration of ion implantation and amorphization damage as a linear function of the final milling voltage. Patch fields are suppressed, but the bulk doping-dependent surface band-bending fields at the amorphous-crystalline interface is crucial for doping contrast. In general, as the milling voltage decreases the doping contrast increases, which although reaches up to only half that attainable from a freshly-cleaved specimen, is usable, and demonstrates the feasibility of site-specific dopant profiling in situ in the SEM.</description><identifier>ISSN: 0304-3991</identifier><identifier>EISSN: 1879-2723</identifier><identifier>DOI: 10.1016/j.ultramic.2020.112947</identifier><identifier>PMID: 32361280</identifier><language>eng</language><publisher>Netherlands: Elsevier B.V</publisher><subject>Amorphous damage ; Dopant profiling ; Focused ion beam ; Ga+ ions ; Low-voltage milling ; Microfabrication ; p–n junctions ; Scanning electron microscope ; secondary electron emission ; Semiconductor metrology ; Surface band-bending</subject><ispartof>Ultramicroscopy, 2020-06, Vol.213, p.112947-112947, Article 112947</ispartof><rights>2020 Elsevier B.V.</rights><rights>Copyright © 2020 Elsevier B.V. All rights reserved.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c368t-e4743916649d3710ea383dd9695cddcb8040fd6a5fd767734d78dbd31c5680313</citedby><cites>FETCH-LOGICAL-c368t-e4743916649d3710ea383dd9695cddcb8040fd6a5fd767734d78dbd31c5680313</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://dx.doi.org/10.1016/j.ultramic.2020.112947$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>314,780,784,3550,27924,27925,45995</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/32361280$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Chee, Augustus K.W.</creatorcontrib><title>Unravelling new principles of site-selective doping contrast in the dual-beam focused ion beam/scanning electron microscope</title><title>Ultramicroscopy</title><addtitle>Ultramicroscopy</addtitle><description>•FIB-processed doping contrast from trench-cut facet is lower than that from cleaving.•Doping contrast correlates with milling voltage via surface amorphous layer thickness.•Imaging/milling geometry and metal deposition impact on site-specific doping contrast.•The trench aspect ratio dependence of doping contrast is related to redeposition effects.•Amorphous-crystalline interfacial field within electron range governs doping contrast.
Doping contrast using the secondary electron (SE) signal in the scanning electron microscope (SEM) can satisfy the International Roadmap for Semiconductors (ITRS) requisites for quantitative dopant profiling of next-generation integrated circuits and devices, but only if adopting a site-selective specimen preparation procedure. In this study, site-specific dopant profiling was performed on the trench side-wall cut by a 30-kV Ga+ focused ion beam (FIB) into silicon p–n junction specimens and milled using successively lower voltages in the dual-beam FIB/SEM. Although depositing the protective platinum strap on the surface effectively controls ‘curtaining’ effects at low final milling voltages, significantly reduced doping contrast from the side-wall compared to that from a cleaved surface subjected to the same ion-beam energy is ascribed to the material affected by a previous milling step, as well as the dissimilar geometries of milling and imaging. New principles underpinning the doping contrast mechanism were surveyed taking into account the depth and concentration of ion implantation and amorphization damage as a linear function of the final milling voltage. Patch fields are suppressed, but the bulk doping-dependent surface band-bending fields at the amorphous-crystalline interface is crucial for doping contrast. In general, as the milling voltage decreases the doping contrast increases, which although reaches up to only half that attainable from a freshly-cleaved specimen, is usable, and demonstrates the feasibility of site-specific dopant profiling in situ in the SEM.</description><subject>Amorphous damage</subject><subject>Dopant profiling</subject><subject>Focused ion beam</subject><subject>Ga+ ions</subject><subject>Low-voltage milling</subject><subject>Microfabrication</subject><subject>p–n junctions</subject><subject>Scanning electron microscope</subject><subject>secondary electron emission</subject><subject>Semiconductor metrology</subject><subject>Surface band-bending</subject><issn>0304-3991</issn><issn>1879-2723</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><recordid>eNqFkEtPHDEQhK0oKCyQv4B8zGUWP2b9uIFQSJCQuMDZ8to9xKsZe2LPbIT483iywJVTS6Wqru4PoXNK1pRQcbFbz_2U7RDcmhFWRcp0K7-gFVVSN0wy_hWtCCdtw7Wmx-iklB0hhJJWfUPHnHFBmSIr9PIYs91D34f4hCP8w2MO0YWxh4JTh0uYoCnQg5vCHrBP4-JzKdbuMuEQ8fSnyrPtmy3YAXfJzQU8DiniRbgozsa4ZP7vyFWuJ-dUXBrhDB11ti_w_W2eosebnw_Xv5u7-1-311d3jeNCTQ20suWaCtFqzyUlYLni3muhN857t1WkJZ0XdtN5KaTkrZfKbz2nbiMU4ZSfoh-HvWNOf2cokxlCcfVnGyHNxTCuFRVMycUqDtblxpKhM5XHYPOzocQs4M3OvIM3C3hzAF-D528d83YA_xF7J10NlwcD1E_3AbIpLkB04EOuZIxP4bOOV9wimdI</recordid><startdate>202006</startdate><enddate>202006</enddate><creator>Chee, Augustus K.W.</creator><general>Elsevier B.V</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7X8</scope></search><sort><creationdate>202006</creationdate><title>Unravelling new principles of site-selective doping contrast in the dual-beam focused ion beam/scanning electron microscope</title><author>Chee, Augustus K.W.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c368t-e4743916649d3710ea383dd9695cddcb8040fd6a5fd767734d78dbd31c5680313</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2020</creationdate><topic>Amorphous damage</topic><topic>Dopant profiling</topic><topic>Focused ion beam</topic><topic>Ga+ ions</topic><topic>Low-voltage milling</topic><topic>Microfabrication</topic><topic>p–n junctions</topic><topic>Scanning electron microscope</topic><topic>secondary electron emission</topic><topic>Semiconductor metrology</topic><topic>Surface band-bending</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Chee, Augustus K.W.</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><collection>MEDLINE - Academic</collection><jtitle>Ultramicroscopy</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Chee, Augustus K.W.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Unravelling new principles of site-selective doping contrast in the dual-beam focused ion beam/scanning electron microscope</atitle><jtitle>Ultramicroscopy</jtitle><addtitle>Ultramicroscopy</addtitle><date>2020-06</date><risdate>2020</risdate><volume>213</volume><spage>112947</spage><epage>112947</epage><pages>112947-112947</pages><artnum>112947</artnum><issn>0304-3991</issn><eissn>1879-2723</eissn><abstract>•FIB-processed doping contrast from trench-cut facet is lower than that from cleaving.•Doping contrast correlates with milling voltage via surface amorphous layer thickness.•Imaging/milling geometry and metal deposition impact on site-specific doping contrast.•The trench aspect ratio dependence of doping contrast is related to redeposition effects.•Amorphous-crystalline interfacial field within electron range governs doping contrast.
Doping contrast using the secondary electron (SE) signal in the scanning electron microscope (SEM) can satisfy the International Roadmap for Semiconductors (ITRS) requisites for quantitative dopant profiling of next-generation integrated circuits and devices, but only if adopting a site-selective specimen preparation procedure. In this study, site-specific dopant profiling was performed on the trench side-wall cut by a 30-kV Ga+ focused ion beam (FIB) into silicon p–n junction specimens and milled using successively lower voltages in the dual-beam FIB/SEM. Although depositing the protective platinum strap on the surface effectively controls ‘curtaining’ effects at low final milling voltages, significantly reduced doping contrast from the side-wall compared to that from a cleaved surface subjected to the same ion-beam energy is ascribed to the material affected by a previous milling step, as well as the dissimilar geometries of milling and imaging. New principles underpinning the doping contrast mechanism were surveyed taking into account the depth and concentration of ion implantation and amorphization damage as a linear function of the final milling voltage. Patch fields are suppressed, but the bulk doping-dependent surface band-bending fields at the amorphous-crystalline interface is crucial for doping contrast. In general, as the milling voltage decreases the doping contrast increases, which although reaches up to only half that attainable from a freshly-cleaved specimen, is usable, and demonstrates the feasibility of site-specific dopant profiling in situ in the SEM.</abstract><cop>Netherlands</cop><pub>Elsevier B.V</pub><pmid>32361280</pmid><doi>10.1016/j.ultramic.2020.112947</doi><tpages>1</tpages></addata></record> |
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subjects | Amorphous damage Dopant profiling Focused ion beam Ga+ ions Low-voltage milling Microfabrication p–n junctions Scanning electron microscope secondary electron emission Semiconductor metrology Surface band-bending |
title | Unravelling new principles of site-selective doping contrast in the dual-beam focused ion beam/scanning electron microscope |
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