Stress analysis of a finite plate adhesively bonded to an elastic half-space
An analysis is performed of finite plates bonded to an elastic half-space through an adhesive layer. Parametric studies of the effects of plate dimensions adhesive and plate material properties, and thickness of the adhesive, on bond strength are obtained. A higher order plate theory, which accounts...
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Veröffentlicht in: | International journal of adhesion and adhesives 1981-10, Vol.1 (6), p.287-299 |
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container_title | International journal of adhesion and adhesives |
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creator | Connelly, L.M. Batterman, S.C. |
description | An analysis is performed of finite plates bonded to an elastic half-space through an adhesive layer. Parametric studies of the effects of plate dimensions adhesive and plate material properties, and thickness of the adhesive, on bond strength are obtained. A higher order plate theory, which accounts for transverse normal stresses, is used to obtain the stress state in the plate and the adhesive for various normal and shear loadings applied to the top surface of the plate. The governing partial differential equations are generated by means of variational principle and then solved numerically. Specific numerical results for stresses as a function of the parameter variations are presented. The results are significant for the optimum design of adhesive joints. |
doi_str_mv | 10.1016/0143-7496(81)90022-1 |
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Parametric studies of the effects of plate dimensions adhesive and plate material properties, and thickness of the adhesive, on bond strength are obtained. A higher order plate theory, which accounts for transverse normal stresses, is used to obtain the stress state in the plate and the adhesive for various normal and shear loadings applied to the top surface of the plate. The governing partial differential equations are generated by means of variational principle and then solved numerically. Specific numerical results for stresses as a function of the parameter variations are presented. 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Parametric studies of the effects of plate dimensions adhesive and plate material properties, and thickness of the adhesive, on bond strength are obtained. A higher order plate theory, which accounts for transverse normal stresses, is used to obtain the stress state in the plate and the adhesive for various normal and shear loadings applied to the top surface of the plate. The governing partial differential equations are generated by means of variational principle and then solved numerically. Specific numerical results for stresses as a function of the parameter variations are presented. 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Parametric studies of the effects of plate dimensions adhesive and plate material properties, and thickness of the adhesive, on bond strength are obtained. A higher order plate theory, which accounts for transverse normal stresses, is used to obtain the stress state in the plate and the adhesive for various normal and shear loadings applied to the top surface of the plate. The governing partial differential equations are generated by means of variational principle and then solved numerically. Specific numerical results for stresses as a function of the parameter variations are presented. The results are significant for the optimum design of adhesive joints.</abstract><pub>Elsevier Ltd</pub><doi>10.1016/0143-7496(81)90022-1</doi><tpages>13</tpages></addata></record> |
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title | Stress analysis of a finite plate adhesively bonded to an elastic half-space |
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