A decision support system for the Alternative Assembly and Reflow Technology process
The Alternative Assembly and Reflow Technology (AART) process allows for the concurrent reflow soldering of through hole and surface mount components on to a Printed Circuit Board (PCB) assembly. The implementation of the AART process will preclude the need for wave and/or manual soldering. Prior to...
Gespeichert in:
| Veröffentlicht in: | Computers & industrial engineering 1998-10, Vol.35 (1-2), p.61-64 |
|---|---|
| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 64 |
|---|---|
| container_issue | 1-2 |
| container_start_page | 61 |
| container_title | Computers & industrial engineering |
| container_volume | 35 |
| creator | Ramakrishnan, S. Srihari, K. Westby, G.R. |
| description | The Alternative Assembly and Reflow Technology (AART) process allows for the concurrent reflow soldering of through hole and surface mount components on to a Printed Circuit Board (PCB) assembly. The implementation of the AART process will preclude the need for wave and/or manual soldering. Prior to the implementation of the AART process, the engineer is required to compute the volume of solder paste that is needed to form a robust solder joint. The hole fill that can be anticipated should then be determined. Finally, the stencil apertures need to be designed. The decision support systems developed in this research, and described in this paper, can assist a process engineer with solder volume estimation, hole fill prediction, and with stencil aperture design. |
| doi_str_mv | 10.1016/S0360-8352(98)00020-5 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_23574003</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><els_id>S0360835298000205</els_id><sourcerecordid>39053203</sourcerecordid><originalsourceid>FETCH-LOGICAL-c443t-7b6ca841639cdc36f9424fa222268bceea0e246bef80ff74f2260dc56e7f9b4a3</originalsourceid><addsrcrecordid>eNqFkN9LHDEQgEOp0Kv2TxBCEWkftiabZDd5Kof0FwiCPZ9DNjupkdzmzOwp998bPWnBl87LDMM3M8xHyDFnXzjj3dlvJjrWaKHaT0Z_Zoy1rFFvyILr3jRMKfaWLP4i78h7xNsKSWX4gqyWdAQfMeaJ4nazyWWmuMMZ1jTkQucboMs0Q5ncHO9rjQjrIe2om0Z6BSHlB7oCfzPllP_s6KZkD4hH5CC4hPDhJR-S6-_fVuc_m4vLH7_OlxeNl1LMTT903mnJO2H86EUXjGxlcG2NTg8ewDFoZTdA0CyEXobaZ6NXHfTBDNKJQ3K631vv3m0BZ7uO6CElN0Heom2F6iVjooIfX4G3eVt_SpXholc917pCag_5khELBLspce3KznJmn0TbZ9H2yaI12j6LtqrOnbwsd-hdCsVNVei_YWVabVjFvu4xqEbuIxSLPsLkYYwF_GzHHP9z6BGEcZIX</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>213757188</pqid></control><display><type>article</type><title>A decision support system for the Alternative Assembly and Reflow Technology process</title><source>Elsevier ScienceDirect Journals</source><creator>Ramakrishnan, S. ; Srihari, K. ; Westby, G.R.</creator><creatorcontrib>Ramakrishnan, S. ; Srihari, K. ; Westby, G.R.</creatorcontrib><description>The Alternative Assembly and Reflow Technology (AART) process allows for the concurrent reflow soldering of through hole and surface mount components on to a Printed Circuit Board (PCB) assembly. The implementation of the AART process will preclude the need for wave and/or manual soldering. Prior to the implementation of the AART process, the engineer is required to compute the volume of solder paste that is needed to form a robust solder joint. The hole fill that can be anticipated should then be determined. Finally, the stencil apertures need to be designed. The decision support systems developed in this research, and described in this paper, can assist a process engineer with solder volume estimation, hole fill prediction, and with stencil aperture design.</description><identifier>ISSN: 0360-8352</identifier><identifier>EISSN: 1879-0550</identifier><identifier>DOI: 10.1016/S0360-8352(98)00020-5</identifier><identifier>CODEN: CINDDL</identifier><language>eng</language><publisher>Seoul: Elsevier Ltd</publisher><subject>Alternative Assembly and Reflow Technology (AART) ; Applied sciences ; Decision support systems ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronics ; Exact sciences and technology ; Intrusive Reflow ; Manufacturing ; Paste-in-Hole ; Pin-in-Paste ; Printed circuit boards ; Printed Curcuit Board (PCB) Assembly ; Studies</subject><ispartof>Computers & industrial engineering, 1998-10, Vol.35 (1-2), p.61-64</ispartof><rights>1998</rights><rights>1999 INIST-CNRS</rights><rights>Copyright Pergamon Press Inc. Oct 1998</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c443t-7b6ca841639cdc36f9424fa222268bceea0e246bef80ff74f2260dc56e7f9b4a3</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://www.sciencedirect.com/science/article/pii/S0360835298000205$$EHTML$$P50$$Gelsevier$$H</linktohtml><link.rule.ids>309,310,314,776,780,785,786,3537,23909,23910,25118,27901,27902,65306</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=1592890$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Ramakrishnan, S.</creatorcontrib><creatorcontrib>Srihari, K.</creatorcontrib><creatorcontrib>Westby, G.R.</creatorcontrib><title>A decision support system for the Alternative Assembly and Reflow Technology process</title><title>Computers & industrial engineering</title><description>The Alternative Assembly and Reflow Technology (AART) process allows for the concurrent reflow soldering of through hole and surface mount components on to a Printed Circuit Board (PCB) assembly. The implementation of the AART process will preclude the need for wave and/or manual soldering. Prior to the implementation of the AART process, the engineer is required to compute the volume of solder paste that is needed to form a robust solder joint. The hole fill that can be anticipated should then be determined. Finally, the stencil apertures need to be designed. The decision support systems developed in this research, and described in this paper, can assist a process engineer with solder volume estimation, hole fill prediction, and with stencil aperture design.</description><subject>Alternative Assembly and Reflow Technology (AART)</subject><subject>Applied sciences</subject><subject>Decision support systems</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Intrusive Reflow</subject><subject>Manufacturing</subject><subject>Paste-in-Hole</subject><subject>Pin-in-Paste</subject><subject>Printed circuit boards</subject><subject>Printed Curcuit Board (PCB) Assembly</subject><subject>Studies</subject><issn>0360-8352</issn><issn>1879-0550</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1998</creationdate><recordtype>article</recordtype><recordid>eNqFkN9LHDEQgEOp0Kv2TxBCEWkftiabZDd5Kof0FwiCPZ9DNjupkdzmzOwp998bPWnBl87LDMM3M8xHyDFnXzjj3dlvJjrWaKHaT0Z_Zoy1rFFvyILr3jRMKfaWLP4i78h7xNsKSWX4gqyWdAQfMeaJ4nazyWWmuMMZ1jTkQucboMs0Q5ncHO9rjQjrIe2om0Z6BSHlB7oCfzPllP_s6KZkD4hH5CC4hPDhJR-S6-_fVuc_m4vLH7_OlxeNl1LMTT903mnJO2H86EUXjGxlcG2NTg8ewDFoZTdA0CyEXobaZ6NXHfTBDNKJQ3K631vv3m0BZ7uO6CElN0Heom2F6iVjooIfX4G3eVt_SpXholc917pCag_5khELBLspce3KznJmn0TbZ9H2yaI12j6LtqrOnbwsd-hdCsVNVei_YWVabVjFvu4xqEbuIxSLPsLkYYwF_GzHHP9z6BGEcZIX</recordid><startdate>19981001</startdate><enddate>19981001</enddate><creator>Ramakrishnan, S.</creator><creator>Srihari, K.</creator><creator>Westby, G.R.</creator><general>Elsevier Ltd</general><general>Pergamon Press</general><general>Pergamon Press Inc</general><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>8FD</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope></search><sort><creationdate>19981001</creationdate><title>A decision support system for the Alternative Assembly and Reflow Technology process</title><author>Ramakrishnan, S. ; Srihari, K. ; Westby, G.R.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c443t-7b6ca841639cdc36f9424fa222268bceea0e246bef80ff74f2260dc56e7f9b4a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1998</creationdate><topic>Alternative Assembly and Reflow Technology (AART)</topic><topic>Applied sciences</topic><topic>Decision support systems</topic><topic>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Intrusive Reflow</topic><topic>Manufacturing</topic><topic>Paste-in-Hole</topic><topic>Pin-in-Paste</topic><topic>Printed circuit boards</topic><topic>Printed Curcuit Board (PCB) Assembly</topic><topic>Studies</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Ramakrishnan, S.</creatorcontrib><creatorcontrib>Srihari, K.</creatorcontrib><creatorcontrib>Westby, G.R.</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Technology Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><jtitle>Computers & industrial engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Ramakrishnan, S.</au><au>Srihari, K.</au><au>Westby, G.R.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A decision support system for the Alternative Assembly and Reflow Technology process</atitle><jtitle>Computers & industrial engineering</jtitle><date>1998-10-01</date><risdate>1998</risdate><volume>35</volume><issue>1-2</issue><spage>61</spage><epage>64</epage><pages>61-64</pages><issn>0360-8352</issn><eissn>1879-0550</eissn><coden>CINDDL</coden><abstract>The Alternative Assembly and Reflow Technology (AART) process allows for the concurrent reflow soldering of through hole and surface mount components on to a Printed Circuit Board (PCB) assembly. The implementation of the AART process will preclude the need for wave and/or manual soldering. Prior to the implementation of the AART process, the engineer is required to compute the volume of solder paste that is needed to form a robust solder joint. The hole fill that can be anticipated should then be determined. Finally, the stencil apertures need to be designed. The decision support systems developed in this research, and described in this paper, can assist a process engineer with solder volume estimation, hole fill prediction, and with stencil aperture design.</abstract><cop>Seoul</cop><cop>Oxford</cop><cop>New York, NY</cop><pub>Elsevier Ltd</pub><doi>10.1016/S0360-8352(98)00020-5</doi><tpages>4</tpages></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0360-8352 |
| ispartof | Computers & industrial engineering, 1998-10, Vol.35 (1-2), p.61-64 |
| issn | 0360-8352 1879-0550 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_23574003 |
| source | Elsevier ScienceDirect Journals |
| subjects | Alternative Assembly and Reflow Technology (AART) Applied sciences Decision support systems Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Intrusive Reflow Manufacturing Paste-in-Hole Pin-in-Paste Printed circuit boards Printed Curcuit Board (PCB) Assembly Studies |
| title | A decision support system for the Alternative Assembly and Reflow Technology process |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-31T16%3A42%3A13IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=A%20decision%20support%20system%20for%20the%20Alternative%20Assembly%20and%20Reflow%20Technology%20process&rft.jtitle=Computers%20&%20industrial%20engineering&rft.au=Ramakrishnan,%20S.&rft.date=1998-10-01&rft.volume=35&rft.issue=1-2&rft.spage=61&rft.epage=64&rft.pages=61-64&rft.issn=0360-8352&rft.eissn=1879-0550&rft.coden=CINDDL&rft_id=info:doi/10.1016/S0360-8352(98)00020-5&rft_dat=%3Cproquest_cross%3E39053203%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=213757188&rft_id=info:pmid/&rft_els_id=S0360835298000205&rfr_iscdi=true |