Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry

The application of a novel UV fs Laser Ablation Ionization Mass Spectrometry approach for chemical depth profiling of low-melting point, high surface roughness SnAg solder bump features is presented. The obtained submicrometer resolved three-dimensional compositional data reveal unprecedented inform...

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Veröffentlicht in:	Analytical chemistry (Washington) 2020-01, Vol.92 (1), p.1355-1362
Hauptverfasser:	Cedeño López, A, Grimaudo, V, Riedo, A, Tulej, M, Wiesendanger, R, Lukmanov, R, Moreno-García, P, Lörtscher, E, Wurz, P, Broekmann, P
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Sprache:	eng
Schlagworte:	Chemistry Composition Depth profiling Ionization Laser ablation Mass spectrometry Mass spectroscopy Melting point Melting points Organic chemistry Scientific imaging Sensitivity analysis Spectroscopy Surface roughness Three dimensional analysis
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container_title	Analytical chemistry (Washington)
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creator	Cedeño López, A Grimaudo, V Riedo, A Tulej, M Wiesendanger, R Lukmanov, R Moreno-García, P Lörtscher, E Wurz, P Broekmann, P
description	The application of a novel UV fs Laser Ablation Ionization Mass Spectrometry approach for chemical depth profiling of low-melting point, high surface roughness SnAg solder bump features is presented. The obtained submicrometer resolved three-dimensional compositional data reveal unprecedented information on the distribution of individual elements inside the solder bump matrix. Moreover, the determination of matrix-matched relative sensitivity coefficients allows the first report on quantitative assessment of the SnAg alloy composition. These results significantly contribute to an in-depth understanding of the SnAg plating process. This experimental procedure may find application in future additive performance screening.
doi_str_mv	10.1021/acs.analchem.9b04530
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subjects	Chemistry Composition Depth profiling Ionization Laser ablation Mass spectrometry Mass spectroscopy Melting point Melting points Organic chemistry Scientific imaging Sensitivity analysis Spectroscopy Surface roughness Three dimensional analysis
title	Three-Dimensional Composition Analysis of SnAg Solder Bumps Using Ultraviolet Femtosecond Laser Ablation Ionization Mass Spectrometry
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