Hydrogen passivation of grain boundaries in polycrystalline gallium arsenide
Exposure to a plasma of monatomic hydrogen at 300 °C for periods of 3–5 h is shown to significantly reduce the reverse leakage currents of surface barrier diodes fabricated from polycrystalline GaAs. The neutralization by hydrogen of electrical activity associated with grain boundaries leads to redu...
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Veröffentlicht in: | Journal of applied physics 1983-02, Vol.54 (2), p.1154-1155 |
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creator | PEARTON, S. J TAVENDALE, A. J |
description | Exposure to a plasma of monatomic hydrogen at 300 °C for periods of 3–5 h is shown to significantly reduce the reverse leakage currents of surface barrier diodes fabricated from polycrystalline GaAs. The neutralization by hydrogen of electrical activity associated with grain boundaries leads to reductions in leakage current of a factor of 50 in material with grain sizes of 150–400 μm, and a factor of 3 in material with a typical grain size of ∼1 mm. |
doi_str_mv | 10.1063/1.332089 |
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J</creatorcontrib><title>Hydrogen passivation of grain boundaries in polycrystalline gallium arsenide</title><title>Journal of applied physics</title><description>Exposure to a plasma of monatomic hydrogen at 300 °C for periods of 3–5 h is shown to significantly reduce the reverse leakage currents of surface barrier diodes fabricated from polycrystalline GaAs. The neutralization by hydrogen of electrical activity associated with grain boundaries leads to reductions in leakage current of a factor of 50 in material with grain sizes of 150–400 μm, and a factor of 3 in material with a typical grain size of ∼1 mm.</description><subject>Applied sciences</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Microelectronic fabrication (materials and surfaces technology)</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. 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Solid state devices</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>PEARTON, S. J</creatorcontrib><creatorcontrib>TAVENDALE, A. J</creatorcontrib><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><jtitle>Journal of applied physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>PEARTON, S. J</au><au>TAVENDALE, A. J</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Hydrogen passivation of grain boundaries in polycrystalline gallium arsenide</atitle><jtitle>Journal of applied physics</jtitle><date>1983-02-01</date><risdate>1983</risdate><volume>54</volume><issue>2</issue><spage>1154</spage><epage>1155</epage><pages>1154-1155</pages><issn>0021-8979</issn><eissn>1089-7550</eissn><coden>JAPIAU</coden><abstract>Exposure to a plasma of monatomic hydrogen at 300 °C for periods of 3–5 h is shown to significantly reduce the reverse leakage currents of surface barrier diodes fabricated from polycrystalline GaAs. The neutralization by hydrogen of electrical activity associated with grain boundaries leads to reductions in leakage current of a factor of 50 in material with grain sizes of 150–400 μm, and a factor of 3 in material with a typical grain size of ∼1 mm.</abstract><cop>Woodbury, NY</cop><pub>American Institute of Physics</pub><doi>10.1063/1.332089</doi><tpages>2</tpages></addata></record> |
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language | eng |
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source | AIP Digital Archive |
subjects | Applied sciences Electronics Exact sciences and technology Microelectronic fabrication (materials and surfaces technology) Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices |
title | Hydrogen passivation of grain boundaries in polycrystalline gallium arsenide |
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