Pretreatment of metallic substrates with the plasmatron

It is expected that ring gap discharges will increasingly gain in importance as a pretreatment technique for metallic substrates prior to vacuum deposition. Such a process not only allows proper gas desorption, sputter cleaning and setting of the substrate temperature but also provides adequate surf...

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Bibliographische Detailangaben

Veröffentlicht in:	Thin solid films 1978-06, Vol.51 (2), p.189-196
Hauptverfasser:	Schiller, S., Heisig, U., Steinfelder, K., Gehm, K.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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