Photolithographic Masking Method to Chemically Pattern Silk Film Surfaces

A method has been developed for selectively patterning silk surfaces using a photolithographic process to mask off sections of silk films, which allows selective and precise patterning of features down to 40 μm. This process is highly versatile, utilizes only low-cost equipment and can be used to rapidly prototype flat silk substrates with spatially controlled chemical patterns. Here we demonstrate the usefulness of this technique to deposit fluorescent dyes, labeled proteins and conducting polymers or to modify the surface charge of the silk protein in desired regions on a silk film surface.