Stable Na Plating and Stripping Electrochemistry Promoted by In Situ Construction of an Alloy‐Based Sodiophilic Interphase

Sodium metal anodes are poor due to the reversibility of Na plating/stripping, which hinders their practical applications. A strategy to form a sodiophilic Au–Na alloy interphase on a Cu current collector, involving a sputtered Au thin layer, is shown to enable efficient Na plating/stripping for a c...

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Veröffentlicht in:	Advanced materials (Weinheim) 2019-04, Vol.31 (16), p.e1807495-n/a
Hauptverfasser:	Tang, Shuai, Zhang, Yi‐Yang, Zhang, Xia‐Guang, Li, Jun‐Tao, Wang, Xue‐Yin, Yan, Jia‐Wei, Wu, De‐Yin, Zheng, Ming‐Sen, Dong, Quan‐Feng, Mao, Bing‐Wei
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloy plating alloying Alloys Antimony Control stability Copper Electrochemistry Gold Materials science plating/stripping cycles sodiophilic Sodium sodium metal anodes Stripping Substrates Thin films Tin
Online-Zugang:	Volltext
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