Low angle boundary migration of shot‐peened pure nickel investigated by electron channeling contrast imaging and electron backscatter diffraction
Study on recrystallization of deformed metal is important for practical industrial applications. Most of studies about recrystallization behavior focused on the migration of the high‐angle grain boundaries, resulting in lack of information of the kinetics of the low angle grain boundary migration. I...
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| Veröffentlicht in: | Microscopy research and technique 2019-06, Vol.82 (6), p.849-855 |
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| creator | Oh, Jin‐Su Cha, Hyun‐Woo Kim, Tae‐Hoon Shin, Keesam Yang, Cheol‐Woong |
| description | Study on recrystallization of deformed metal is important for practical industrial applications. Most of studies about recrystallization behavior focused on the migration of the high‐angle grain boundaries, resulting in lack of information of the kinetics of the low angle grain boundary migration. In this study, we focused on the migration of the low angle grain boundaries during recrystallization process. Pure nickel deformed by shot peening which induced plastic deformation at the surface was investigated. The surface of the specimen was prepared by mechanical polishing using diamond slurry and colloidal silica down to 0.02 μm. Sequential heat treatment under a moderate annealing temperature facilitates to observe the migration of low angle grain boundaries. The threshold energy for low angle boundary migration during recrystallization as a function of misorientation angle was evaluated using scanning electron microscopy techniques. A combination of electron channeling contrast imaging and electron backscatter diffraction was used to measure the average dislocation density and a quantitative estimation of the stored energy near the boundary. It was observed that the migration of the low angle grain boundaries during recrystallization was strongly affected by both the stored energy of the deformed matrix and the misorientation angle of the boundary. Through the combination of electron channeling contrast imaging and electron backscatter diffraction, the threshold stored energy for the migration of the low angle grain boundaries was estimated as a function of the boundary misorientation.
Behavior of low angle grain boundary during recrystallization was directly observed.
Shot‐peening process produces linear plastic deformation gradient.
Total dislocation density was obtained using combination of electron backscatter diffraction and electron channeling contrast imaging.
Threshold driving force for low angle grain boundary migration was evaluated. |
| doi_str_mv | 10.1002/jemt.23226 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_proquest_miscellaneous_2179443604</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>2224367799</sourcerecordid><originalsourceid>FETCH-LOGICAL-c3576-748b49863f0d372a5e9dbc10ddbebdd84104da8daebb49dbce9bdf7ef90c9073</originalsourceid><addsrcrecordid>eNp9kc1u1DAQxy1ERUvhwgMgS1wQUortZOP4iKryUS3isgdulj8mqbeJvdhOq73xCEi8IU-C021B4sBpRjO_-c-M_gi9oOSMEsLebmHKZ6xmrH2ETigRvCpV8XjJV6ISlHw9Rk9T2hJC6Yo2T9BxTdpOsIafoJ_rcIuVH0bAOszeqrjHkxuiyi54HHqcrkL-9f3HDsCDxbs5AvbOXMOInb-BlN2gcmnoPYYRTI5lylwp72F0fsAm-BxVythNalgKytu_oFbmOhmVM0RsXd9HZZa1z9BRr8YEz-_jKdq8v9icf6zWXz58On-3rky94m3Fm043omvrntiaM7UCYbWhxFoN2tquoaSxqrMKdOFKC4S2PYdeECMIr0_R64PsLoZvc3lFTi4ZGEflIcxJMspF09QtaQr66h90G-boy3GSMVYYzoUo1JsDZWJIKUIvd7H8HfeSErk4JRen5J1TBX55LznrCewf9MGaAtADcOtG2P9HSl5efN4cRH8DvG6j2w</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2224367799</pqid></control><display><type>article</type><title>Low angle boundary migration of shot‐peened pure nickel investigated by electron channeling contrast imaging and electron backscatter diffraction</title><source>Wiley Online Library Journals Frontfile Complete</source><creator>Oh, Jin‐Su ; Cha, Hyun‐Woo ; Kim, Tae‐Hoon ; Shin, Keesam ; Yang, Cheol‐Woong</creator><creatorcontrib>Oh, Jin‐Su ; Cha, Hyun‐Woo ; Kim, Tae‐Hoon ; Shin, Keesam ; Yang, Cheol‐Woong</creatorcontrib><description>Study on recrystallization of deformed metal is important for practical industrial applications. Most of studies about recrystallization behavior focused on the migration of the high‐angle grain boundaries, resulting in lack of information of the kinetics of the low angle grain boundary migration. In this study, we focused on the migration of the low angle grain boundaries during recrystallization process. Pure nickel deformed by shot peening which induced plastic deformation at the surface was investigated. The surface of the specimen was prepared by mechanical polishing using diamond slurry and colloidal silica down to 0.02 μm. Sequential heat treatment under a moderate annealing temperature facilitates to observe the migration of low angle grain boundaries. The threshold energy for low angle boundary migration during recrystallization as a function of misorientation angle was evaluated using scanning electron microscopy techniques. A combination of electron channeling contrast imaging and electron backscatter diffraction was used to measure the average dislocation density and a quantitative estimation of the stored energy near the boundary. It was observed that the migration of the low angle grain boundaries during recrystallization was strongly affected by both the stored energy of the deformed matrix and the misorientation angle of the boundary. Through the combination of electron channeling contrast imaging and electron backscatter diffraction, the threshold stored energy for the migration of the low angle grain boundaries was estimated as a function of the boundary misorientation.
Behavior of low angle grain boundary during recrystallization was directly observed.
Shot‐peening process produces linear plastic deformation gradient.
Total dislocation density was obtained using combination of electron backscatter diffraction and electron channeling contrast imaging.
Threshold driving force for low angle grain boundary migration was evaluated.</description><identifier>ISSN: 1059-910X</identifier><identifier>EISSN: 1097-0029</identifier><identifier>DOI: 10.1002/jemt.23226</identifier><identifier>PMID: 30689247</identifier><language>eng</language><publisher>Hoboken, USA: John Wiley & Sons, Inc</publisher><subject>Boundaries ; Channeling ; Deformation ; Diamond polishing ; Diamonds ; Diffraction ; Dislocation ; Dislocation density ; Electron backscatter diffraction ; electron backscatter diffraction (EBSD) ; electron channeling contrast imaging (ECCI) ; Energy ; Grain boundaries ; Grain boundary migration ; Heat treatment ; Imaging ; Industrial applications ; Internal energy ; Kinetics ; low angle boundary migration ; Mechanical polishing ; Misalignment ; Nickel ; Plastic deformation ; Recrystallization ; Scanning electron microscopy ; scanning electron microscopy (SEM) ; Silica ; Silicon dioxide ; Slurries ; stored energy</subject><ispartof>Microscopy research and technique, 2019-06, Vol.82 (6), p.849-855</ispartof><rights>2019 Wiley Periodicals, Inc.</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c3576-748b49863f0d372a5e9dbc10ddbebdd84104da8daebb49dbce9bdf7ef90c9073</citedby><cites>FETCH-LOGICAL-c3576-748b49863f0d372a5e9dbc10ddbebdd84104da8daebb49dbce9bdf7ef90c9073</cites><orcidid>0000-0002-7462-3142 ; 0000-0003-0475-8399</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1002%2Fjemt.23226$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1002%2Fjemt.23226$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,776,780,1411,27901,27902,45550,45551</link.rule.ids><backlink>$$Uhttps://www.ncbi.nlm.nih.gov/pubmed/30689247$$D View this record in MEDLINE/PubMed$$Hfree_for_read</backlink></links><search><creatorcontrib>Oh, Jin‐Su</creatorcontrib><creatorcontrib>Cha, Hyun‐Woo</creatorcontrib><creatorcontrib>Kim, Tae‐Hoon</creatorcontrib><creatorcontrib>Shin, Keesam</creatorcontrib><creatorcontrib>Yang, Cheol‐Woong</creatorcontrib><title>Low angle boundary migration of shot‐peened pure nickel investigated by electron channeling contrast imaging and electron backscatter diffraction</title><title>Microscopy research and technique</title><addtitle>Microsc Res Tech</addtitle><description>Study on recrystallization of deformed metal is important for practical industrial applications. Most of studies about recrystallization behavior focused on the migration of the high‐angle grain boundaries, resulting in lack of information of the kinetics of the low angle grain boundary migration. In this study, we focused on the migration of the low angle grain boundaries during recrystallization process. Pure nickel deformed by shot peening which induced plastic deformation at the surface was investigated. The surface of the specimen was prepared by mechanical polishing using diamond slurry and colloidal silica down to 0.02 μm. Sequential heat treatment under a moderate annealing temperature facilitates to observe the migration of low angle grain boundaries. The threshold energy for low angle boundary migration during recrystallization as a function of misorientation angle was evaluated using scanning electron microscopy techniques. A combination of electron channeling contrast imaging and electron backscatter diffraction was used to measure the average dislocation density and a quantitative estimation of the stored energy near the boundary. It was observed that the migration of the low angle grain boundaries during recrystallization was strongly affected by both the stored energy of the deformed matrix and the misorientation angle of the boundary. Through the combination of electron channeling contrast imaging and electron backscatter diffraction, the threshold stored energy for the migration of the low angle grain boundaries was estimated as a function of the boundary misorientation.
Behavior of low angle grain boundary during recrystallization was directly observed.
Shot‐peening process produces linear plastic deformation gradient.
Total dislocation density was obtained using combination of electron backscatter diffraction and electron channeling contrast imaging.
Threshold driving force for low angle grain boundary migration was evaluated.</description><subject>Boundaries</subject><subject>Channeling</subject><subject>Deformation</subject><subject>Diamond polishing</subject><subject>Diamonds</subject><subject>Diffraction</subject><subject>Dislocation</subject><subject>Dislocation density</subject><subject>Electron backscatter diffraction</subject><subject>electron backscatter diffraction (EBSD)</subject><subject>electron channeling contrast imaging (ECCI)</subject><subject>Energy</subject><subject>Grain boundaries</subject><subject>Grain boundary migration</subject><subject>Heat treatment</subject><subject>Imaging</subject><subject>Industrial applications</subject><subject>Internal energy</subject><subject>Kinetics</subject><subject>low angle boundary migration</subject><subject>Mechanical polishing</subject><subject>Misalignment</subject><subject>Nickel</subject><subject>Plastic deformation</subject><subject>Recrystallization</subject><subject>Scanning electron microscopy</subject><subject>scanning electron microscopy (SEM)</subject><subject>Silica</subject><subject>Silicon dioxide</subject><subject>Slurries</subject><subject>stored energy</subject><issn>1059-910X</issn><issn>1097-0029</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><recordid>eNp9kc1u1DAQxy1ERUvhwgMgS1wQUortZOP4iKryUS3isgdulj8mqbeJvdhOq73xCEi8IU-C021B4sBpRjO_-c-M_gi9oOSMEsLebmHKZ6xmrH2ETigRvCpV8XjJV6ISlHw9Rk9T2hJC6Yo2T9BxTdpOsIafoJ_rcIuVH0bAOszeqrjHkxuiyi54HHqcrkL-9f3HDsCDxbs5AvbOXMOInb-BlN2gcmnoPYYRTI5lylwp72F0fsAm-BxVythNalgKytu_oFbmOhmVM0RsXd9HZZa1z9BRr8YEz-_jKdq8v9icf6zWXz58On-3rky94m3Fm043omvrntiaM7UCYbWhxFoN2tquoaSxqrMKdOFKC4S2PYdeECMIr0_R64PsLoZvc3lFTi4ZGEflIcxJMspF09QtaQr66h90G-boy3GSMVYYzoUo1JsDZWJIKUIvd7H8HfeSErk4JRen5J1TBX55LznrCewf9MGaAtADcOtG2P9HSl5efN4cRH8DvG6j2w</recordid><startdate>201906</startdate><enddate>201906</enddate><creator>Oh, Jin‐Su</creator><creator>Cha, Hyun‐Woo</creator><creator>Kim, Tae‐Hoon</creator><creator>Shin, Keesam</creator><creator>Yang, Cheol‐Woong</creator><general>John Wiley & Sons, Inc</general><general>Wiley Subscription Services, Inc</general><scope>NPM</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7QF</scope><scope>7QO</scope><scope>7QP</scope><scope>7QQ</scope><scope>7SC</scope><scope>7SE</scope><scope>7SP</scope><scope>7SR</scope><scope>7SS</scope><scope>7TA</scope><scope>7TB</scope><scope>7U5</scope><scope>7U7</scope><scope>8BQ</scope><scope>8FD</scope><scope>C1K</scope><scope>F28</scope><scope>FR3</scope><scope>H8D</scope><scope>H8G</scope><scope>JG9</scope><scope>JQ2</scope><scope>K9.</scope><scope>KR7</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>P64</scope><scope>RC3</scope><scope>7X8</scope><orcidid>https://orcid.org/0000-0002-7462-3142</orcidid><orcidid>https://orcid.org/0000-0003-0475-8399</orcidid></search><sort><creationdate>201906</creationdate><title>Low angle boundary migration of shot‐peened pure nickel investigated by electron channeling contrast imaging and electron backscatter diffraction</title><author>Oh, Jin‐Su ; Cha, Hyun‐Woo ; Kim, Tae‐Hoon ; Shin, Keesam ; Yang, Cheol‐Woong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3576-748b49863f0d372a5e9dbc10ddbebdd84104da8daebb49dbce9bdf7ef90c9073</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Boundaries</topic><topic>Channeling</topic><topic>Deformation</topic><topic>Diamond polishing</topic><topic>Diamonds</topic><topic>Diffraction</topic><topic>Dislocation</topic><topic>Dislocation density</topic><topic>Electron backscatter diffraction</topic><topic>electron backscatter diffraction (EBSD)</topic><topic>electron channeling contrast imaging (ECCI)</topic><topic>Energy</topic><topic>Grain boundaries</topic><topic>Grain boundary migration</topic><topic>Heat treatment</topic><topic>Imaging</topic><topic>Industrial applications</topic><topic>Internal energy</topic><topic>Kinetics</topic><topic>low angle boundary migration</topic><topic>Mechanical polishing</topic><topic>Misalignment</topic><topic>Nickel</topic><topic>Plastic deformation</topic><topic>Recrystallization</topic><topic>Scanning electron microscopy</topic><topic>scanning electron microscopy (SEM)</topic><topic>Silica</topic><topic>Silicon dioxide</topic><topic>Slurries</topic><topic>stored energy</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Oh, Jin‐Su</creatorcontrib><creatorcontrib>Cha, Hyun‐Woo</creatorcontrib><creatorcontrib>Kim, Tae‐Hoon</creatorcontrib><creatorcontrib>Shin, Keesam</creatorcontrib><creatorcontrib>Yang, Cheol‐Woong</creatorcontrib><collection>PubMed</collection><collection>CrossRef</collection><collection>Aluminium Industry Abstracts</collection><collection>Biotechnology Research Abstracts</collection><collection>Calcium & Calcified Tissue Abstracts</collection><collection>Ceramic Abstracts</collection><collection>Computer and Information Systems Abstracts</collection><collection>Corrosion Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>Entomology Abstracts (Full archive)</collection><collection>Materials Business File</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Toxicology Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Environmental Sciences and Pollution Management</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Aerospace Database</collection><collection>Copper Technical Reference Library</collection><collection>Materials Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>ProQuest Health & Medical Complete (Alumni)</collection><collection>Civil Engineering Abstracts</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>Biotechnology and BioEngineering Abstracts</collection><collection>Genetics Abstracts</collection><collection>MEDLINE - Academic</collection><jtitle>Microscopy research and technique</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Oh, Jin‐Su</au><au>Cha, Hyun‐Woo</au><au>Kim, Tae‐Hoon</au><au>Shin, Keesam</au><au>Yang, Cheol‐Woong</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Low angle boundary migration of shot‐peened pure nickel investigated by electron channeling contrast imaging and electron backscatter diffraction</atitle><jtitle>Microscopy research and technique</jtitle><addtitle>Microsc Res Tech</addtitle><date>2019-06</date><risdate>2019</risdate><volume>82</volume><issue>6</issue><spage>849</spage><epage>855</epage><pages>849-855</pages><issn>1059-910X</issn><eissn>1097-0029</eissn><abstract>Study on recrystallization of deformed metal is important for practical industrial applications. Most of studies about recrystallization behavior focused on the migration of the high‐angle grain boundaries, resulting in lack of information of the kinetics of the low angle grain boundary migration. In this study, we focused on the migration of the low angle grain boundaries during recrystallization process. Pure nickel deformed by shot peening which induced plastic deformation at the surface was investigated. The surface of the specimen was prepared by mechanical polishing using diamond slurry and colloidal silica down to 0.02 μm. Sequential heat treatment under a moderate annealing temperature facilitates to observe the migration of low angle grain boundaries. The threshold energy for low angle boundary migration during recrystallization as a function of misorientation angle was evaluated using scanning electron microscopy techniques. A combination of electron channeling contrast imaging and electron backscatter diffraction was used to measure the average dislocation density and a quantitative estimation of the stored energy near the boundary. It was observed that the migration of the low angle grain boundaries during recrystallization was strongly affected by both the stored energy of the deformed matrix and the misorientation angle of the boundary. Through the combination of electron channeling contrast imaging and electron backscatter diffraction, the threshold stored energy for the migration of the low angle grain boundaries was estimated as a function of the boundary misorientation.
Behavior of low angle grain boundary during recrystallization was directly observed.
Shot‐peening process produces linear plastic deformation gradient.
Total dislocation density was obtained using combination of electron backscatter diffraction and electron channeling contrast imaging.
Threshold driving force for low angle grain boundary migration was evaluated.</abstract><cop>Hoboken, USA</cop><pub>John Wiley & Sons, Inc</pub><pmid>30689247</pmid><doi>10.1002/jemt.23226</doi><tpages>7</tpages><orcidid>https://orcid.org/0000-0002-7462-3142</orcidid><orcidid>https://orcid.org/0000-0003-0475-8399</orcidid></addata></record> |
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| subjects | Boundaries Channeling Deformation Diamond polishing Diamonds Diffraction Dislocation Dislocation density Electron backscatter diffraction electron backscatter diffraction (EBSD) electron channeling contrast imaging (ECCI) Energy Grain boundaries Grain boundary migration Heat treatment Imaging Industrial applications Internal energy Kinetics low angle boundary migration Mechanical polishing Misalignment Nickel Plastic deformation Recrystallization Scanning electron microscopy scanning electron microscopy (SEM) Silica Silicon dioxide Slurries stored energy |
| title | Low angle boundary migration of shot‐peened pure nickel investigated by electron channeling contrast imaging and electron backscatter diffraction |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T02%3A57%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Low%20angle%20boundary%20migration%20of%20shot%E2%80%90peened%20pure%20nickel%20investigated%20by%20electron%20channeling%20contrast%20imaging%20and%20electron%20backscatter%20diffraction&rft.jtitle=Microscopy%20research%20and%20technique&rft.au=Oh,%20Jin%E2%80%90Su&rft.date=2019-06&rft.volume=82&rft.issue=6&rft.spage=849&rft.epage=855&rft.pages=849-855&rft.issn=1059-910X&rft.eissn=1097-0029&rft_id=info:doi/10.1002/jemt.23226&rft_dat=%3Cproquest_cross%3E2224367799%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2224367799&rft_id=info:pmid/30689247&rfr_iscdi=true |