Electromigration and crevice formation in thin metallic films
The problems of electromigration and crevice, or crack, formation in thin metallic films are reviewed. Various measurement techniques of electromigration in thin films are descrived. The effect of several variables on electromigration are discussed. It is shown that alternating currents can also cau...
Gespeichert in:
| Veröffentlicht in: | Thin solid films 1972-11, Vol.13 (1), p.117-129 |
|---|---|
| 1. Verfasser: | |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!