Metal‐Halide Perovskites for Gate Dielectrics in Field‐Effect Transistors and Photodetectors Enabled by PMMA Lift‐Off Process

Metal‐halide perovskites have emerged as promising materials for optoelectronics applications, such as photovoltaics, light‐emitting diodes, and photodetectors due to their excellent photoconversion efficiencies. However, their instability in aqueous solutions and most organic solvents has complicat...

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Veröffentlicht in:Advanced materials (Weinheim) 2018-06, Vol.30 (23), p.e1707412-n/a
Hauptverfasser: Daus, Alwin, Roldán‐Carmona, Cristina, Domanski, Konrad, Knobelspies, Stefan, Cantarella, Giuseppe, Vogt, Christian, Grätzel, Michael, Nazeeruddin, Mohammad Khaja, Tröster, Gerhard
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container_issue 23
container_start_page e1707412
container_title Advanced materials (Weinheim)
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creator Daus, Alwin
Roldán‐Carmona, Cristina
Domanski, Konrad
Knobelspies, Stefan
Cantarella, Giuseppe
Vogt, Christian
Grätzel, Michael
Nazeeruddin, Mohammad Khaja
Tröster, Gerhard
description Metal‐halide perovskites have emerged as promising materials for optoelectronics applications, such as photovoltaics, light‐emitting diodes, and photodetectors due to their excellent photoconversion efficiencies. However, their instability in aqueous solutions and most organic solvents has complicated their micropatterning procedures, which are needed for dense device integration, for example, in displays or cameras. In this work, a lift‐off process based on poly(methyl methacrylate) and deep ultraviolet lithography on flexible plastic foils is presented. This technique comprises simultaneous patterning of the metal‐halide perovskite with a top electrode, which results in microscale vertical device architectures with high spatial resolution and alignment properties. Hence, thin‐film transistors (TFTs) with methyl‐ammonium lead iodide (MAPbI3) gate dielectrics are demonstrated for the first time. The giant dielectric constant of MAPbI3 (>1000) leads to excellent low‐voltage TFT switching capabilities with subthreshold swings ≈80 mV decade−1 over ≈5 orders of drain current magnitude. Furthermore, vertically stacked low‐power Au‐MAPbI3‐Au photodetectors with close‐to‐ideal linear response (R2 = 0.9997) are created. The mechanical stability down to a tensile radius of 6 mm is demonstrated for the TFTs and photodetectors, simultaneously realized on the same flexible plastic substrate. These results open the way for flexible low‐power integrated (opto‐)electronic systems based on metal‐halide perovskites. A lift‐off process for metal‐halide perovskites based on poly(methyl methacrylate) and deep UV lithography on flexible plastic foils is presented. With this technique, thin‐film transistors with methyl‐ammonium lead iodide (MAPbI3) gate dielectrics showing excellent low‐voltage switching capabilities are demonstrated for the first time. Furthermore, vertically stacked low‐power Au‐MAPbI3‐Au photodetectors with close‐to‐ideal linear response are simultaneously realized.
doi_str_mv 10.1002/adma.201707412
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subjects Dielectrics
Electronic systems
Foils (structural shapes)
gate dielectrics
Materials science
metal‐halide perovskites
Micropatterning
micropatterning techniques
Optoelectronics
Organic light emitting diodes
Perovskites
photodetectors
Photometers
Photovoltaic cells
Polymethyl methacrylate
Semiconductor devices
Solar cells
Spatial resolution
Stability
Substrates
thin‐film transistors
Transistors
title Metal‐Halide Perovskites for Gate Dielectrics in Field‐Effect Transistors and Photodetectors Enabled by PMMA Lift‐Off Process
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