Formation of Micrometer Scale Metal Structures on Glass by Selective Electroless Plating on Photopatterned Titanium and Copper Containing Films

A procedure for formation of catalytic SiO2 substrate adhesive layer patterns and selective electrochemical metal deposition on the catalyst images was investigated. A photoreactive solution containing a diazonaphthoquinone sulfonate ester and Ti and Cu complexes was developed to deposit Cu catalyst...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	Langmuir 2017-12, Vol.33 (51), p.14571-14579
Hauptverfasser:	Cordonier, Christopher E. J, Okabe, Kyohei, Horiuchi, Yoshio, Nakamura, Akimasa, Ishikawa, Kaoru, Seino, Shozo, Takagi, Shinsuke, Honma, Hideo
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!