Analysis on temperature dependent current mechanism of tunnel field-effect transistors

In this paper, the total drain current (ID) of a tunnel FET (TFET) is decomposed into each current component with different origins to analyze the ID formation mechanisms of the TFET as a function of gate voltage (VGS). Transfer characteristics are firstly extracted with fabricated Silicon channel T...

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Veröffentlicht in:Japanese Journal of Applied Physics 2016-06, Vol.55 (6S1), p.6-06GG03
Hauptverfasser: Lee, Junil, Kwon, Dae Woong, Kim, Hyun Woo, Kim, Jang Hyun, Park, Euyhwan, Park, Taehyung, Kim, Sihyun, Lee, Ryoongbin, Lee, Jong-Ho, Park, Byung-Gook
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container_end_page 06GG03
container_issue 6S1
container_start_page 6
container_title Japanese Journal of Applied Physics
container_volume 55
creator Lee, Junil
Kwon, Dae Woong
Kim, Hyun Woo
Kim, Jang Hyun
Park, Euyhwan
Park, Taehyung
Kim, Sihyun
Lee, Ryoongbin
Lee, Jong-Ho
Park, Byung-Gook
description In this paper, the total drain current (ID) of a tunnel FET (TFET) is decomposed into each current component with different origins to analyze the ID formation mechanisms of the TFET as a function of gate voltage (VGS). Transfer characteristics are firstly extracted with fabricated Silicon channel TFETs (Si TFETs) and silicon germanium channel TFETs (SiGe TFETs) at various temperatures. The subthreshold swings (SS) of both Si TFETs and SiGe TFETs get degraded and the SSs of SiGe TFETs get degraded more as temperature becomes higher. Then, all the IDs measured at various temperatures are decomposed into each current component through technology computer aided design (TCAD) simulations with a good agreement with experimental data. As a result, it is revealed that Shockley-Read-Hall (SRH) recombination mainly contribute to the ID of a TFET before band to band tunneling (BTBT) occurs. Furthermore, the SS degradation by high temperature is explained successfully by the SRH recombination with electric field dependence.
doi_str_mv 10.7567/JJAP.55.06GG03
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J. Appl. Phys</addtitle><date>2016-06-01</date><risdate>2016</risdate><volume>55</volume><issue>6S1</issue><spage>6</spage><epage>06GG03</epage><pages>6-06GG03</pages><issn>0021-4922</issn><eissn>1347-4065</eissn><coden>JJAPB6</coden><abstract>In this paper, the total drain current (ID) of a tunnel FET (TFET) is decomposed into each current component with different origins to analyze the ID formation mechanisms of the TFET as a function of gate voltage (VGS). Transfer characteristics are firstly extracted with fabricated Silicon channel TFETs (Si TFETs) and silicon germanium channel TFETs (SiGe TFETs) at various temperatures. The subthreshold swings (SS) of both Si TFETs and SiGe TFETs get degraded and the SSs of SiGe TFETs get degraded more as temperature becomes higher. Then, all the IDs measured at various temperatures are decomposed into each current component through technology computer aided design (TCAD) simulations with a good agreement with experimental data. As a result, it is revealed that Shockley-Read-Hall (SRH) recombination mainly contribute to the ID of a TFET before band to band tunneling (BTBT) occurs. Furthermore, the SS degradation by high temperature is explained successfully by the SRH recombination with electric field dependence.</abstract><pub>The Japan Society of Applied Physics</pub><doi>10.7567/JJAP.55.06GG03</doi><tpages>4</tpages></addata></record>
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source IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link
subjects Channels
Decomposition
Degradation
Field effect transistors
Semiconductor devices
Silicon
Silicon germanides
Tunnels (transportation)
title Analysis on temperature dependent current mechanism of tunnel field-effect transistors
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