Fracture toughness of ultrashort pulse-bonded fused silica

We determined the bond interface strength of ultrashort pulse laser-welded fused silica for different processing parameters. To this end, we used a high repetition rate ultrashort pulse laser system to inscribe parallel welding lines with a specific V-shaped design into optically contacted fused sil...

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Veröffentlicht in:	Applied physics. A, Materials science & processing Materials science & processing, 2016-02, Vol.122 (2), p.1-6, Article 131
Hauptverfasser:	Richter, S., Naumann, F., Zimmermann, F., Tünnermann, A., Nolte, S.
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonding strength Characterization and Evaluation of Materials Condensed Matter Physics Design engineering Emerging trends in photo-excitations and promising new laser ablation technologies Fracture toughness Fused silica Invited Paper Laser beam welding Machines Manufacturing Nanotechnology Optical and Electronic Materials Physics Physics and Astronomy Process parameters Processes Repetition Surfaces and Interfaces Thin Films Welding
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