Change aspects of microstructure and mechanical behavior of Bi and Zn-doped Sn–0.5Cu solders for microelectronic applications

Sn–Cu alloys were recommended as a promising substitute for traditional Sn–Pb alloy in wave soldering applications. In the present study, the change of microstructure, thermal and mechanical behavior associated with alloying of Bi and Zn into Sn–0.5Cu solder have been investigated. DSC analysis reve...

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Veröffentlicht in:	Journal of materials science. Materials in electronics 2017, Vol.28 (1), p.1060-1069
Hauptverfasser:	Ibrahiem, A. A., El-Khawas, E. H., El-Daly, A. A.
Format:	Artikel
Sprache:	eng
Schlagworte:	Characterization and Evaluation of Materials Chemistry and Materials Science Electronics Materials Science Mechanical properties Microstructure Optical and Electronic Materials Precipitation hardening Solders Supercooling Tin base alloys Undercooling
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